Fabtech - Product Briefings

SPIE 2012: Tachyon FMO provides effective hotspot repair for advanced mask correction

Mon, 13 Feb 2012 14:31:45 GMT

Product Outline: Brion Technologies, a division of ASML, has launched the Tachyon Flexible Mask Optimization (Tachyon FMO), part of ASML’s Holistic Lithography portfolio. Tachyon FMO is claimed to enable the seamless use of multiple Optical Proximity Correction (OPC) techniques in a single mask tapeout, permitting the use of advanced and computationally intensive OPC in key local areas where they provide maximum benefit.

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy

Mon, 19 Sep 2011 16:41:20 GMT

Product Briefing Outline: Applied Materials has introduced its new ‘Applied Centura Tetra’ EUV Advanced Reticle Etch system. The new systems is claimed to overcome a major hurdle to the adoption of EUV lithography by solving the critical and unmet challenge of etching EUVL photomasks with nanometer-level accuracy and world-class defect performance to enable the fabrication of multiple new generations of high-performance semiconductor chips at the 16nm node and below.

New Product: ASML Brion’s Tachyon MB-SRAF enables OPC-like compute times

Mon, 19 Sep 2011 13:46:04 GMT

Product Briefing Outline: Brion Technologies, a division of ASML, has launched a new product for its Tachyon computational lithography platform. Tachyon MB-SRAF (Model-Based Sub-Resolution Assist Features) is said to enable the high-speed, full-chip processing of advanced chip designs with larger process windows, greater productivity, and lower development costs than rule-based alternatives.

EV Group unveils wafer bonding system for 450mm SOI wafers

Wed, 13 Jul 2011 18:00:25 GMT

Product Briefing Outline: EV Group has introduced the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. The EVG850SOI/450mm was created to support and facilitate the industry transition to 450mm wafers from the current 300mm standard.

Surfscan SP3 from KLA-Tencor employs DUV illumination for higher defect sensitivity

Wed, 13 Jul 2011 17:40:48 GMT

Product Briefing Outline: KLA-Tencor has introduced a new generation to the ‘Surfscan’ family of wafer defect and surface quality inspection systems. The Surfscan SP3 is claimed to be the first unpatterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination, enabling a dramatic improvement in sensitivity and throughput over KLA-Tencor’s previous offering, the Surfscan SP2XP. The Surfscan SP3 platform is also designed for extension to 450mm wafers.

Novellus’ conformal film deposition suite offers 100% step coverage

Tue, 12 Jul 2011 18:36:03 GMT

Product Briefing Outline: Novellus Systems has launched the ‘VECTOR CFD’ family of films for the company’s VECTOR Express, VECTOR Extreme and VECTOR Excel plasma-enhanced chemical vapor deposition (PECVD) systems. The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films are deposited at temperatures ranging from 50 degrees to 450 degrees Celsius. These films provide solutions for emerging sub-2X nm logic and memory applications, including front-end-of-line (FEOL) liners and spacers used in tri-gate transistors and FinFETs, bitline spacers, and through silicon via (TSV) dielectric liners, amongst other applications.

ASML enhances NXT:1950i immersion lithography platform

Tue, 12 Jul 2011 11:23:45 GMT

Product Briefing Outline: ASML has introduced three new extensions for TWINSCAN NXT platform that improve imaging, overlay and productivity. The extensions enable chipmakers to manufacture smaller, faster chips more cost-effectively. The first NXT:1950i system shipped in 2009 and today more than 80 systems are in use by chipmakers around the world manufacturing current state-of-the-art devices at resolutions of 45- to 32-nm.

Canon’s FPA-5510iV lithography tool designed for 3D packaging requirements

Mon, 11 Jul 2011 08:56:12 GMT

Product Briefing Outline: Canon has entered the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV for next-generation semiconductor packaging, which is specially designed for ‘Through Silicon Via’ (TSV) and ‘bump’ processes.

Rudolph releases faster ‘Genesis Enterprise’ yield management software

Fri, 08 Jul 2011 15:50:42 GMT

Product Briefing Outline: Rudolph Technologies has released ‘Genesis Enterprise’ version 7.0. Genesis is an offline yield analysis and data mining software with parametric yield management tools designed to maximize factory efficiency and identify causes of yield loss. Since Rudolph’s acquisition of the Yield Dynamics software business from MKS Instruments a year ago, Rudolph have made significant performance improvements to the product.

Applied Materials launches three new products for improving DRAM transistor performance

Wed, 06 Jul 2011 16:55:37 GMT

Product Briefing Outline: Applied Materials has launched a trio of new systems designed to boost performance in the next generations of DRAM chips. These systems are claimed to overcome key challenges in fabricating the transistor and contact areas of memory chips, include: the ‘Applied Centura DPN HD’ system to improve the gate insulator scaling; the ‘Applied Endura HAR Cobalt PVD’ system for high aspect ratio contact structures; and the ‘Applied Endura Versa XLR W PVD’ system for reduced gate stack resistance.

New Product: Applied Materials Applied ‘Vantage Vulcan’ RTP system overcomes wafer ‘hot spots�

Wed, 29 Jun 2011 13:46:31 GMT

Product Briefing Outline: Applied Materials has introduced the Applied ‘Vantage Vulcan’ rapid thermal processing (RTP) system. The system is claimed to supersede current RTP technology to bring a new level of precision and control to the anneal process, enabling chipmakers to reduce variability and boost production yields of their most highly-valued, highest-performing devices.

New Product: EV Group’s in-line metrology module option offers control for thin-wafer processing

Fri, 24 Jun 2011 14:24:04 GMT

Product Briefing Outline: EV Group has introduced a new in-line metrology module for its EVG850TB automated temporary bonding and debonding systems. This new metrology capability, which is now available as an option on the EVG850TB and EVG850DB platforms, allows customers to implement in-line process control for thin-wafer processing.

Applied Materials ‘ Reflexion GTTM’ CMP system tackles tungsten films at lowest cost

Thu, 16 Jun 2011 17:09:34 GMT

Product Briefing Outline: Applied Materials has launched the ‘Applied Reflexion GTTM’ CMP system to cater for the planarization of tungsten films. This CMP process is critical to fabricating the transistor contacts and vias in advanced DRAM, NAND and logic devices. With the Reflexion GT system's proven dual-wafer architecture, it is claimed to have the highest throughput and more than 40% lower cost-per-wafer than competing systems. The system offers closed-loop film thickness and uniformity control - a vital capability to achieve high yields of today's advanced transistor structures.

‘SpectraShape’ metrology tool from KLA-Tencor and TEL enables characterization of complex struct

Wed, 30 Mar 2011 21:03:16 GMT

Product Briefing Outline: KLA-Tencor has introduced the ‘SpectraShape' 8660 and 8810 dimensional metrology systems that feature ‘AcuShape 2’ modeling software developed jointly with Tokyo Electron. The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on ICs and monitor these shapes at production speeds. The system employs a user interface that allows fab engineers to build models on their own, keeping the details of their proprietary IC structures in-house.

New Product: Nikon’s S620D offers 2nm overlay for 22nm production with Streamlign platform

Thu, 03 Mar 2011 07:06:06 GMT

Product Briefing Outline: Nikon’s new S620D incorporates a multi-axial catadioptric lens with a 1.35 NA that will satisfy the imaging requirements to enable DP for 32nm and future technology generations. This lens design delivers extremely low aberrations and minimized local flare. In addition, the S620D design enables active aberration control, and enhances CD uniformity with dose and focus feedback and tuning capabilities that further increase yield. The S620D has already satisfied the aggressive CDU requirements for lines and spaces at 32nm, and demonstrated 22nm patterning capabilities, confirming extendibility to next generation applications.

New Product: Synopsys Proteus LRC offers 28nm and below lithography verification

Wed, 02 Mar 2011 16:31:44 GMT

Product Briefing Outline: Synopsys has introduced Proteus LRC for lithography verification at the 2011, SPIE Advanced Lithography conference. Proteus LRC provides comprehensive, process-window-aware checking features to identify locations in a design that are sensitive to process variations, thereby enabling corrective action to be taken prior to committing a design to manufacture. Proteus LRC is integrated into the Proteus Mask Synthesis flow and is targeted for use by OPC and mask data preparation groups at semiconductor manufacturers.

New Product: Cymer focus drilling technology improves DOF for immersion lithography tools

Wed, 02 Mar 2011 15:30:07 GMT

Product Briefing Outline: At the 2011, SPIE Advanced Lithography Conference, Cymer has announced the development of new focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. According to Cymer, focus drilling provides up to a 2X improvement in the depth of focus on the wafer, thereby enabling a larger process window that can positively impact chipmakers' yield.

New Product: Peter Wolters new wafer lapping tool offers higher productivity

Mon, 28 Feb 2011 20:34:55 GMT

Product Briefing Outline: Novellus Systems subsidiary, Peter Wolters has developed a new version of its microLine double side lapping system for prime silicon wafers. The new AC-2100L system features independently driven inner and outer pin rings, automatic force calibration, and in-situ wafer thickness metrology for closed-loop process control. The system can process up to twenty 300mm wafers in one batch, while exceeding the latest wafer geometry requirements.

New Product: USHIO’s ‘CHIPs’ ashing system designed for nano-imprint lithography

Mon, 28 Feb 2011 05:56:33 GMT

Product Briefing Outline: USHIO is to exhibit and participate in the SPIE Advanced Lithography 2011, highlighting a new nano-imprint VUV (Vacuum Ultra Violet) ashing system ‘CHIPs’ (Compact HiPower System), which is designed to be incorporated into nano-imprint lithography (NIL) equipment.

New Product: Brion’s Tachyon NXE offers predictive modeling for EUV lithography

Tue, 14 Sep 2010 13:43:34 GMT

Product Briefing Outline: Next generation semiconductor production will be facilitated by a new product introduced by Brion Technologies, a division of ASML. Brion’s new Tachyon NXE is the result of a multi-year investment by ASML and Brion to accurately model the performance of NXE scanners, which are designed to provide accurate predictive modeling specifically for ASML Extreme Ultraviolet (EUV) scanners. The accurate EUV modeling in Tachyon NXE is claimed to reduce both the development time and cost to produce chips on EUV systems.