Circuits Assembly Online Magazine

NEWS

Kimball Reports Fiscal Q2 Net Sales Up 8%

JASPER, IN – Kimball Electronics reported fiscal second quarter net sales of $307.1 million, an increase of 8% year-over-year. Read More...

ASE Reports Q4 Net Revenues Up 2%

TAIPEI – ASE Technology Holding reported fourth quarter net revenues of NT$116 billion (US$3.9 billion), up 2% year-over-year and down 1% se... Read More...

Amtech Reports Fiscal Q1 Net Revenue Down 11%

TEMPE, AZ – Amtech Systems, parent company of BTU, reported fiscal first quarter net revenue fell 10.8% year-over-year to $20.7 million. Net... Read More...

iNEMI to Hold Packaging Technology Qualification Methodology Webinar

MORRISVILLE, NC – iNEMI will hold a webinar Feb. 19 on the new packaging technology qualification methodology project. Read More...

Foxconn Delays Return to Shenzhen Facility

SHENZHEN – Foxconn told employees here not to return to work on Feb. 10, the end of the extended Lunar New Year holiday. Read More...

Benchmark Reports Q4 Sales Down 23%

TEMPE, AZ – Benchmark Electronics reported fourth quarter sales of $508 million, down 22.7% year-over-year and 8.5% sequentially. The firm a... Read More...

Foxconn Cuts 2020 Outlook after Quarantine

TAIPEI – Foxconn cut its 2020 revenue outlook as a result of a decision to impose a quarantine at its main iPhone-making site, according to ... Read More...

IPC Hall of Fame Award Presented to Pudles

SAN DIEGO — In recognition of his contributions to IPC and the electronics industry, Steve Pudles, president and CEO, Zentech Manufacturing,... Read More...

Mycronic Posts Q4 Net Sales Up 12%

TABY, SWEDEN – Mycronic’s fourth quarter net sales rose 12% year-over-year to SEK 1.18 billion (US$122.6 million) and 9% based on constant e... Read More...

FEATURES

Designing a Robust Industrial Augmented Reality Solution

A review of tracking methodology choices to address challenges of environmental factors such as light and the prerequisite of fixed visual features. Read More...

Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure, Reliability and Failure Mechanism

How do LTS solders perform under thermal cycling and drop-shock testing? Read More...

An Automated Tin Whisker Risk Assessment Process Resulting in Significant Cost Savings

How a modified design tool automated and standardized TWRA measurement. Read More...

Why ‘Born on Dating’ is Not a Reliable Means for PCB Shelf Life

Flex circuit solderability and life expectancy are influenced by handling and finishes. What is the shelf life of a flex circuit if it stays in its original ... Read More...