Fabtech - News

SIA makes major revisions to global IC sales forecast

Thu, 05 Nov 2009 12:42:24 GMT

A new forecast for global semiconductor sales over the next three years has been released by the Semiconductor Industry Association, which is significantly more optimistic about the sales growth expected in the next few years. Importantly, the SIA has raised its forecast for 2009, projecting global sales to reach US$219.7 billion, a decline from 2008 of 11.6%. The previous guidance given in June, 2009 noted an expected sales decline of 21.3%, with sales reaching US$195.6 billion for 2009.

Tool Order: Foundry places multi-system metrology order for 22nm gate etch OCD with Nanometrics

Tue, 03 Nov 2009 12:09:35 GMT

A leading semiconductor foundry has placed a multi-system order with Nanometrics for its Integrated Metrology (IM) and ‘NanoCD’ suite of optical critical dimension (OCD) metrology solutions. The systems will be delivered in the fourth quarter of 2009.

Semiconductor industry set for explosive growth, says Future Horizons

Tue, 03 Nov 2009 11:22:21 GMT

Malcolm Penn, head of market research firm, Future Horizons wants to get back to running a division of a semiconductor company on the basis that the industry is set for explosive growth over the coming couple of years, yet no-one believes it! Penn believes that the industry will grow by 22% in 2010, compared to a negative 10% figure for 2009, which is a new revised figure (-14% previously). Growth could be even higher in 2011 as the global economy recovers and tight fab capacity through 2010 pushes ASP’s ever higher.

Tool Order: Chartered selects double-patterning solutions from Brion

Mon, 02 Nov 2009 11:51:55 GMT

Chartered Semiconductor has adopted Brion Technologies computational lithography products for 45nm and below technology nodes, including Brion’s double-patterning solutions. Chartered will use ‘Tachyon’ OPC+ (optical proximity correction), Tachyon LMC (lithography manufacturability check), and Tachyon resolution enhancement products, which enable the foundry to select the optimum combination of techniques for each design and every layer, which help to minimize lithography costs.

September semiconductor sales up 8.2% from August: tracking higher than SIA forecast

Mon, 02 Nov 2009 11:33:58 GMT

The recovery in semiconductor sales continued to build momentum in September, according to the latest data from the Semiconductor Industry Association (SIA). September IC sales reached US$20.1 billion, an increase of 8.2% from the previous month, which was US$19.1 billion.

Business building at VSEA: more implanter market share gains expected

Fri, 30 Oct 2009 14:50:04 GMT

Historically, the mainstream semiconductor equipment suppliers see a significant upturn in business after a downturn, approximately a year behind the IC manufacturers. However the signs are clearly showing that some of the suppliers are returning to profitability on the back of stronger order intake in the third quarter of 2009 and guiding stronger shipments through the next few quarters, sparking what seems to be an end to the current downturn for them.

Microsemi to shutter old 3inch fab in Scottsdale, Arizona

Fri, 30 Oct 2009 13:05:19 GMT

An old 2-3inch analog fab, owned by Microsemi Corporation is set for closure by April 2011. Microsemi expects that after the consolidation activities are completed in 18 months, annual savings benefiting operating income will range from US$20 million to US$25 million.

Spectra Gases get rebranding to Linde

Fri, 30 Oct 2009 12:32:40 GMT

Spectra Gases, which was acquired Linde Group back in 2006, is to now be rebranded as Linde, which will include Spectra Gases’ locations in the U.S. and on its hundreds of trucks, skids and tanks. Thousands of gas cylinders and equipment will also be converted. That process however should continue over several years, Linde said. However, some name-plate specialty gases products, such as Spectra Laser Gases, will retain the Spectra brand, but will become part of the ‘Linde HiQ’ family of specialty gases.

Tool Order: Logic manufacturer purchases an ALD tool from ASM International

Thu, 29 Oct 2009 13:43:20 GMT

A leading logic manufacturer and a member of a key semiconductor industry technology alliance, has purchased a ‘Pulsar’ high-k atomic layer deposition (ALD) tool from ASM International. The system, which was delivered earlier in October, will be used to deposit hafnium-based higk-k gate dielectrics for 32 and 28nm logic devices.

TSMC raises CapEx to US$2.7 billion on strong demand for advanced nodes

Thu, 29 Oct 2009 13:26:18 GMT

TSMC is raising its capital equipment spend due to strong demand for advanced process nodes. Spending is being raised in 2009 to US$2.7 billion as demand for both 65nm and 40nm process nodes increases beyond previous expectations. Revenue for its 65nm offerings made up 31% of revenue in the quarter, up from 28% in the second quarter. 45/40nm technology increased to 4% of total revenue, up sharply from a recorded 1% in the previous quarter. The foundry reported third quarter revenue of NT$89.94 billion, a 21.2% increase in revenue compared to the previous quarter.

Fab restructuring at Fujitsu generates operating loss

Wed, 28 Oct 2009 14:05:15 GMT

The restructuring of Fujitsu Microelectronics, which first started in March 2008, has resulted in a 20 billion yen loss that will be recorded by Fujitsu in its full-year fiscal 2009 results, ending in March, 2010. The semiconductor downturn in the second-half of 2008 was cited as a contributing factor in the losses.

TSMC establishes units to improve manufacturing efficiencies

Wed, 28 Oct 2009 13:55:24 GMT

Leading foundry, TSMC has created two new business units in an effort to improve its manufacturing efficiency and customer partnerships. The new units are an Operations Organization and a Business Development Organization. Dr. Mark Liu has been appointed Senior Vice President of Operations, responsible for all its 300mm fabs while Dr. C.C. Wei has been appointed Senior Vice President of Business Development. Both will report directly to the Chairman, Morris Chang.

Renesas to exit back-end IC equipment business

Wed, 28 Oct 2009 11:57:37 GMT

Renesas Technology is to transfer its back-end IC packaging equipment manufacturing arm to Hitachi High-Technologies. Renesas Eastern Japan Semiconductor had revenue of 6.0 billion yen in fiscal 2008 and employed 2,380 with 115affected by transfer. Hitachi High-Tech had been responsible for sales for the Renesas division. The transfer is expected to be completed in the spring of 2010.

UMC to increase CapEx in 2010 as capacity expansions underway at its 300mm fabs

Wed, 28 Oct 2009 10:51:17 GMT

Leading-edge process demand at UMC has sparked the pure-play foundry to expand capacity at its two 300mm fabs, sparking the need to raise capital expenditure in 2010. Although UMC did not say what its CapEx would be next year, CapEx over the last several years has been at very low levels and is not expected to pass its previously stated plans of US$500 million for 2009. In recent times, UMC reached a peak of spending in 2004 at US$1.5 billion.

Semiconductor industry to show growth in the fourth quarter, says iSuppli

Tue, 27 Oct 2009 18:44:30 GMT

Although global semiconductor revenue is set to contract by 16.5% in 2009, iSuppli Corp has now projected that the fourth quarter will mark the first quarter in 2009 that revenue has risen compared to the same period a year earlier. Revenue is expected to rise by 10.6% in the fourth quarter, marking a recovery in the industry that is set to continue for several years.

Ultra Clean Q3 results: up from Q2, down same quarter ‘08

Tue, 27 Oct 2009 11:29:43 GMT

Ultra Clean Holdings reports its financial results for the third quarter of 2009 with revenue and gross margin increases in comparison to the second quarter results from this year. Revenue for the quarter was US$41.3 million, up 78% while the gross margin was 7.9%, compared to 3.7% for the second quarter of 2009.

Pfeiffer Vacuum completes €20 million facility improvements

Thu, 22 Oct 2009 14:06:17 GMT

At a cost of €20 million, Pfeiffer Vacuum now has new state-of-the-art vacuum pump manufacturing and logistics facilities that are designed to optimise production and customer support operations. Now located in 30,000 m² of covered area in Asslar, Germany are two cutting-edge production lines and a new Logistics Center situated in the middle. The Logistics Center, employs 6,000 bin spaces and a high-bay warehouse with 1,200 pallet spaces. The aim is to deliver every order in the form of a single package in the future.

U.S. semiconductor equipment bookings continue to rise

Wed, 21 Oct 2009 13:50:48 GMT

Even after better than projected final book-to-bill figures for the month of August, SEMI has reported the September book-to-bill ratio of 1.17 and bookings of US$732.8 million, up from the final August figure of US$614.5 million. SEMI has now reported three consecutive months where the book-to-bill ratio has surpassed figures for the last three-years, though sales are coming off significant lows seen at the beginning of the year.

Eyelit implements replacement MES system at M/A-COM

Mon, 19 Oct 2009 17:07:22 GMT

Fab MES software and integration firm, Eyelit has completed a legacy Manufacturing Execution Software (MES) replacement at two fabs in 8-weeks for M/A-COM Technology. The move to Eyelit MES enables M/A-COM Tech to standardize to one manufacturing software provider, providing a platform to easily add equipment automation and integrate Quality Management tasks, such as OCAP, QAR, and MRB, Eyelit said.

SOI process from Leti capable of 22nm low power devices

Mon, 19 Oct 2009 16:56:12 GMT

At the SOI Industry Consortium workshop being held in Leuven, Belgium, French R&D organization, Leti said that its planer-SOI CMOS technology met all the key requirements for implementation at the 22nm node for low-power IC devices. Drain-induced barrier lowering (DIBL) below 100mV/V has been demonstrated and SOI has been proven to enable the reduction of electrostatic parasitics and that variability on threshold voltage had been reduced by a factor of two compared with FinFET technologies, at wafer and batch levels.