Technology takes time. Moore’s Law tells us that. But just how much time it takes for a technology to emerge that is smaller, faster, and better than its predecessor can be dependent on variables that Moore himself could not predict. In the semiconductor industry specifically, standards adoption, followed by second-sourcing, are seen to be two momentous forces that push new technology forward—pushing it to the point where it can dramatically shape its world and the products built around it. But it doesn’t always happen in that order. And who would have thought that energy efficiency in these tiny chips that draw only milliwatts of power would be as significant as we have shown?
In April 2007, Micron introduced its Aspen Memory® family of energy-efficient products, featuring the industry’s first low-voltage (LV) DDR2 DRAM in reduced chip count (RCC) memory modules, lowering DDR2 voltage to an industry-leading 1.5 volts.
Recently, there was a second-source announcement for 1.5V DDR2 and 1.5V FBDIMMs. I’m not able to name the company here, but it’s not just a DIMM manufacturer using Micron DRAM, but a company that turns bare silicon wafers into DRAM chips. There are now two companies using a sub-80nm process to get to 1.5V. And all this before energy-efficient standardization has found top billing on JEDEC’s agenda.
We are not trying to be critical of JEDEC. After all, standards are necessary to ensure interoperability. The standard for 1.5V will not define how much power the device can consume, but rather that all 1.5V devices work together. Before a standard makes it on the agenda, there has to be a need—and the market needs to define that need (lower power consumption). Data center operators ask server manufacturers for more efficient systems, and from there, the requirement works its way upstream to the memory industry.
So, we have the typical "what came first" paradox. Instead of trying to predict how this will play out, let’s consider some of the common memory products that were widely adopted before they were standardized by committee:
- PC100: PC100 was unilaterally defined by Intel® in 1998. It was close to the then-defined committee standard, but Intel said it was leaving too much performance on the table, so they tightened it up and squeezed out the technology laggards who weren’t able to make the product. Those who couldn’t yield to PC100 were stuck making PC66 a little bit longer than they expected.
- DDR-400 (a.k.a. PC3200): Became an industry standard outside of committee. In fact, the standards group originally thought that 400-speed memory was supposed to be only DDR2. Sure, there was PC2-3200, but it pretty quickly moved up to 533 and 667. In fact, PC3200 needed to run at a boosted voltage to get up to speed. PC2700 runs at 2.5V while PC3200 needs 2.6V.
- DDR2-1067: This time JEDEC came up with two versions of 800 MHz memory-DDR2-800 and DDR3-800-probably hoping this overlap would stop the technology leaders from offering a disruptive solution. But, it’s hard to hold back innovation, so now Micron is shipping DDR2-1067.
- 1.5V DDR2: Of course I had to add this to the list. It may be a little premature for now, but someday soon this, too, will be shipping FBDIMMs and components in volume.
Two companies at 1.5V … I guess I could wrap this up with a this-is-just-the-tip-of-the-iceberg analogy, but if you’ve been around the industry for a while, you know it already. Second sources for innovations make the world go ’round—and the committees will simply add to the momentum.
Michael Sporer, Regional Sales Manager, Micron Technology, Inc.