Intel Newsroom

Intel Recommends Stockholders Reject TRC Capital's "Mini-Tender" Offer

webadmin@intel.com — Tue, 18 Jun 2013 19:00:30 GMT

SANTA CLARA, Calif., June 18, 2013 – Intel Corporation recently learned of an unsolicited "mini-tender offer" made by TRC Capital Corp. to Intel stockholders to purchase up to 4 million shares of Intel common stock at $23.75 per share. TRC Capital's offer price is approximately 4.96 percent below the closing share price of Intel common stock on June 13, 2013 ($24.99), the day before the offer commenced, and the offer is for less than 1 percent of Intel's outstanding shares.

Intel does not endorse TRC Capital's mini-tender offer and recommends that Intel stockholders reject the offer and not tender their shares in response to the offer. This mini-tender offer is at a price below the market price for Intel shares (as of the date Intel received notice of the offer) and is subject to numerous conditions. TRC Capital's offer states that it may terminate or amend the offer if, among other things, the market price of Intel's stock declines, or if TRC Capital fails to obtain financing necessary to consummate the offer. Intel is not associated in any way with TRC Capital, its mini-tender offer or the offer documentation.

Intel urges investors to obtain current market quotations for their shares, consult with their broker or financial adviser, and exercise caution with respect to TRC Capital's offer. Intel stockholders who have already tendered their shares may withdraw their shares by providing notice in the manner described in the TRC Capital documents prior to the expiration of the offer, which is currently scheduled at 12:01 a.m. Eastern time on Tuesday, July 16, 2013, unless extended.

TRC Capital has made many similar mini-tender offers for shares of other companies. Because TRC Capital's mini-tender offer is for less than 5 percent of Intel's outstanding shares, it is not subject to many of the disclosure and procedural requirements of Securities and Exchange Commission (SEC) rules that are designed to protect investors. The SEC has cautioned investors about these offers, noting that they "have been increasingly used to catch investors off guard." The SEC's tips for investors regarding mini-tender offers may be found on the SEC's Web site at http://www.sec.gov/investor/pubs/minitend.htm.

Intel encourages brokers and dealers, as well as other market participants, to review the SEC's letter regarding broker-dealer mini-tender offer dissemination and disclosures at www.sec.gov/divisions/marketreg/minitenders/sia072401.htm; and the NASD Notice to Members 99-53, issued in July 1999, regarding guidance to members forwarding mini-tender offers to their customers, which can be found at http://www.finra.org/web/groups/industry/@ip/@reg/@notice/documents/notices/p004221.pdf.

Intel requests that a copy of this press release be included with all distributions of materials relating to TRC Capital's mini-tender offer.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel + Toshiba Win Daytime Emmy Award

webadmin@intel.com — Tue, 18 Jun 2013 17:49:07 GMT

“The Beauty Inside,” the second social film from Intel® and Toshiba, has won a 2013 Emmy from the Daytime Emmy’s for Outstanding New Approach to Daytime Programming. The social film was up against PBS’s "Chuck Vanderchuck" and "Design Squad Nation" as well as algebra media project “Get the Math.” The film provided a unique level of engagement between social media and blockbuster-style film and featured the innovative Toshiba Portégé* Ultrabook™. “The Beauty Inside” brought together top talent in entertainment, technology and social media, starring actor Topher Grace, actress Mary Elizabeth Winstead, and Sundance award-winning director Drake Doremus. Stay tuned for what’s next from Intel and Toshiba.

Chip Shot: Intel Technology Powers the World's Fastest Supercomputer

webadmin@intel.com — Mon, 17 Jun 2013 18:25:07 GMT

Today, the Top500 list of the most powerful supercomputers in the world, announced at the International Supercomputing Conference (ISC'13) in Germany, revealed a new leader: the "Milky Way 2" system powered by 32,000 Intel® Xeon® processors and 48,000 Intel® Xeon Phi™ coprocessors. Intel technology also powered more than 80 percent of all listed systems, including 98 percent of the newly added supercomputers. During the conference, Raj Hazra, Intel vice president and general manager of the Technical Computing Group, also announced the new Intel Xeon Phi coprocessors and disclosed the first details of the next generation of this technology, codenamed "Knights Landing", featuring Intel's leading 14nm process technology. Get more information about Intel at ISC'13.

Intel Powers the World's Fastest Supercomputer, Reveals New and Future High Performance Computing Technologies

webadmin@intel.com — Mon, 17 Jun 2013 17:00:06 GMT

NEWS HIGHLIGHTS

The new world's fastest supercomputer is powered by Intel® Xeon Phi™ coprocessors and Intel® Xeon® processors, delivering twice the speed of the previous leader.
Intel processors power more than 80 percent of all systems on Top500 list of world's most powerful supercomputers including 98 percent of new listed systems.
Intel expands the portfolio of current generation coprocessors with new Intel® Xeon Phi™ 3100 and 7100 product families, providing a variety of cost and performance options.
Intel also disclosed the next generation of Intel® Xeon Phi™ technology, codenamed "Knights Landing," promising to extend its supercomputing leadership.

INTERNATIONAL SUPERCOMPUTING CONFERENCE (ISC'13), Leipzig, Germany, June 17, 2013 – A system built with thousands of Intel® processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers.

The system, known as "Milky Way 2," includes 48,000 Intel® Xeon Phi™ coprocessors and 32,000 Intel® Xeon® processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

The worldwide high performance computing (HPC) server segment is expected to grow its annual revenue by 36 percent¹ from $11 billion to $15 billion over the next four years. The dramatic increase and growth of supercomputers continues to be driven by the need to quickly compute, simulate and make more informed decisions across a range of industries. Supercomputers are used to increase the accuracy of weather predictions, help to explore more efficient energy resources, develop cures for diseases, sequence the human genome and analyze big data.

"Intel is helping to blaze a path toward new innovation, discovery and competitiveness with its supercomputing vision and products," said Raj Hazra, vice president and general manager of Technical Computing Group. "There is an insatiable demand for more computing power while also achieving new levels of power efficiency. With the current and future generations of Intel Xeon Phi coprocessors, Intel Xeon processors, Intel® TrueScale fabrics and software, Intel is uniquely equipped to deliver a comprehensive solution for our customers without compromise."

Since the introduction of Intel Xeon Phi six months ago, Intel Xeon processors and Intel Xeon Phi co-processors have become a powerful combination now powering many of the world's fastest supercomputers. Intel Xeon Phi coprocessors based on the Intel® Many Integrated Core (Intel MIC) architecture address the need for higher performing yet more energy efficient and user-friendly technology.

"Milky Way 2" - the World's Fastest Supercomputer
Built for the National Supercomputing Center in Guangzhou China, the "Milky Way 2" system is powered by 32,000 of the upcoming 12-core Intel Xeon processors E5-2600 v2 based on Ivy Bridge architecture, and 48,000 Intel Xeon Phi coprocessors, with a total system power of 17.8 MW. Not only is it the fastest, but also one of the most power-efficient systems on the Top500 list. The system uses "neo-heterogeneous architecture," whereby the hardware architecture has multiple classes of compute capabilities that are accessed by a common programming model, streamlining development and optimization processes – an advantage not possible when using a combination of CPUs and GPU accelerators.

The system's leading performance and energy efficiency were achieved by using the upcoming Intel Xeon processor E5-2600 v2 product family based on Intel's leading 22nm manufacturing process. In addition to powering the "Milky Way 2", these processors also power two other systems on the Top500 list from Bull*, the 54th ranked system with 557 TFlops and the 329th with 139 TFlops, as part of an "early ship" program Intel uses to equip supercomputer customers. The products will be generally available next quarter, and will feature up to 12 cores and up to 2.7GHz clock speeds, delivering 259 GFlops per socket, a 56 percent increase over the previous generation.

More than 80 percent (403 systems) of the supercomputers on the 41st edition of the Top500 list are powered by Intel processors. Of those systems making their first appearance on the list, Intel-powered installations account for 98 percent. The June edition of the list had recorded 11 systems based on the Intel Xeon Phi coprocessor, including the Petaflops class systems like "Milky Way 2" at 54.9 PFlops and "Stampede" at 8.5 PFlops of peak performance.

The semi-annual TOP500 list of supercomputers is the work of Hans Meuer of the University of Mannheim, Erich Strohmaier and Horst Simon of the U.S. Department of Energy's National Energy Research Scientific Computing Center, and Jack Dongarra of the University of Tennessee. The complete report is available athttp://www.top500.org/

New Intel® Xeon Phi™ Coprocessor 3000 and 7000 Product Families

Intel also announced the expansion of its current generation Intel Xeon Phi coprocessors with the addition of five new products that feature various performance options, memory capacity, power efficiency and form factors that are available today. The Intel Xeon Phi coprocessor 7100 family is designed and optimized to provide the best performance and offer the highest level of features, including 61 cores clocked at 1.23GHz, 16 GB of memory capacity support (double the amount previously available in accelerators or coprocessors) and over 1.2 TFlops of double precision performance. The Intel Xeon Phi coprocessor 3100 family is designed for high performance per dollar value. The family features 57 cores clocked at 1.1 GHz and 1TFlops of double precision performance.

Lastly, Intel added another product to the Intel Xeon Phi coprocessor 5100 family announced last year. Named the Intel Xeon Phi coprocessor 5120D, it is optimized for high-density environments with the ability to allow sockets to attach directly to a mini-board for use in blade form factors.

"Knights Landing" – A Choice of Coprocessor or CPU
Intel revealed details of its second generation Intel Xeon Phi products aimed to further increase their supercomputing capabilities. Codenamed "Knights Landing," the next generation of Intel MIC Architecture-based products will be available as a coprocessor or a host processor (CPU) and manufactured using Intel's 14nm process technology featuring second generation 3-D tri-gate transistors.

As a PCIe card-based coprocessor, "Knights Landing" will handle offload workloads from the system's Intel Xeon processors and provide an upgrade path for users of current generation of coprocessors, much like it does today. However, as a host processor directly installed in the motherboard socket, it will function as a CPU and enable the next leap in compute density and performance per watt, handling all the duties of the primary processor and the specialized coprocessor at the same time. When used as a CPU, "Knights Landing" will also remove programming complexities of data transfer over PCIe, common in accelerators today.

To further boost the performance for HPC workloads, Intel will significantly increase the memory bandwidth for all "Knights Landing" products by introducing integrated on-package memory. This will allow customers to take full advantage of available compute capacity without encountering memory bandwidth bottlenecks experienced today.

More information on Intel news from ISC'13 including Raj Hazra's presentation are available on the Intel Newsroom.

Intel, Intel Xeon, Intel Xeon Phi, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

* Other names and brands may be claimed as the property of others.

INFORMATION IN THIS DOCUMENT IS PROVIDED "AS IS". NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO THIS INFORMATION INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

1 Source: IDC: Worldwide Technical Computing Server 2013–2017 Forecast

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_number

Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Chip Shot: ABI Research Finds Intel® Atom™ Processor-based Smartphone Outperforms Competition

webadmin@intel.com — Thu, 13 Jun 2013 21:53:19 GMT

In recent benchmark testing, ABI Research found that Intel’s latest smartphone processor outperformed the competition while consuming less power. ABI pitted the performance of the Intel® Atom™ processor Z2580 running inside the new Lenovo K900 Smartphone against the performance of several competing ARM-based, high-end smartphones. ABI found that Intel’s 2.0 GHz smartphone chip not only beat the competition in performance but it did so “with up to half the current drain.” Read the ABI Research news release.

Chip Shot: Intel Powers Big Data Analytics at New Energy Lab

webadmin@intel.com — Thu, 13 Jun 2013 16:06:13 GMT

The new Pike Powers Laboratory & Center for Commercialization features nearly 80TB of high-speed computing systems based on Intel® Xeon® processors and the ability to do near real-time analytics using the Intel® Distribution for Apache Hadoop. Based in Austin, Texas, the new lab offers specialized capabilities for developing, testing and validating a wide range of smart grid, distributed energy and consumer electronics hardware and software. These capabilities provide companies of all sizes with a unique venue to simulate thousands of real world use cases (home or commercial down to the device level) of customer applications such as lighting, smart meters, solar panels and more. In addition to world-class hardware and computing assets, the lab provides companies with access to the largest database of disaggregated, detailed residential energy data ever recorded, as well as the research experts that designed and built the database. Get more information.

Intel Expands Software Portfolio for Big Data Solutions

webadmin@intel.com — Wed, 12 Jun 2013 18:00:05 GMT

New Intel® Enterprise Edition for Lustre* Software Designed to Simplify Big Data Management, Storage

NEWS HIGHLIGHTS

Intel® Enterprise Edition for Lustre* software helps simplify configuration, monitoring, management and storage of high volumes of data.
With Intel® Manager for Lustre* software, Intel is able to extend the reach of Lustre into new markets such as financial services, data analytics, pharmaceuticals, and oil and gas.
When combined with the Intel® Distribution for Apache Hadoop* software, Hadoop users can access Lustre data files directly, saving time and resources.
New software offering furthers Intel's commitment to drive new levels of performance and features through continuing contributions the open source community.

SANTA CLARA, Calif., June. 12, 2013 – The amount of available data is growing at exponential rates and there is an ever-increasing need to move, process and store it to help solve the world's most important and demanding problems. Accelerating the implementation of big data solutions, Intel Corporation announced the Intel® Enterprise Edition for Lustre* software to make performance-based storage solutions easier to deploy and manage.

Businesses and organizations of all sizes are increasingly turning to high-performance computing (HPC) technologies to store and process big data workloads due to its performance and scalability advantages. Lustre is an open source parallel distributed file system and key storage technology that ties together data and enables extremely fast access. Lustre has become the popular choice for storage in HPC environments for its ability to support tens of thousands of client systems and tens of petabytes of storage with access speeds well over 1 terabyte per second. That is the equivalent to downloading all "Star Wars"* and all "Star Trek"* movies and television shows in Blu-Ray* format in one-quarter of a second.

"Enterprise users are looking for cost-effective and scalable tools to efficiently manage and quickly access large volumes of data to turn valuable information into actionable insight," said Boyd Davis, vice president and general manager of Intel's Datacenter Software Division. "The addition of the Intel Enterprise Edition for Lustre to our big data software portfolio will help make it easier and more affordable for businesses to move, store and process data quickly and efficiently."

The Intel Enterprise Edition for Lustre software is a validated and supported distribution of Lustre featuring management tools as well as a new adaptor for the Intel® Distribution for Apache Hadoop*. This new offering provides enterprise-class reliability and performance to take full advantage of storage environments with worldwide service, support, training and development provided experienced Lustre engineers at Intel.

The Intel® Manager for Lustre provides a consistent view of what is happening inside the storage system regardless of where the data is stored or what type of hardware is used. This tool enables IT administrators to easily manage tasks and reporting, provides real-time system monitoring as well as the ability to quickly troubleshoot. IT departments are also able to streamline management, shorten the learning curve and lower operational expenses resulting in time and resource savings, better risk mitigation and improved business decision-making.

When paired with the Intel® Distribution for Apache Hadoop, the Intel Enterprise Edition for Lustre software allows Hadoop to be run on top of Lustre, significantly improving speed in which data can be accessed and analyzed. This allows users to access data files directly from the global file system at faster rates and speeds up analytics time, providing more productive use of storage assets as well as simpler storage management.

As part of the company's commitment to drive innovation and enable the open source community, Intel will contribute development and support as well as community releases to the development of Lustre. With veteran Lustre engineers and developers working at Intel contributing to the code, Lustre will continue its growth in both high-performance computing and commercial environments and is poised to enter new enterprise markets including financial services, data analytics, pharmaceuticals, and oil and gas.

The Intel Enterprise Edition for Lustre will be available in early in the third quarter of this year.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Delivers New Enterprise SSDs

webadmin@intel.com — Tue, 11 Jun 2013 17:08:54 GMT

To meet the growing storage needs of the data center and cloud computing, Intel today announced the latest addition to its data center family of solid-state drives (SSD) at the Cloud Computing Expo in New York, the Intel® SSD DC S3500 Series. The DC S3500 Series is ideal for read-intensive applications such as Web hosting, cloud computing and data center virtualization. Data centers can save significant costs by replacing traditional hard disk drives (HDD) and moving toward an all-SSD storage model. Additional information about the Intel SSD DC S3500 Series is available here. Tune in Wednesday, June 12, 9 AM ET, for a livecast of Intel corporate VP Rob Crooke’s Cloud Computing Expo keynote address about the state of storage in cloud computing and data centers.

Intel® Solid-State Drive Data Center S3500 Series Gives Cloud Computing Major Boost

webadmin@intel.com — Tue, 11 Jun 2013 15:00:20 GMT

NEWS HIGHLIGHTS

Intel^® Solid-State Drive Data Center S3500 Series delivers next-generation performance to meet the growing storage needs of cloud computing.
Deployment of Intel^® SSDs in data centers increases multicore CPU utilization, reduces rack space, lowers power consumption and improves total cost of ownership.
Based on Intel's industry-leading 20nm NAND flash memory, the new SSD offers fast, consistent performance and stress-free protection in a cost- and power-efficient design.

Intel® Solid-State Drive Data Center S3500 Series

CLOUD COMPUTING EXPO, New York, June 11, 2013 -- Intel Corporation today announced the Intel^® Solid-State Drive DC S3500 Series, its latest solid-state drive (SSD) for data centers and cloud computing. Designed for read-intensive applications such as Web hosting, cloud computing and data center virtualization, the Intel DC S3500 Series is an ideal replacement for traditional hard disk drives (HDD), allowing data centers to save significant costs by moving toward an all-SSD storage model.

Intel SSDs, including the Intel SSD DC S3500 Series, enable transformational improvements in cloud infrastructure, fostering new and enriching Web experiences. End customers experience quicker Web page loads and improved response times as a result of dramatically improved data access times and reduced latency. IT managers and cloud developers are rewarded with improved total cost of ownership as a result of reduced power consumption, more consistent performance and smaller space requirements. More than half of U.S. businesses now employ cloud computing applications, and IDC predicts that worldwide spending on cloud services will reach $44.2 billion this year¹. Data centers powering these cloud applications need to quickly, efficiently and reliably scale to handle the tremendous growth of connected users and data traffic.

"The Intel SSD DC S3500 Series breaks through barriers – like the need for high throughput/low latency storage with a low total cost of ownership – to deliver the storage solution that meets the needs of the cloud, and its demand for storage, which has exploded in recent years," said Rob Crooke, Intel corporate vice president and general manager for the Non-Volatile Memory Solutions Group. "Intel's data center family of SSDs helps make cloud computing faster and more reliable, enabling more transactions and richer experiences."

In cloud computing and data center environments, fast and consistent performance, reduced power consumption, high multicore CPU utilization and stress-free data protection are important requirements. The Intel SSD DC S3500 Series offers enterprise IT and data center managers storage options that deliver increased IO performance, reliability and a lower total cost of ownership over traditional HDDs, ideal for cloud applications.

"Intel SSDs have enabled our chip designers to gain up to 27 percent performance throughput in our massive design distributed computing environment," said Kim Stevenson, chief information officer at Intel. "In fact, we are increasing our deployment of Intel SSDs in our data centers from 10,000 units to 40,000 by the end of this year to enable our global design team to help bring products to market faster."

By combining 20nm Intel^® NAND Flash Memory technology with SATA 6 Gb/s interface support, the Intel SSD DC S3500 Series delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 450 MB/s and a tight distribution of input/outputs per second with low maximum latencies. Random read performance can go up to 75,000 input-output operations per second.

The Intel SSD DC S3500 Series also includes data protection features to address IT and data center professional's concerns of data loss. Built-in capacitors provide a short period of backup power to the drive allowing it to finish operations in the event of power loss. The drives also use 256-bit AES encryption for data protection.

The new SSDs will be offered in capacities ranging from 80 gigabyte (GB) to 800GB and both 2.5 and 1.8 inch form factors. Available through Intel distributors and resellers, the Intel DC S3500 Series is offered at the suggested channel price of $115 for a 1.8-inch 80GB drive and $979 for a 2.5-inch 800GB drive. It is also accompanied by a 5-year warranty.

The new DC S3550 Series, as well as a previously released data center family (Intel SSD DC S3700 Series and 910 Series), are being showcased in Intel's booth (#519) at the Cloud Computing Expo. The event runs from June 10-13 at Jacob K. Javits Center in New York.

More information on Intel SSDs can be found at www.intel.com/go/ssd or by accessing the multimedia press kit at www.intel.com/newsroom/ssd. Follow Intel SSDs on Twitter: @intelssd, or communities.intel.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 "Neovise Report, Public, Private and Hybrid Clouds – When, Why and How They are Really Used."

Chip Shot: Intel Technologists Present at VLSI Symposia

webadmin@intel.com — Mon, 10 Jun 2013 21:59:54 GMT

Some of Intel’s top technologists are presenting details of technologies that enable 4th Generation Intel® Core™ processor technology to achieve dramatically improved graphics performance and how the company is improving energy efficiency of its products. The presentations are part of the 2013 IEEE Symposia on VLSI Technology and Circuits, June 11 to 14. Four of the eight Intel papers are highlighted by event organizers. Get details of the Intel papers.

Intel® Puma™ 6 Powers Comcast’s New XFINITY Wireless Gateway

webadmin@intel.com — Mon, 10 Jun 2013 16:47:04 GMT

Announced in 2012, Intel Puma 6 Now Shipping in Volume to Major Service Providers

NEWS HIGHLIGHTS

Intel® Puma™ 6 silicon powering Comcast's newest wireless gateway.
Fast gateway enables new TV experiences on all customer-owned and managed devices in the home.

THE CABLE SHOW, Washington, D.C., June 10, 2013 – Intel Corporation today announced that Intel® Puma™ 6 is the silicon powering Comcast's recently announced XFINITY Wireless Gateway. The Cisco-made XB3 device is a blazing-fast next-generation DOCSIS 3.0 wireless gateway that delivers data, voice, MoCA 2.0 wireline networking and dual-band wireless coverage in the home to power PCs, game consoles, tablets, smartphones and other customer owned Internet-connected devices. The Wireless Gateway (XB3) from XFINITY Internet is capable of up to 16 bonded downstream channels supporting speeds up to 640 Mbps.

Intel Puma 6 is the first DOCSIS silicon to reach up 1 Gbps downstream by bonding up to 24 DOCSIS channels and up to 240 Mbps upstream by bonding up to 8 DOCSIS return channels. Intel Puma 6 incorporates a powerful Intel® Atom™ core that can be used to support multiple services in the home including home automation, security, and energy management. Intel's hardware-based virtualization technology allows service providers to deploy a single gateway to support multiple services in a secure and stable environment, eliminating the need and cost of multiple, dedicated devices.

"Comcast and Cisco's selection of Puma 6 as the silicon powering this new generation of powerful wireless gateways illustrates the value of Intel to service providers," said Alan Crouch, Intel vice president and general manager, PCCG Service Provider Division. "The integration of these fast gateways and powerful new Intel-based Ultrabook™ and all-in-one PCs bridge the client and cloud to deliver exciting TV and broadband entertainment experiences to consumers."

Joe Chow, vice president and general manager of Cisco's Connected Devices Business Unit, said, "Cisco and Intel have a long-standing relationship as Intel is one of several strategic suppliers of silicon to Cisco. We look forward to the opportunities our combined technology offers, as we expand our collaboration to include CPE like the XB3 wireless gateway for Comcast."

MoCA-enabled wireless gateways will enable service providers such as Comcast to extend their video delivery into consumer devices over Wi-Fi. The combination of Comcast's X1set-top boxes, launched last year based on an Intel chipset, and the wireless gateway allows Comcast to stream live and On Demand content wirelessly to Intel-based devices in the home, all without the need of additional set-top boxes. That capability was previously only available on MoCA-connected set-top boxes. The same new graphically enhanced, cloud-based guide and user interface that you see on your TV will be available on subscribers' Ultrabooks and all-in-one PCs.

"Intel continues to be a great partner as we work to develop a platform that supports an in-home gateway and client architecture," said Steve Reynolds, senior vice president of Customer Premise Equipment for Comcast. "Intel's powerful silicon platforms have enabled us to quickly develop a flexible platform for the delivery of our cable video services that will give customers the ability to view them on a wide range of consumer devices in the home."

The Intel Puma family system architecture provides OEMs with flexibility to easily customize their products to fit a wide range of MSO-required and optional features such as high data rates, wireless communications, power down modes and telephone support. Intel was the first to deploy DOCSIS 3.0 technology with Intel® Puma™ 5, and over 40 million DOCSIS 3.0 systems have shipped.

Intel, Intel Puma, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Capital Invests US$16 Million in e-Commerce across Asia

webadmin@intel.com — Fri, 07 Jun 2013 16:03:01 GMT

At the World Economic Forum (June 5-7,2013) taking place in Myanmar, Intel Capital announced three investments in e-commerce firms seeking to scale up and extend their businesses in Asia. The investments, totaling approximately US$16 million, are: India's Bright Lifecare, a premier distributor of nutrition, health and wellness products; Snapdeal.com, a leading consumer goods marketplace in India; and existing portfolio company Singapore's Reebonz.com, one of Asia's largest private luxury goods retailers. Please follow this link to learn more.

Chip Shot: At Intel, "We Recycle" for World Environment Day

webadmin@intel.com — Wed, 05 Jun 2013 20:20:27 GMT

Today is World Environment Day, and Intel is celebrating by spreading the word about the company’s We Recycle program. We Recycle was launched earlier this year and aims to engage Intel employees in recycling 90 percent of the company’s solid waste – about 8,200 tons. Participating Intel sites now feature centralized areas for recycling to better manage food waste, and Intel cafeterias now have reusable dishware to reduce waste from disposable utensils. Check out this blog post to learn more.

Chip Shot: Intel® Iris™ Graphics in 4th Generation Core Processors Enhance User Experience

webadmin@intel.com — Wed, 05 Jun 2013 17:13:30 GMT

Available in new 4^th generation Intel® Core™ processors, Intel® Iris™ Pro graphics 5200 and Intel® Iris™ graphics 5100 give consumers a better gaming experience with more stunning performance than ever before. One notable app that takes advantage of these new graphics to deliver a visually stunning racing experience is Codemasters GRID 2. In addition to great graphics, Ultrabook™ device users can enhance their experiences with touch, sensor and gesture input. Young racing fans will enjoy SEGA Sonic All Stars Racing with its touch and sensor controls. Aspiring composers can use Cakewalk Sonar’s multi-touch UI to make a musical masterpiece, while Magix Movie Edit Touch or Cyberlink Power Director let users express their video creativity. Inquiring minds can explore the night sky using Star Chart’s touch and sensor capabilities, and youngsters can use gestures to explore an animated virtual world with Compedia’s Pandu Park.

Chip Shot: Intel Capital Invests in Wearable Computing Innovator Thalmic Labs

webadmin@intel.com — Wed, 05 Jun 2013 17:08:29 GMT

Intel Capital today announced an investment in Thalmic Labs, makers of MYO, an armband with the ability to control gadgets with simple hand gestures. Since announcing MYO, Thalmic Labs has seen rapid traction and global enthusiasm, receiving over 30,000 pre-orders across 138 countries in less than three months. The funding will help Thalmic Labs with product development and market expansion. As part of the investment from Intel Capital, Thalmic Labs will gain access to Intel’s manufacturing and technology expertise to help the company scale production and enhance next generation products. View the press release for more information.

Chip Shot: Intel Technology Powers Polar Explorer Ben Saunders' Scott Expedition

webadmin@intel.com — Wed, 05 Jun 2013 16:08:20 GMT

Intel today announced it is the technology sponsor for polar explorer Ben Saunders’ attempt to replicate the Terra Nova expedition – a return trip from the coast of Antarctica to the South Pole that British Royal Navy Captain Robert Falcon Scott attempted in 1912 and that no person has completed since. Saunders will be equipped with a 4th Generation Intel® Core™ processor powered Sony VAIO* Pro Ultrabook™, which at just over 1.9 pounds is the lightest Ultrabook yet. This makes Saunders one of the first people to use the latest Intel® Core™ technology. He will connect to the Internet using an Intel NUC (Next Unit of Computing) device. The NUC will have a 24/7 data connection via satellite phone to a server in London and both it and the Ultrabook device will charge via solar panels attached to a specially designed sled. Saunders will be able to upload video, photos, data and blog content with minimal delay, enabling him to share his journey, as it happens, with the world.

Intel Readies 'Bay Trail' for Holiday 2013 Tablets and 2-in-1 Devices

webadmin@intel.com — Wed, 05 Jun 2013 04:45:39 GMT

Highlights Next-Generation 22nm Intel® Atom™ Processor Products Aimed at Tablets and Smartphones, and Demonstrates Global 4G LTE Solution

NEWS HIGHLIGHTS

Next-generation 22nm Intel® Atom™ processor-based SoC for tablets based on Silvermont microarchitecture to include quad core processing, Gen 7 graphics, support for DX11, full HD, Intel® Burst Technology 2.0, hardware-based security features, 2x CPU improvement and 3x graphics improvement¹ and support for Windows* and Android*.
Highlights recent momentum around the Intel® Atom™ processor Z2580 with the Lenovo* K900 and ASUS* Fonepad Note FHD6 and ASUS* MeMO Pad FHD 10 announcements.
New Samsung GALAXY Tab 3 10.1-inch, equipped with Intel's 3G and 4G LTE solutions, and powered by the Intel® Atom™ processor-based SoC ("Clover Trail+") platform for Android* tablets.
Demonstrates Intel® XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia.

COMPUTEX, Taipei, Taiwan, June 5, 2013 – At an industry event in Taipei today, Hermann Eul, general manager of Intel's Mobile and Communications Group, unveiled new details about the company's forthcoming Intel® Atom™ processor-based SoC for tablets ("Bay Trail-T") due in market for holiday this year.

Based on the new Silvermont microarchitecture, the next generation 22nm Intel technology for tablets and ultra-mobile devices will enable sleek designs with 8 or more hours of battery life² and weeks of standby, as well as support Android* and Windows 8.1*.

Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel® XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia.

"The mobile category is undergoing a tremendous amount of innovation and constant change," said Eul. "As we look at growing it, we continue to invest in and accelerate our efforts across all aspects of mobility with a focus on smartphones, tablets and wireless communications. Intel's unique assets will enable more compelling and differentiated products and experiences, while at the same time helping to shape and lead markets in the future."

Next-Generation 22nm Intel® Atom™ Processor-based SoC for Tablets and 2-in-1s
Building on the progress of the Intel® Atom™ processor Z2760, the new products will deliver efficient, quad core processing that doubles the performance over the previous generation, according to Eul.

The next-generation Intel Atom processor-based SoC for tablets ("Bay Trail") provides the best balance of performance, features and battery life, he added. Taking full advantage of the broad spectrum of capabilities enabled by Intel's design, microarchitecture, 22nm tri-gate transistor technology, and leading-edge manufacturing, Intel can quickly scale up and down in performance and power efficiency to address various market and product needs. With the new 22nm Silvermont architecture, Intel delivers industry-leading performance with fewer cores, allowing Intel platforms to bring to life incremental features and capabilities.

Eul discussed Intel's focus on enabling a richer media and content experience by improving graphics performance. He then highlighted the tablet platform's new Gen 7 graphics that will offer more than three times the graphics capabilities¹, with support for DX11 for expanded PC application and game support.

The new Intel Atom processor-based platform comes equipped with hardware-based security with McAfee Live Safe. This digital life protection suite keeps online identity private, protects from phishing attacks and keeps data secure while protecting the devices.

Intel's next-generation Atom processor for tablets will provide the benefits of both performance and productivity. Any task performed on a tablet or 2-in-1 device, from light photo editing to office productivity, becomes much faster and more interactive. People will see increased capability and richer content and will be able to play popular 3-D games on these sleek, battery-efficient devices than previously possible.

Bay Trail also represents the first time Intel is offering its customers a mobile platform solution that is flexible with regard to operating system and the company will provide the same great Intel tablet performance and high-resolution graphics at cost savings to consumers.

Enabling Mobile Devices with Intel Inside®
Intel platform and enabling programs have been the foundation of OEM and ODM innovation for decades. Eul said the company is currently focused on work with leading ODMs and OEMs to speed time-to-market of leading-edge mobile devices based on Intel technology.

Intel's platform and ecosystem enabling efforts will be focused initially on Intel Atom processor-based tablets running Android* and Windows*. The company is providing pre-qualified solutions with simplified building blocks to scale designs quickly for mature and emerging markets.

Eul said that the Taiwanese ecosystem is vital to this effort and will bring speed, scale and exciting new innovation.

Long-Term Evolution (4G LTE)
Intel's strategy is to deliver leading low-power, global modem solutions that work across multiple bands, regions and devices.

Intel's XMM 7160 is one of the world's smallest and lowest-power multimode-multiband LTE solutions. The modem supports 15 LTE bands simultaneously, and also includes a highly configurable RF architecture running real-time algorithms for envelope tracking and antenna tuning that enables cost-efficient multiband configurations, extended battery life and global LTE roaming in a single SKU.

Eul demonstrated the solution by showcasing a Bay Trail-based tablet over an LTE network connection, and said that Intel will begin shipments of multimode data 4G LTE in the coming weeks following final IOT with Tier 1 service providers in North America, Europe and Asia.

Intel® in Smartphones and Tablets
Eul also highlighted recent momentum with the "Clover Trail+".

Jerry Shen, ASUS CEO, joined Eul on stage to showcase two innovative Intel-based devices -- the ASUS Fonepad* Note FHD 6 and the ASUS MeMO Pad* FHD 10.

The ASUS Fonepad Note FHD 6 features the Intel Atom processor Z2560. It has a display brightness rating of 450 nits so it can be used outdoors under bright sunshine, while twin speakers with ASUS SonicMaster* technology guarantees optimized high definition audio. In addition, the bundled stylus enables quick, accurate input on ASUS-exclusive note-taking apps.

The ASUS MeMO Pad FHD 10 also features the Intel Atom processor Z2560 1.6GHzand a 1920 x 1200 Full HD IPS display for vivid visuals with 178-degree wide viewing angles. It features stereo speakers with SonicMaster audio technology, a 10-inch screen ideal for entertainment, 1080p video playback and handheld gaming.

The ASUS MeMO Pad FHD 10 includes Intel® Hyper-Threading Technology for improved graphics performance and increased energy efficiency. The slim design has a 1.2-megapixel front-facing camera and a 5-megapixel rear-facing camera with autofocus for impressive photos. It is just 9.5mm thick and 580g light, and its lithium polymer battery lasts for up to 10 hours.

Intel announced that the new Samsung GALAXY Tab 3 10.1-inch is powered by the Intel® Atom™ processor Z2560 ("Clover Trail+"). Additionally, the new Samsung GALAXY Tab 3 10.1-inch tablet will come equipped with Intel's XMM 6262 3G modem solution or Intel's XMM 7160 4G LTE solution.

Lenovo* recently announced the general availability of the Lenovo K900 smartphone with Intel Inside. The handset, based on the Intel Atom processor Z2580 phone chip, is now available in China and very shortly in India, Indonesia, Malaysia, Russia, Thailand, the Philippines and Vietnam. Additional markets will be announced in the near future. The Lenovo K900 combines powerful performance with elegant design and user-friendly capabilities such as an advanced camera and rich, immersive HD graphics.

Building on this, ZTE also disclosed the ZTE Grand X2 IN smartphone with Intel Inside® and the ZTE GEEK. Featuring the Intel Atom processor Z2580, the smartphones are scheduled to be available in Europe and then China in the second half of this year.

Looking forward, Eul highlighted Intel's next Atom processor-based SoC for smartphones, codenamed "Merrifield." Taking advantage of the new, versatile 22nm Silvermont microarchitecture, Merrifield will enable a performance increase of greater than 50 percent and will also increase battery life over current-generation "Clover Trail+" product offerings. The platform also brings support for contextual awareness and personal services via an integrated sensor hub, and increased data, device and privacy protection.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

Intel, Atom, Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1Compared to the Intel Atom Processor Z2760 Platform

2Based on a 30W Hour battery on 19x10 resolution on 10.1” display. Higher resolution will require larger battery. Active use measured as 1080/30 fps local video playback. Battery life may differ based on SKU and SoC performance.

Chip Shot: Intel, Alstom Grid Announce Smart Grid Technologies Collaboration

webadmin@intel.com — Tue, 04 Jun 2013 17:18:04 GMT

Intel, with McAfee and Wind River, and Alstom Grid announced a strategic collaboration that will enable the companies to seamlessly integrate operational technology and information technologies in order to meet current and future challenges and opportunities in the Smart Grid industry. A key benefit of the collaboration will be increased expertise gained from cross-training through pilot projects run by both companies. To achieve this, Smart Grid pilot demonstrators will liaison between the companies with the goal to improve Smart Grid technologies, particularly in the field of security and hardware platforms. For more information, check out the press release and the whitepaper.

Chip Shot: New Intel® Xeon® Processors Accelerate Media Processing in the Cloud

webadmin@intel.com — Tue, 04 Jun 2013 16:29:18 GMT

Today Intel introduced the new Intel® Xeon® processor E3-1200 v3 product family based on Haswell microarchitecture and the company's 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors will help reduce costs and increase media processing capabilities for cloud-based media service providers to better support customers wanting to upload and share videos with friends across different mobile devices. In addition to a better offering for cloud media workloads than discrete graphic-based servers, new Intel Xeon processors offer exceptional energy efficiency and lowest TDP ever at 13 Watts for highly dense environments like microservers. Get the Intel Xeon processor E3-1200 v3 product family fact sheet.

Intel is Inside the New Samsung GALAXY Tab 3 10.1-Inch

webadmin@intel.com — Tue, 04 Jun 2013 13:00:05 GMT

Intel® Atom™ Processor Z2560 and Intel XMM 7160 LTE Solution to Ship Globally in New Tablet

NEWS HIGHLIGHTS

New Samsung GALAXY Tab 3 10.1-inch, equipped with Intel's 3G and 4G LTE solutions, and powered by the Intel® Atom™ SoC ("Clover Trail+") platform for Android* tablets.
Intel® Atom™ processor Z2560 provides outstanding performance, battery life and overall experience for Android tablet users.
Intel® XMM 7160 is one of the world's smallest and lowest-power multimode-multiband solutions for global LTE roaming in one SKU with envelope tracking and antenna tuning.

SANTA CLARA, Calif., June 4, 2013 – Signaling the company's continued momentum in the tablet market segment, Intel Corporation today announced that the new Samsung GALAXY Tab 3 10.1-inch is powered by the Intel® Atom™ Z2560 processor ("Clover Trail+"). Additionally, the new Samsung GALAXY Tab 3 10.1-inch tablet will come equipped with Intel's XMM 6262 3G modem solution or Intel's XMM 7160 4G LTE solution.

"Customers are selecting Intel technology because it offers the best balance of high performance, power efficiency and battery life," said Hermann Eul, Intel vice president and general manager of the company's Mobile and Communications Group. "It's ultimately about the consumer experience, and we are confident people will be pleased with what Intel Inside® has to offer."

Intel in Android-based Tablets
People expect more from their tablets, and the dual-core Intel Atom SoC ("Clover Trail+") platform for Android* tablets provides double the compute performance and 3x graphics capabilities with competitive battery life compared to the previous-generation Intel Atom processors platform¹.

Intel Atom processors are designed and optimized for a lightning-fast applications experience, responsive Web browsing, stunning 3-D graphics, advanced camera capabilities and vivid HD video with energy efficiency for outstanding battery life.

The integrated Intel® Graphics Media Accelerator provides compelling and realistic 3-D gaming experiences, 1080p HD video and crystal-clear graphics. Advanced camera features including face recognition, mobile HDR and panorama help users create like never before. Additionally, Clover Trail+ offers dual-core performance along with Intel® Hyper-Threading Technology, supporting four simultaneous application threads for smoother, seamless multitasking.

Long-Term Evolution (4G LTE)
Intel's strategy is to deliver leading low-power, global modem solutions that work across multiple bands, regions and devices.

Intel's XMM 7160 is one of the world's smallest and lowest-power multimode-multiband LTE solutions². The modem supports 15 LTE bands simultaneously and also includes a highly configurable RF architecture, running real-time algorithms for envelope tracking and antenna tuning, that enables cost-efficient multiband configurations, extended battery life and global LTE roaming in a single SKU. It supports multiple devices including smartphones, tablets and Ultrabooks™.

Intel will begin shipments of multimode data 4G LTE in the coming weeks following final interoperability testing (IOT) with Tier 1 service providers in North America, Europe and Asia.

Intel, Atom, Core, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

¹ Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Configurations: Compared to the Intel Atom Processor Z2460 platform; Graphics clock will vary based on SKU: Z2580, Z2560, Z2520. For more information go to http://www.intel.com/performance.

²Compared with competitive solutions shipping in market today.

Intel Capital Fund to Accelerate Human-Like Senses on Computing Devices

webadmin@intel.com — Tue, 04 Jun 2013 08:30:05 GMT

NEWS HIGHLIGHTS

Intel Capital creates a $100-million Intel Capital Experiences and Perceptual Computing Fund to bring more compelling, natural and immersive experiences across the spectrum of Intel® architecture platforms.
Intel Capital Experiences and Perceptual Computing Fund targeted at accelerating the development of software and applications to bring new experiences to life.

COMPUTEX, Taipei, Taiwan, June 4, 2013 – At Computex today, Intel Corporation executives detailed progress toward the company's vision to integrate human-like sensing technology into devices, ultimately delivering more natural, intuitive and immersive computing experiences. To help realize this vision, Intel Capital, Intel's Global Investment and M&A Organization, announced a $100-million investment fund to accelerate the development of software and applications that bring these experiences to life across the spectrum of Intel® architecture platforms.

The Intel Capital Experiences and Perceptual Computing Fund will invest over the next 2-3 years. Areas of software and application investment will include broader touch applications, imaging, gesture, voice and emotion sensing and biometrics, among others.

"Devices with human-like senses – the ability to see, hear and feel much like people do – has long been a subject of science fiction but is now within reach given recent innovations in compute power and camera technology," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "This new fund will invest in start-ups and companies enabling these experiences, helping them with the business development support, global business network and technology expertise needed to scale for worldwide use."

Intel announced its perceptual computing initiative at its annual Intel Developer Forum in 2012. Since then, the company's Perceptual Computing Software Developer Kit (SDK) has been downloaded more than 10,000 times. It had already launched the Perceptual Computing Challenge, an early kick-off contest for developers to create innovative applications using the SDK with up to $1 million in awards.

Intel and its industry partners have also made significant progress in bringing the first perceptual computing technologies to the market for today's Ultrabook™ systems and PCs, including:

An interactive gesture camera from Creative, the Senz3D which is already in the hands of developers and will be available to consumers in the third quarter of this year.
Leading the development and enabling the integration of 3-D depth camera technology by working with multiple OEM partners to build the technology into various Intel-based devices with targeted availability for second half of 2014.
The largest U.S. PC retailer, Best Buy, is assorting the Nuance Dragon Assistant on 10+ Intel® Core™ based notebooks, Ultrabooks™, and all-in-one PCs from Acer, Asus, Lenovo, and Toshiba. With Dell announced earlier this year, there are now five OEMs shipping designs to consumers during the back-to-school selling cycle.
Facial log-in software from Sensible Vision will ship preloaded from multiple OEMs.

"Intel and our key OEM partners are excited about integrating 3-D depth camera technology into our next-generation platforms bringing compelling, natural and immersive experiences to life," said Kirk Skaugen, senior vice president and general manager of Intel's PC Client Group.

The Intel Capital Experiences and Perceptual Computing Fund will complement the existing Intel Capital Ultrabook Fund. Intel Capital has invested a significant portion of the $300-million Ultrabook Fund in innovative system component technologies in areas such as audio, touch, battery, display, sensor and wireless connectivity to make Intel-based computing devices thinner, lighter, more secure and responsive.

About Intel Capital
Intel Capital, Intel's global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media and semiconductor manufacturing. Since 1991, Intel Capital has invested more than US$10.8 billion in over 1,284 companies in 54 countries. In that timeframe, 202 portfolio companies have gone public on various exchanges around the world and 320 were acquired or participated in a merger. In 2012, Intel Capital invested US$352 million in 150 investments with approximately 57 percent of funds invested outside North America. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com or follow @Intelcapital.

Intel, Intel Atom, Intel Core, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

4th Generation Intel® Core™ Ushers New Wave of 2-in-1 Devices

webadmin@intel.com — Tue, 04 Jun 2013 06:03:59 GMT

New Family of Processors Combines Exceptionally Low Power Consumption with Stunning Performance

NEWS HIGHLIGHTS

First system-on-a-chip for PCs, enabling new form factors and 2-in-1 designs.
4th generation Intel® Core™ processors enable 50 percent improvement in battery life, biggest gain in company history.
4th generation Intel® Core™ with Intel® Iris™ graphics delivers up to double the graphics performance over the previous generation.

SANTA CLARA, Calif., June 4, 2013 – Intel Corporation today introduced the 4th generation Intel® Core™ processor family, reinventing personal computing as people know it today. 4th generation Intel Core delivers optimized experiences personalized for end-users' specific needs, packing extraordinary battery life capability, breakthrough graphics and new usages in devices such as 2-in-1s, tablets, robust enthusiast and portable all-in-one systems and secure and manageable business device with Intel® vPro™.

The new Intel Core processors provide incredibly responsive, secure and powerful performance for consumers to create and consume content wherever their mobile lifestyles take them. The first chip ever built from the ground up for the Ultrabook™ and the most significant roadmap change since Intel® Centrino® technology, 4th generation Intel Core processors combine stunning PC performance with tablet-like mobility, accelerating a broad new category of 2-in-1 devices. With power levels as low as 6 watts in scenario design power, Intel is enabling thinner, lighter, cooler, quieter and fanless designs. New Intel Core processors also power designs such as all-in-one PCs with great battery life, bringing portability to the growing category. The highest-performing processor family, 4th generation Intel Core processors are capable of delivering up to 15 percent better performance than the previous generation.

"4th generation Intel Core processors offer the most significant gain in battery life enabling ever achieved by Intel, up to double the graphics and significant CPU performance improvements that are delivering exciting new consumer experiences," said Kirk Skaugen, Intel senior vice president and PC Client Group general manager. "Today's announcement accelerates a new category of 2-in-1 computing devices delivering the best of a notebook and a tablet in amazing new form factors. This year is the perfect time for consumers to refresh their old tablet or PC with these new 2-in-1 devices."

Consumer and business systems based on quad-core versions of 4th generation Intel Core processors are now available. Summer availability is planned for 2-in-1s Ultrabooks, portable all-in-ones and traditional laptops and desktops. New mobile business products with 4th generation Intel® Core™ vPro™ will be available later this year. Pricing for the new Intel Core processors can be found on www.intc.com.

Low Power + Stunning Performance + Eye-Popping Graphics

Delivering Intel's largest generation-over-generation gain in battery life enablement in company history, 4th generation Intel Core processors can bring an 50 percent improvement in battery life over the previous generation in active workloads when watching movies or surfing the Internet, and two to three times improvement in standby battery life. For some systems coming to market this year, over 9 hours of active use battery life or 10 to 13 days of standby with fresh data on a single charge is expected.

To achieve this breakthrough, Intel exceeded its expectations on power reduction at the CPU level to as low as 6 watts and also worked across the system for power optimization. These improvements range from System-on-a-Chip (SoC) and platform level technologies to Intel's leading-edge 22nm process technology. Active power is improved as is idle power by architecting new ultra low-power processor states where the CPU consumes a fraction of the power compared to previous idle states.

The 4th generation Intel Core processors also bring the highest performance currently available in mainstream computing with the additional benefit of superior graphics support. People will be able to experience every day computing approximately two times faster; systems can wake up approximately eight times faster and users will have the ability to edit and share HD video about 20 times faster; than a similar 4-year-old computer.

Intel expanded its range of Intel graphics in the highly integrated SoC to deliver even more stunning visuals in thinner and lighter devices. Intel® Iris™ graphics, available on select SKUs of the 4th generation Intel® Core™ processor family, delivers up to double the 3-D performance over today's fastest mobile Intel HD Graphics solutions. Intel Iris graphics bring next-generation mobile computing devices to life with a built-in, visual experience – no extra graphics card required.

New Computing Experiences, More Peace of Mind for New Intel Core-Powered Ultrabook

The 4th generation Intel Core processor also enables a number of new computing interactions to enhance the overall user experience. 4th generation Intel Core – completely redesigned from the ground up specifically for the Ultrabook – represents a seismic shift in the compute landscape. New Intel Core raises the bar for Ultrabooks and realizes the vision Intel outlined 2 years ago to combine best-in-class performance, impressive responsiveness and battery life and built-in security in thin and elegant mobile designs. All new Ultrabooks will be touch-enabled and have Intel Wireless Display capability built in to bring natural touch and motion interactivity and speed mode for low-latency gaming on the big screen. Ultrabooks will also be hardware-ready for voice command and control, giving the user flexibility to choose the most natural and intuitive way of handling the task at hand. Ultrabooks will wake in less than 3 seconds from deep sleep and in some cases much faster, offering the nearly "instant-on" experience that people want. Ultrabooks will pull email, social media and other updates while in a low-power mode, meaning less waiting for fresh data upon waking.

Ultrabooks are also equipped with built in security capabilities including Intel Identity Protection Technology (Intel IPT) and Intel Anti-Theft Technology (Intel AT) for more computing protection. Websites partnered with Intel IPT help protect log-in information, keeping identities safe based on hardware authentication. Intel Anti-Theft Technology helps protect Ultrabooks by automatically disabling it if lost or stolen. The recently introduced McAfee LiveSafe service brings the deepest protections available by taking advantage of technology in new Intel Core processors and Intel IPT and Intel AT.

Built for the Enterprise: Business, Workstation and Intelligent Systems

To ensure the best business computing experience for both IT staff and end users, embedded features in 4th generation Intel Core vPro processors further strengthen security and increase business productivity. Available today in select business desktops, all-in-one PCs, ultra-small form factor and mobile workstation devices with future availability later this year for Ultrabook, tablet and business laptop devices, Intel Core vPro offers superior performance for secure, productive and collaborative experiences allowing end users and IT to compute with confidence.

The 4th generation Intel® Core™ processor family is also ideal for the design of high-performance, low-power intelligent systems for retail, industrial, media servers, medical and digital surveillance environments. The improved 3-D graphics and media performance deliver outstanding HD media playback for highly visual retail and digital signage applications, while new Intel AVX 2.0 instructions enable faster calculations for the rapid collection and interpretation of sound waves in an ultrasound machine. (Additional information on the 4th generation Intel Core processor family for intelligent systems is available in the news fact sheet.)

It is estimated that by 2016 all TV, video-on-demand and Internet video combined may compose up to 86 percent of global consumer traffic¹. Such growth requires innovation in processing technologies to help content providers deliver faster, better-quality video to consumers while at the same time radically optimizing their cloud infrastructure to serve billions of connected devices. Introduced today, the Intel® Xeon® processors E3-1200 v3 product family comes equipped with graphics featuring hardware accelerated media encode and decode technologies that allows all media and video content providers to deliver up to 4.6 times² more videos to customers and decrease their total cost of ownership up to 64 percent² versus traditional servers equipped with discrete graphics used today. The new microarchitecture and leading process technology also allow the lowest-power Intel® Xeon® processor ever at 13W TDP aimed at microservers and communication infrastructure. Up to 38 percent improvement in graphics performance and up to 18 percent better energy-efficient performance versus the previous generation also provide an opportunity for upgrading workstations, entry-level servers and storage solutions. (More information about new Intel® Xeon processors E3-1200 v3 product family is available in the news fact sheet.)

"B-roll featuring three lead Intel engineers on the making of 4th generation Intel Core and supporting images are available at www.intel.synapticdigital.com."

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

Intel, Intel Atom, Intel Core, Intel Xeon, Centrino, vPro, Ultrabook, Iris and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Source: Cisco Visual Networking Index Forecast and Methodology, 2011-2016

2 Results, which are provided for informational purposes only, were estimated as of March 2013 by Intel based on a comparison of performance (number of 1080p 30fps HD concurrent transcode per GPU) and related results utilizing Intel’s product data and data published by nVidia* Kepler*. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

Innovation, Reinvention on Intel® Architecture Fuel Wave of 2-in-1 Devices, New Mobile Computing Experiences

webadmin@intel.com — Tue, 04 Jun 2013 06:01:11 GMT

NEWS HIGHLIGHTS

Intel introduced 4th generation Intel® Core™ processors that serve as foundation to wave of new 2-in-1s that combine stunning PC performance with tablet-like mobility in one device and deliver on Ultrabook™ vision.
New Intel Core processors deliver biggest power savings in company history, enabling over 9 hours of battery life¹ with stunning performance and two times the graphics capability versus the previous generation².
Intel demonstrated for the first time its next-generation 22nm quad-core Intel® Atom™ SoC for tablets in conjunction with its forthcoming 4G LTE multimode data solution.
Showed first smartphone reference design platform based on next-generation 22nm Intel Atom SoC for smartphones.

COMPUTEX, Taipei, Taiwan, June 4, 2013 – Ushering in a wave of new Ultrabook™ andemerging 2-in-1 devices that deliver a PC when you need it and a tablet when you want it, Intel Corporation today introduced its ground-breaking 4th generation Intel® Core™ Processor family.

Speaking at Computex Taipei 2013, Executive Vice President Tom Kilroy said Intel has more than 50 different 2-in-1 designs in the pipeline across a range of price points, including premium Ultrabook 2-in-1s powered by the new Intel Core processors, and other designs powered by forthcoming processors based on the company's 22nm Silvermont microarchitecture.

"Today we deliver on the vision set forth 2 years ago to reinvent the laptop with the introduction of our 4th generation Intel Core processors that were designed from the ground up for the Ultrabook and serve as the foundation for a new era of 2-in-1 computing," said Kilroy. "We made one of the most seismic changes to our roadmap ever to build these new Core processors that deliver the stunning performance of the PC and the mobility of a tablet in one device. The new processors power the most exciting 2-in-1 designs to-date."

Kilroy also highlighted momentum in ultra-mobility, pointing to Intel's next-generation 22nm quad-core and most powerful Intel® Atom™ system-on-chip (SoC; codenamed "Bay Trail-T") yet for tablets coming this holiday, the company's forthcoming 4G LTE multimode solution and its next-generation 22nm Atom SoC (codenamed "Merrifield") for smartphones.

"With the new Intel Core processors introduced today, our next-generation Atom SoC for tablets and other 22nm products coming soon, the advances in Intel® architecture are accelerating the pace of innovation, enabling new experiences and powering some of the best mobile devices coming to market this year," said Kilroy.

New Intel Core Processors Foundational to 2-in-1 Computing, New Experiences

Designed first and foremost with the Ultrabook in mind and based on the company's flagship 22nm Haswell microarchitecture, the 4th generation Intel Core processors deliver a 50 percent increase in battery life in active workloads over the previous generation¹. This is the largest generation-over-generation gain in the company's history, equating to over 9 hours of battery life in active workloads¹ for some Ultrabooks based on the new processors.

Intel's newest Core processors are the first SoCs for PCs with stunning performance, and power a variety of innovative devices, including Ultrabook, 2-in-1 and portable all-in-one designs. Systems based on the quad-core version of the new Core processors are available now, with additional versions available in the coming months.

The 4th generation Intel Core processors also have built-in graphics that deliver discrete-level performance, or up to 2 times the performance of Intel's prior generation². Offered on select versions of the new Intel Core processors, Intel® Iris™ graphics bring the Ultrabook and other mobile PCs to life with built-in, eye-popping visual experiences.

Select Ultrabooks powered by 4th generation Intel Core processors will deliver the Intel performance people expect combined with the mobility and responsiveness of a tablet, making them the premium, ultra-versatile 2-in-1 devices. With touch capability and a keyboard, the system adapts to the user and also offers full application compatibility. People can lean forward to work and lean back to relax using just one device.

Kilroy also showcased progress in bringing human-like senses to 2-in-1 and other Intel-based devices through the addition of touch, voice and facial recognition and other technologies. Called perceptual computing, these technologies take advantage of Intel processing power to make interaction with devices natural, intuitive and immersive.

He demonstrated immersive, short-range gesture and voice-based interaction by giving new Intel Core-based Ultrabook 2-in-1 devices "eyes" with the Creative Senz3D* peripheral camera, noting general availability for the camera starting next quarter. Looking to the future, he said Intel is working on an integrated solution to build 3-D depth camera technology directly into future Intel-based devices targeted for the second half of 2014.

Accelerating Fast: Tablets, Smartphones and LTE

Intel's 22nm low-power, high-performance Silvermont microarchitecture is enabling the company to accelerate and significantly enhance its tablet and smartphone offerings.

For tablets on shelves for holiday 2013, Intel's next-generation, 22nm quad-core Atom SoC ("Bay Trail-T") will deliver superior graphics and more than two times the CPU performance of the current generation. It will also enable sleek designs with 8 or more hours³ of battery life and weeks of standby, as well as support Android* and Windows 8.1*.

For the first time, Kilroy demonstrated Intel's 4G LTE multimode solution in conjunction with the next-generation 22nm quad-core Atom SoC for tablets. The Intel® XMM 7160 is one of the world's smallest⁴and lowest-power multimode-multiband LTE solutions and will support global LTE roaming in a single SKU.

With a number of phones with Intel silicon inside having shipped across more than 30 countries, Kilroy previewed what's coming. He showed for the first time a smartphone reference design platform based on "Merrifield," Intel's next-generation 22nm Intel Atom SoC for smartphones that will deliver increased performance and battery life. The platform includes an integrated sensor hub for personalized services, as well as capabilities for data, device and privacy protection.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

Intel, Intel Atom, Intel Core, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Measured on OEM system using battery life during local offline video playback of a 1080p MP4 in landscape mode. Measured on OEM System using MobileMark* 2012. For more information, see www.bapco.com.

2 As measured by 3DMark11*, an industry standard benchmark from Futuremark*

3 Based on a 30W Hour battery on 19x10 resolution on 10.1” display. Higher resolution will require larger battery. Active use measured as 1080/30 fps local video playback. Battery life may differ based on SKU and SoC performance.

4 Compared with competitive solutions shipping in market today and projections of forthcoming solutions.

Lenovo Teams with Intel on K900 Smartphone

webadmin@intel.com — Mon, 03 Jun 2013 22:00:02 GMT

BEIJING and SANTA CLARA, CA – June 3, 2013 - In a series of events over the past week, Lenovo (HKSE: 992) (ADR: LNVGY) and Intel Corporation announced availability in several markets of the Lenovo K900 Smartphone, the world's first smartphone based on the latest Intel® Atom™ Z2580 processor. With this week's addition of Thailand and Malaysia to markets already selling the K900, Lenovo has now upped the number of countries receiving the new smartphone to eight with more to be announced this summer.

Already the world's third-largest producer of "smart connected devices"¹, Lenovo expects the K900 will appeal to customers around the world looking for sleek design, high quality and the latest innovations in smartphone technology. The device offers a large display, high-end camera and other features popular with customers in key, emerging markets in Asia. The K900 also distinguishes itself with a unique, eye-catching design and Intel's powerful, cutting-edge mobile processor.

By year end, Lenovo plans to offer the K900 smartphone in 10 new markets in addition to the current set, which includes China, India, Indonesia, Russia, the Philippines and Vietnam. The company has tapped global NBA superstar Kobe Bryant to help promote the device in China and Southeast Asia, while designing a worldwide marketing campaign to promote the phone in other markets. Lenovo aims to use its experience in Asia as a springboard for its global smartphone ambitions.

"Many of the world's fastest-growing smartphone markets are in Asia," said JD Howard, vice president, Mobile Internet Digital Home business operations and business development. "Lenovo has built a strong smartphone base in China, and last year we began offering our smartphones in additional markets. The Lenovo K900 is a world-class smartphone, which will compete well around the world. Intel has been an ideal partner for developing the K900 and ensuring an outstanding user experience for our customers."

The new Intel® Atom™ processor platform ("Clover Trail+") brings Intel's classic product strengths, including high performance that lets users enjoy smooth Web browsing, vibrant, glitch-free, full HD movies, and an Android* applications experience that launches fast and runs great. The product's 2GHz dual core Intel Atom processing also features Intel® Hyper-Threading Technology, supporting four simultaneous application threads and further enhancing the overall efficiency of the Intel Atom cores and platform.

"The K900 embodies the value propositions of high-performance Intel® architecture and great battery life with Lenovo's product and design innovation," said Hermann Eul, Intel vice president and general manager of the Mobile and Communications Group. "We look forward to our continued partnership with Lenovo across a range of mobile market segments, and to working closely with them to bring the K900 smartphone experience with Intel Inside® to more consumers around the world."

K900 – Product Information

As smartphones have become ubiquitous, customer demands for "top-of-the-line" devices have increased, with design and usability growing in importance. The K900 resets the bar on these aspects. At 6.9mm, the K900 is the thinnest phone in its class by a wide margin and weighs a mere 162g, making it a device that unobtrusively slips into a jacket pocket or handbag. Made from a composite of stainless steel alloy and polycarbonate in a Unibody mold, the K900 manages to stay strong and look sharp while maintaining its slim profile.

While the K900 is certainly sleek, it does not ignore the emerging trend toward larger and clearer displays on smartphones. The K900 is one of the first smartphones in the world to combine a 5.5" IPS display with 1080p full high-definition resolution performance at 400+ pixels-per-inch, all under the latest, touch-capacitive Gorilla Glass 2. This gives the K900 supreme clarity and crispness along with plenty of space to capture the nuances of high-definition photos and video, as well as for viewing standard-size Web pages.

Lenovo K900 runs on the Intel® Atom™ Z2580 processor, a dual core chip, which runs up to 2.0 GHz and utilizes Intel® Hyper-Threading technology to boost performance efficiency. The Intel-powered device also features an Intel® Graphics Media Accelerator engine running a PowerVR SGX 544MP2 GPU, which triples graphics performance over the previous generation.³ This makes the Lenovo K900 very responsive, especially for key functions such as web-browsing, multi-tasking and application-switching.

The K900's camera stands out as one of the smartphone's most distinguished features. As with other functions on the K900, Lenovo has overhauled the camera completely, and delivered a package that is truly greater than the sum of its parts. Megapixels is the first specification that many users recognize for digital cameras, and with 13MP, the K900 ranks at the top of its class in this aspect and combines this with an industry-leading, Sony* Exmor BSI sensor for what would already be considered outstanding performance.

With the K900 though, the team has gone even further. Recognizing that customers often need to take clear, flash-less photos in low-light, Lenovo has equipped the K900 with a large aperture f1.8 lens, making it the first smartphone to offer such a wide aperture on its camera. Combined with its other specifications, the K900 is now a legitimate stand-in for a digital camera in a smartphone. In addition to these improvements to the rear camera, the front camera has also been widened to an 88-degree viewing angle, the widest available on a smartphone front camera for convenient self-photos and video calls.

The Lenovo K900 smartphone is available now or very shortly in China, India, Indonesia, Malaysia, Russia, Thailand, the Philippines and Vietnam. Additional markets will be announced in the near future. Retail price for the K900 varies by market².

For the latest Lenovo news, subscribe to Lenovo RSS feeds or follow Lenovo on Twitter and Facebook.

About Lenovo
Lenovo (HKSE: 992) (ADR: LNVGY) is a $US30 billion personal technology company – and the second largest PC company in the world, serving customers in more than 160 countries. Dedicated to building exceptionally engineered PCs and mobile internet devices, Lenovo's business is built on product innovation, a highly-efficient global supply chain and strong strategic execution. Formed by Lenovo Group's acquisition of the former IBM Personal Computing Division, the company develops, manufactures and markets reliable, high-quality, secure and easy-to-use technology products and services. Its product lines include legendary Think-branded commercial PCs and Idea-branded consumer PCs, as well as servers, workstations, and a family of mobile internet devices, including tablets and smart phones. Lenovo has major research centers in Yamato, Japan; Beijing, China; and Raleigh, North Carolina. For more information, see www.lenovo.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 IDC

2 Prices do not include tax or shipping and are subject to change without notice and is tied to specific terms and conditions. Reseller prices may vary. Price does not include all advertised features. All offers subject to availability. Lenovo reserves the right to alter product offerings and specifications at any time without notice.

3 Compared to the Intel Atom Processor Z2460 platform; Graphics clock will vary based on SKU: Z2580, Z2560, Z2520

Configurations: [describe config + what test used + who did testing]. For more information go to www.intel.com/performance

Chip Shot: Intel, Dell and Revolution Analytics Launch Big Data Analytics Center

webadmin@intel.com — Mon, 03 Jun 2013 21:03:30 GMT

Intel, Dell and Revolution Analytics announced the creation of the Big Data Innovation Center in Singapore, the first of its kind in that country. With the convergence of analytics, big data and cloud, there is an urgent need to mine intelligence based on massive sets of raw data. This center will serve as a home for data scientist training programs and a launch pad for companies to test run big data initiatives and proofs-of-concept for deployment. Housed at the Dell Solution Center, the center will use technologies and expertise from all three organizations, such as Dell infrastructure using the latest Intel® Xeon® E5 processor-based servers, the Intel® Distribution for Apache Hadoop* Software and Revolution Analytics Enterprise R predictive analytics software. Get more information.

Chip Shot: Justin Rattner Wins Industry Luminary Award

webadmin@intel.com — Mon, 03 Jun 2013 18:10:07 GMT

Intel CTO Justin Rattner has been named the winner of an Industry Luminary award for 21^st Century Industrial Innovation from the Open Innovation Strategy and Policy Group (OISPG). The special Ami de L’Europe (friend of Europe) award was presented to Rattner for “a non-European national of high eminence who has contributed very significantly to the improvement of the European Research and Innovation Ecosystem.” In addition, the OISPG presented an “Innovator’s Courage” award to Stephen Hawking and awards in six other categories. The awards were announced during the Open Innovation 2.0 conference in Dublin, Ireland. The OISPG was established by the European Commission in 2007 to support innovation policy development for open innovation in services.

Chip Shot: Intel Launches Server Board, System Products for Intel® Xeon® Processor E3-1200 V3 Family

webadmin@intel.com — Mon, 03 Jun 2013 13:59:53 GMT

Today Intel’s Enterprise Platforms and Services Division launched the Intel® Server Board S1200V3RP family of server boards and systems. These products provide boards and integrated systems support for a single Intel® Xeon® processor E3-1200 v3. The Intel® Server Board S1200V3RP “Rainbow Pass” product family is the smart entry-level server of choice for small business owners. The products are packed with features to accelerate business, eliminate IT headaches with improved reliability and manageability, and protect small business by supporting new security and redundancy features. Learn more at www.intelserveredge.com.

Chip Shot: Largest US Hack-A-Thon to Help Solve Social Challenges

webadmin@intel.com — Fri, 31 May 2013 15:25:22 GMT

This weekend at over 83 U.S. Cities, the National Day of Civic Hacking initiative will bring citizens together with government and private organizations with the common goal of improving their community through the unique application of data. The world has been madly digitizing everything from music and books to business transactions and scientific data, but we are only just beginning to understand data’s potential when put in the hands of individuals. Intel Labs is sponsoring events like this to engage and empower people to explore novel applications of their digital information. Get the fact sheet.

Unprecedented Collaboration of Business, Government and Technology Enthusiasts to Tackle Social and Civic Challenges

webadmin@intel.com — Fri, 31 May 2013 13:30:04 GMT

Events in 83 Cities will Mark National Day of Civic Hacking by Using Publicly Available Data and Entrepreneurial Thinking to Spur Innovation

Washington, D.C. – May 31, 2013 – This weekend, more than 6,000 individuals representing businesses, nonprofits, government agencies and local citizens will team up to participate in 96 events throughout the United States as part of the National Day of Civic Hacking. The effort's goal is to make people's lives better by working together to solve social challenges facing local communities.

A civic hacker is someone who uses a minimum amount of resources and a maximum amount of brainpower and ingenuity to solve a problem. Participating civic hackers will develop new solutions to old challenges – from an app that allows rural communities to track private water wells and prevent water supply contamination to developing platforms that expand access to energy consumption data.

Intel Corporation, as a headlining sponsor of National Day of Civic Hacking, is paving the way for how individuals can benefit from increased access to data and information. On June 1 and 2, in cities across the country, civic hackers, government and businesses are stepping up to the challenge of how to use technology to improve the quality of life in their communities.

"The world has been madly digitizing everything from music and books to business transactions and scientific data," said Dr. Genevieve Bell, Intel Labs Director, Interaction & Experience Research. "There is a gold mine of insight and wisdom that lies within all our digital information, but we have only begun to understand its potential when put in the hands of citizens. The National Day of Civic Hacking is critical to educating and engaging citizens in this emerging 'data society' so people can start to explore how to harness the power of digital information and share it with others to unleash new, unexpected and serendipitous opportunities."

Many of the weekend's challenges will incorporate an unprecedented amount of shared data from over 22 federal agencies including the White House Office of Digital Strategy, the White House Office of Science and Technology Policy, NASA, the Department of Labor, the Census Bureau, the National Science Foundation, the Federal Emergency Management Agency, the Peace Corps, USAID and dozens of local and state governments across the country. Civic hackers will relay this data to the general public through tools, apps and platforms that aim to make people's lives better.

"Imagine all the good that can be done by developers and other innovators with the growing troves of data the federal government has been making available – data on everything from hospital pricing to drinking water safety to natural disasters and much more," said Todd Park, Assistant to President Obama and U.S. Chief Technology Officer. "Americans paid for these data resources and deserve easy access to them, and we applaud the many innovators who are leveraging this information to create apps and services that help address key challenges, improve lives, and grow the economy."

The National Day of Civic Hacking is the largest convening of civic hackers to ever assemble and is part of a growing grassroots trend. Increasingly, savvy individuals are using their talents to tackle problems they encounter in their daily lives and see within their communities. Those responsible for driving this recent trend are not only tech professionals from Silicon Valley; they are also everyday citizens from communities across the United States who use a minimum amount of resources to create or enhance open source solutions.

As part of National Day of Civic Hacking, the foundation founded by pop icon will.i.am is hosting an event focused on engaging young people in civic hacking in Los Angeles. "Everything we can do to engage local communities, especially our young people, in technology and innovation helps us to create a stronger LA and a stronger America. I'm proud to support this amazing event in Boyle Heights, and I can't wait to see the apps and ideas that come out of it," said will.i.am.

National Day of Civic Hacking is being led by SecondMuse with organizing support from partners including: Code for America, Innovation Endeavors and Random Hacks of Kindness. The sponsors of this initiative include Intel, Edelman, CodeForGood, Rally Software, Elance and Socrata.

For more information about National Day of Civic Hacking's partners and challenges, download the fact sheet and visit www.hackforchange.org.

About Innovation Endeavors
Innovation Endeavors empowers the best and brightest to connect and launch game-changing ventures. Founded in 2010 by Dror Berman and funded by Eric Schmidt, Innovation has backed over 100 entrepreneurs and more than 50 early stage companies. Learn more at: www.innovationendeavors.com.

About SecondMuse
SecondMuse is an innovation and collaboration agency. SecondMuse co-creates prosperity by applying the art and science of collaboration to solve complex problems. Founded in 2008, SecondMuse has worked with over 300 clients around the world to co-design and co-create solutions to complex social challenges. Some examples of SecondMuse's work include: Random Hacks of Kindness, Launch, and International Space Apps Challenge. www.secondmuse.com

About Code for America
Founded in 2009, Code for America (CfA) is a nonprofit collaborating with local governments to foster and facilitate innovation. CfA is known for its fellowship program, which embeds tech and design professionals in local governments explore new approaches to resolving local challenges. Through the Accelerator, Brigade, and Peer Network programs, CfA is connecting cities with startups and volunteers, as well as each other: http://codeforamerica.org.

Intel is a trademark of Intel Corporation in the United States and other countries.

About Edelman
Edelman is the world's largest public relations firm, with 67 offices and more than 4,800 employees worldwide, as well as affiliates in more than 30 cities. Edelman was named Advertising Age's top-ranked PR firm of the decade in 2009 and one of its "A-List Agencies" in both 2010 and 2011; Adweek's "2011 PR Agency of the Year;" PRWeek's "2011 Large PR Agency of the Year;" and The Holmes Report's "2011 Global Agency of the Year" and its 2012 "Digital Agency of the Year." Edelman was named one of the "Best Places to Work" by Advertising Age in 2010 and 2012 and among Glassdoor's top ten "Best Places to Work" in 2011 and 2012. Edelman owns specialty firms Edelman Berland (research), Blue (advertising), BioScience Communications (medical communications), and agencies Edelman Significa (Brazil), and Pegasus (China). Visit http://www.edelman.com/ www.edelman.com for more information.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Capital Named Top Corporate VC

webadmin@intel.com — Tue, 28 May 2013 20:48:17 GMT

Intel Capital has been named Global Corporate Venturing’s Corporate VC Unit of the Year. The award recognized Intel Capital for high investment activity and resulting successful exits in 2012. In bestowing the award, Global Corporate Venturing specifically called out Intel Capital for its overall steadfast investment pace and global reach, calling it “unrivaled in the corporate venturing community.” Commenting on the award, Arvind Sodhani, president of Intel Capital and executive vice president of Intel Corporation, said, “This recognition validates our unique ability to help entrepreneurs scale from start-up to global corporations. As a preeminent global investor, we are focused on helping entrepreneurs with the resources, tools and know-how they need to succeed by providing access to our business development programs, global network, tech expertise, and brand capital.” Get more information.

Chip Shot: Intel Moves up to 5th on Gartner's Supply Chain Top 25

webadmin@intel.com — Thu, 23 May 2013 17:32:32 GMT

Intel improved from 7^th to 5^th on Gartner Group’s ninth annual Supply Chain Top 25. The goal of the Supply Chain Top 25 research initiative is to raise awareness of the supply chain discipline and how it impacts business. Gartner announced the findings from this year's research at the Gartner Supply Chain Executive Conference in Phoenix, Arizona. This is the fifth consecutive year Intel has been included on the list and it reflects the importance of Intel’s supply chain and the work of supply chain teams as it continues to be one of Intel’s competitive advantages in meeting the needs of our customers. Get the full Gartner list.

Chip Shot: Intel® CoFluent™ Studio 5.0 Now Available

webadmin@intel.com — Wed, 22 May 2013 17:09:08 GMT

Intel will demonstrate new Intel® CoFluent™ Studio modeling and code generation for virtual platforms and high-level synthesis at the Design Automation Conference, June 2-6 in Austin, TX. As a standards-based, electronic system-level modeling and simulation environment, it helps system designers securely predict behavior and performance in devices created for the consumer, communication, transportation and industrial segments. Intel CoFluent Studio assists developers in quickly creating device IP for hardware design automation. It also allows system designers to refine a graphical model in a top-down manner, from a functional view to a microarchitectural level to a synthesizable model, and automatically generate code for SystemC and Wind River Simics* modeling languages. To download or find more information about Intel CoFluent Studio, visit cofluent.intel.com.

Chip Shot: Intel Ethernet Pioneer to Speak

webadmin@intel.com — Tue, 21 May 2013 17:37:29 GMT

Intel’s Radia Perlman helps celebrate Ethernet’s 40^th birthday at the Ethernet Innovation Summit in Mountain View, CA. On May 22 at 9:15 am PDT, Perlman will participate in a plenary session on the technology’s early history. Perlman is the inventor of many fundamental technologies in computer networking including the spanning tree algorithm which is at the heart of today's Ethernet. Intel was one of three companies to initially promote Ethernet as a standard. Forty years later, the standard continues to help spur innovation.

Romanian Teenager Wins Big for Low-Cost, Self-Driving Car Innovation

webadmin@intel.com — Fri, 17 May 2013 18:09:56 GMT

Ionut Budisteanu of Romania Wins Top Prize at Intel International Science and Engineering Fair

NEWS HIGHLIGHTS

The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in Phoenix.
Ionut Budisteanu of Romania received the Gordon E. Moore Award, a $75,000 prize named in honor of the Intel co-founder and fellow scientist.
Two Intel Foundation Young Scientist Awards winners – Eesha Khare of Saratoga, Calif. and Henry Lin of Shreveport, La. – each received prizes of $50,000 from the Intel Foundation.

PHOENIX, May 17, 2013 – Ionut Budisteanu, 19, of Romania was awarded first place for using artificial intelligence to create a viable model for a low-cost, self-driving car at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public.

Ionut said his research addresses a major global issue. In 2004, car accidents caused 2.5 million deaths worldwide¹, and 87 percent of crashes resulted from driver error². With 3-D radar and mounted cameras, Ionut created a feasible design for an autonomously controlled car that could detect traffic lanes and curbs, along with the real-time position of the car – and it would only cost $4,000. He received the Gordon E. Moore Award of $75,000, named in honor of the Intel co-founder and fellow scientist.

Eesha Khare, 18, of Saratoga, Calif. received the Intel Foundation Young Scientist Award of $50,000. With the rapid adoption of portable electronics, Eesha recognized the crucial need for energy-efficient storage devices. She developed a tiny device, called a supercapacitor, which allows an LED to fully charge within 20-30 seconds. Eesha’s project builds on existing research in this area, and specifically aims to create an improved supercapacitor with increased energy density while maintaining power density and long life cycle. Eesha’s invention has potential applications for car batteries and cell phone batteries.³

Henry Lin, 17, of Shreveport, La. also received the Intel Foundation Young Scientist Award of $50,000. By simulating thousands of clusters of galaxies, Henry has provided scientists with valuable new data, allowing them to better understand the mysteries of astrophysics: dark matter, dark energy and the balance of heating and cooling in the universe's most massive objects.

"We support the Intel International Science and Engineering Fair because we believe that science and math are the foundation of innovation, which is imperative for global economic growth and advancing society," said Wendy Hawkins, executive director of the Intel Foundation. "This competition encourages millions of students worldwide every year to explore their passion for math and science while developing solutions for global challenges."

This year, approximately 1,600 young scientists were chosen to compete in the Intel International Science and Engineering Fair. They were selected from 433 affiliate fairs in more than 70 countries, regions and territories. In addition to the winners mentioned above, more than 500 finalists received awards and prizes for their innovative research. Awards included 17 "Best of Category" winners who each received a $5,000 prize. The Intel Foundation also awarded a $1,000 grant to each winner's school and to the affiliated fair they represent.

The following lists the 17 Best of Category winners from which the top three were chosen:

Category	First	Last	City	State/Country
Animal Sciences	Michael	Shao	Northville	Mich.
Behavioral and Social Sciences	Zarin	Rahman	Brookings	S.D.
Biochemistry	Savannah	Tobin	Salem	Ore.
Cellular and Molecular Biology	Hannah	Wastyk	Palmyra	Pa.
Chemistry	Eesha	Khare	Saratoga	Calif.
Computer Science	Ionut	Budisteanu	Ramnicu, Valcea	Romania
Earth and Planetary Sciences	Gyou	Tanaka	Mobara, Chiba	Japan
Engineering: Electrical and Mechanical	Zeyu	Liu	Calgary, Alberta	Canada
Engineering: Materials and Bioengineering	Samantha	Marquez	Midlothian	Va.
Energy and Transportation	Evie	Sobczak	St. Petersburg	Fla.
Environmental Management	Shixuan	Li	Lynn Haven	Fla.
Environmental Sciences	Naomi	Shah	Portland	Ore.
Mathematical Sciences	Vinay	Iyengar	Portland	Ore.
Medicine and Health	Jessie	MacAlpine	Woodstock, Ontario	Canada
Microbiology	David	Zimmerman	Los Angeles	Calif.
Physics and Astronomy	Henry	Lin	Shreveport	La.
Plant Sciences	Samantha	DiSalvo	Hewlett	N.Y.
	Ryan	Kenny
	Amy	Vitha

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, has owned and administered the International Science and Engineering Fair since its inception in 1950.

"We congratulate Ionut, Eesha and Henry on their success at the Intel International Science and Engineering Fair this week in Phoenix," said Elizabeth Marincola, president of Society for Science & the Public. "Their research demonstrates the value of hard work and creative thinking. All the Intel International Science and Engineering Fair finalists here this week show great promise in harnessing the power of science and innovation to solve problems and create opportunity for our global community."

The Intel International Science and Engineering Fair honors some of the world's most promising, rising student entrepreneurs, innovators and scientists. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by more than 1,200 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of 6 years of related professional experience in one of the scientific disciplines.

This is the first year that all Intel International Science and Engineering Fair finalists will receive digital badges recognizing and rewarding their achievements in independent scientific and engineering research. Volunteers, judges and interpreters will also receive badges. Digital badges promote informal modes of education and provide recognition and credentialing for achievements beyond the classroom. Learn more about the badging initiative at http://badging.societyforscience.org.

A full listing of finalists is available in the event program. The Intel International Science and Engineering Fair 2013 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations. This year, more than $4 million was awarded.

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

PHOENIX, May 17, 2013 – Top winner Ionut Budisteanu, 19, of Romania (center) with second-place winners Eesha Khare, 18, of Saratoga, Calif. (left) and Henry Lin, 17, of Shreveport, La. celebrate their awards at the Intel International Science and Engineering Fair, the world's largest high school science research competition. More than 1,600 high schoolers from 70 countries, regions and territories competed for more than $4 million in awards this week. PHOTO CREDIT: Intel/Chris Ayers

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 World report on road traffic injury prevention, WHO, 2004 (from Ionut’s research)

2 A study using British and American crash reports as data (from Ionut’s research)

3 Originally published with a factual error stating "She developed a tiny device that fits inside cell phone batteries, allowing them to fully charge within 20-30 seconds. Eesha's invention also has potential applications for car batteries." - updated June 5, 2013

Chip Shot: Lenovo Ships K900 Smartphone with Intel Inside™

webadmin@intel.com — Fri, 17 May 2013 16:18:56 GMT

Lenovo announced the general availability of K900 smartphone with Intel Inside™. The handset, based on the latest Intel® Atom™ processor Z2580 phone chip, is now available at nationwide outlets across China, and will roll out to additional international markets throughout the summer. The K900 offer a sleek, unibody design and features a 5.5-inch IPS display with full 1080p high-definition resolution performance at 400+ pixels-per-inch, along with advanced imaging capabilities and much more.

Chip Shot: Intel's 2012 CSR Report Shows Strengths in Employee Engagement and Sustainability

webadmin@intel.com — Fri, 17 May 2013 15:41:03 GMT

Intel released its 2012 Corporate Responsibility Report, which shows the company performed strongly in areas including employee engagement, environmental sustainability, supply chain systems, and education. The report also showcases the progress Intel has made toward its environmental goals for 2020, which aim to reduce the environmental impact of the company’s manufacturing processes and its products. With this year’s report, Intel has reached nearly two decades of corporate responsibility reporting and is continuing to promote transparency in its performance and actions. For more information, check out this blog.

Chip Shot: New Android* Developer Environment from Intel

webadmin@intel.com — Thu, 16 May 2013 21:24:12 GMT

As part of Intel’s ongoing support of the Android ecosystem, the company today released a new tool environment for developers of native Android applications. Codenamed Beacon Mountain, it supports Intel® Atom™ processor-based systems, including phones and tablets, that run Android Jellybean 4.2* and up. Beacon Mountain is currently available for host development on Windows*7 and 8 systems, with support for OSX* to be rolled out at a later date. Beacon Mountain contains downloads of popular Android development tools such as Intel® Hardware Accelerated Execution Manager, Intel® Threading Building Blocks, Intel® Graphics Performance Analyzers and Intel® Integrated Performance Primitives. Third-party tools include Google* Android SDK, Android NDK, Eclipse* Integrated Development Environment and more. Beacon Mountain also supports Android development on ARM* platforms. Download the development environment.

Employee Engagement and Sustainability Thrive at Intel

webadmin@intel.com — Thu, 16 May 2013 17:00:18 GMT

2012 Corporate Responsibility Report Released

NEWS HIGHLIGHTS

Employee Engagement: Intel links a portion of every employee's compensation to sustainability goals, focusing on carbon emission reductions in 2012 and waste recycling in 2013.
Environment: In 2013, Intel is increasing its green power purchases to equal 100 percent of the company's projected U.S. electricity use for the year.
Supply Chain Responsibility: Intel achieved its goal to manufacture a "conflict-free" microprocessor for the metal tantalum.
Education: Intel partnered on the "Girl Rising" film and 10x10 social action campaign, highlighting the importance of investing in the education of girls and women.

SANTA CLARA, Calif., May 16, 2013 – Intel Corporation today released its 2012 Corporate Responsibility Report, highlighting the company's performance in areas including employee engagement, environmental sustainability, supply chain systems and education. The report also showcases Intel's progress toward its 2020 environmental goals that aim to drive continuous improvement in the company's manufacturing operations and the energy efficiency of its products.

"Intel's annual Corporate Responsibility Report allows us to transparently track our progress and aggressively work toward new goals in areas ranging from supply chain responsibility to K-12 education," said Michael Jacobson, director of corporate responsibility at Intel. "Embedding corporate responsibility into our vision, strategy and management systems creates value for us, as well as our stockholders, customers and our global communities."

Building on its nearly 2 decades of reporting, Intel is continuing to promote transparency in its performance and actions. Highlights from the 2012 report include:

Employee Engagement

Since 2008, Intel has linked a portion of every employee's compensation to environmental goals, focusing on carbon emission reductions in 2012 and solid waste recycling in 2013.

Through Intel Involved, employees in 2012 donated 1.2 million hours of service to more than 5,400 schools and nonprofit organizations in 42 countries, bringing the total donated hours to more than 5 million over the past 5 years.
Twelve employee teams received Intel Environmental Excellence Awards for sustainability projects, generating more than $40 million in estimated savings in 2012 and totaling more than $200 million in savings over the past 3 years.
Through Intel's Sustainability in Action grant program, nine teams of employees received grants in 2012 for environmental projects ranging from planting a vegetable garden at a children's home in Singapore to developing a water purification system in rural India.

Renewable Power

For the past 5 years, the U.S. Environmental Protection Agency has recognized Intel as the largest voluntary purchaser of green power in the nation. In 2013, Intel will increase its green power purchases to nearly 3.1 billion kilowatt-hours (kWh), equivalent to 100 percent of the company's projected U.S. electricity use for the year and equal to the annual electricity use of more than 320,000 U.S. homes.
Since 2009, Intel has partnered with third parties to complete 18 solar installations on nine Intel campuses in the United States, Israel and Vietnam, generating more than 10 million kWh of energy per year.¹

Green Building Design and LEED Certification

As of April 2013, Intel has achieved Leadership in Energy and Environmental Design (LEED) certification for 29 new and existing buildings, with a total of more than 7.5 million square feet of floor space.

Supply Chain Responsibility

In 2012, Intel achieved its goal to manufacture a microprocessor that has been verified as "conflict-free" for the metal tantalum.
Intel ranked seventh on the 2012 "Gartner Supply Chain Top 25" list for excellence in supply chain management, up from 16th in 2011 and 18th in 2010.
Intel convened its first Supplier Sustainability Leadership Summit in China to advance supplier responsibility performance. The company also requested that its top 75 suppliers publish a Global Reporting Initiative-based report by the end of 2013 to promote greater transparency.

Education

Intel and the Intel Foundation invest approximately $100 million annually in education programs globally, including the Intel Science Talent Search and the Intel International Science and Engineering Fair, both programs of Society for Science and the Public, which reached 7 million high school students in 2012 alone.
In 2012, Intel partnered on the launch of the "Girl Rising" film and 10x10 social action campaign, which highlights the importance of investing in girls and women education.

Intel has provided public reports on its environmental, health and safety performance since 1994 and produced an annual Corporate Responsibility Report since 2001. To read the new report, visit www.intel.com/go/responsibility. More information on Intel's corporate responsibility programs can be found at the CSR@Intel blog and on Twitter.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Renewable Energy Credits generated by these installations are often transferred to local utilities to support their regulatory obligations and programs.

Intel Launches 'Experience Intel. Look Inside.'™

webadmin@intel.com — Thu, 16 May 2013 17:00:01 GMT

6-Month Global Tour to Introduce Consumers to Intel-Powered Devices

SANTA CLARA, Calif., May 16, 2013 - Intel Corporation today launched "Experience Intel. Look Inside."™, a global tour to introduce consumers to a range of cutting-edge devices based on Intel products including the Ultrabook™, thin and light laptops, tablets, all-in-ones and smartphones.

In collaboration with customers and retailers, the tour will feature a custom-built installation that will travel to cities around the globe over the next 6 months, providing guests with a variety of highly collaborative and visual interactions to experience Intel technology in new and creative ways.

Attendees will be invited to experience the newest Ultrabook convertibles, 2-in-1 Intel-inspired devices that flip, fold and swivel from laptop to tablet. Guests will also have the opportunity to play with a range of Intel-powered products, including thin and light laptops, tablets, smartphones and all-in-ones.

"We're very excited to tour the world and show consumers how the laptop has been reinvented," said Kevin Sellers, vice president of Sales and Marketing and director of Creative Services and Digital Marketing. "The industry has rallied around our vision and produced some stunning new products— including Ultrabooks that detach or convert to be both a tablet as well as full-featured PCs. When consumers touch and play with these new devices we are confident that they will be as excited about them as we are."

Launching today in New York, the "Experience Intel" tour will host some of today's most relevant artists, designers and thought leaders to create customized, cutting-edge digital interactions, all powered by the Ultrabook. The installations span art, data visualization and gaming, providing audiences with creative introductions to the Ultrabook's unique capabilities and features.

Designer Matt Pyke of Universal Everything has created an experiential design that transforms guests' drawings — completed on Ultrabooks — into a digital flock of "wings" projected on the interior walls of the installation. Additionally, The Office of Creative Research, a multi-disciplinary research group, has created custom data visualizations around the evolution of the computer, highlighting dramatic changes in speed, power and the size of computers in recent history. In addition, Hide & Seek, an independent gaming studio, has designed the first game created specifically for Ultrabook convertibles.

In each city, "Experience Intel" will host a Spotlight Series, featuring live performances and demonstrations by hyper-local, notable personalities and experts—from film, art, fashion, design, music, and more –who integrate Ultrabook technology into their work. Each day, several Ultrabooks will be given to select audience members following certain spotlight performances. Guests will also have the opportunity to receive a discount towards a new Ultrabook. In certain tour locations, e-recycling will be available to attendees to recycle their old PCs safely and responsibly.

"Experience Intel" kicks off in New York's Gansevoort Plaza on May 17 and runs through May 19. The free installation is open to the public starting at 10 a.m. all three days.

The complete global tour:

New York – May 17-19

Chicago – June 6-9

Tokyo – June 20-23

Beijing – July 11-14

London – July 11-14

Sao Paulo – Aug. 29-Sept. 1

Moscow – Sept. 6-8

Sydney – Oct. 10-13

To learn more about the "Experience Intel. Look Inside."™ visit: www.intel.com/experienceintel

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel's Mobile Insights Radio Celebrates Water Awareness Month with charity: water

webadmin@intel.com — Wed, 15 May 2013 20:58:50 GMT

Intel’s Mobile Insights Radio with Peter Biddle honored California’s Water Awareness Month with Paull Young, director of Digital for nonprofit, charity: water in talking about on the importance of safe, clean drinking water. During the show, Peter and Paull discuss the organization’s innovative efforts to bring drinking water resources to people in developing nations. Mobile Insights Radio with Peter Biddle is an online radio program that brings together a variety of perspectives to discuss the fusion of technology, life, culture and science. Hosted by Peter Biddle, an Intel engineer and executive, the program strives to take on the hottest topics in order to create a lively and thought-provoking discussion.

Chip Shot: Intel International Science and Engineering Fair Kicks Off

webadmin@intel.com — Tue, 14 May 2013 17:19:30 GMT

More than 1,600 high school students from 70 countries, regions and territories celebrated the opening of the Intel International Science and Engineering Fair last night, the world’s largest high school science research competition and a program of the Society for Science & the Public. Finalists are competing this week in Phoenix for more than $4 million in awards. Download the fact sheet for more information.

Media Alert: Young Scientists from Around the World Compete in Phoenix

webadmin@intel.com — Mon, 13 May 2013 16:00:10 GMT

Approximately 1,600 High School Students Vie for more than $4 Million


WHAT:	The world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, comes to Phoenix May 12-17. Approximately 1,600 high school students selected from 433 affiliate fairs in more than 70 countries, regions and territories will share ideas, showcase cutting-edge research and inventions, and compete for more than $4 million in awards. The full list of finalists is available in the event program (starting at page 56). At most events, Wendy Hawkins, executive director of the Intel Foundation, and Elizabeth Marincola, president of Society for Science & the Public, will be available for comment. Media must be registered to attend. To register, please reach out to the contacts listed below.
WHEN:	Public Exhibition of Projects Thursday, May 16 from 10 a.m.-2 p.m. MT This is the best opportunity for registered media to see, interview, film and photograph a broad range of students from across the country and the world. This year, research topics range from medical treatments to environmental solutions to robotic technology. Awards Ceremony Friday, May 17 from 9-11 a.m. MT Registered media are invited to attend the awards ceremony where the winners will be announced. The top prizes awarded by the Intel Foundation include the $75,000 Gordon E. Moore Award, named for the Intel co-founder and fellow scientist. Two additional top winning projects will receive Intel Foundation Young Scientist Awards of $50,000 each.
WHERE:	Phoenix Convention Center 100 N. 3rd Street
QUOTES:	"Through the Intel International Science and Engineering Fair, Intel encourages high school students around the world to explore science and math,” said Intel’s Wendy Hawkins, executive director of the Intel Foundation. “By giving the finalists a global stage, we are allowing them to share their promising research with the public – from fellow scientists to future scientists." "Finalists at the Intel International Science and Engineering Fair are dedicated, passionate and curious,” said Elizabeth Marincola, president of Society for Science & the Public. “The Intel International Science and Engineering Fair provides an opportunity for these scientists to share ideas and showcase their research. The students competing in Phoenix this year will use their creativity and intelligence to provide insights into the challenges of today and tomorrow."
MORE INFO:	To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter. To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter. PHOENIX, May 16, 2013 – Madelyn Lucas, 14, from Farmington, N.M. explained her research project on probiotics' affect on the digestive system to an eager group of middle schoolers at the Intel International Science and Engineering Fair, the world's largest high school science research competition. More than 1,600 high schoolers from 70 countries, regions and territories are competing for more than $4 million in awards this week. PHOTO CREDIT: Intel/Chris Ayers
CONTACTS:	Gail Dundas, Intel 503-264-2154, gail.dundas@intel.com Rachel Sutherland, Intel Arizona 480-552-2002, rachel.sutherland@intel.com Maria Culp, North of Nine Communications, for Intel 646-525-5654, maria.culp@nof9.com Sarah Wood, Society for Science & the Public 202-872-5110, swood@societyforscience.org

Media Alert: Intel at Computex Taipei 2013 - New Experiences Unleashed

webadmin@intel.com — Fri, 10 May 2013 04:00:06 GMT

Intel Set to Introduce 4th Generation Intel Core Processors, Usher in Era of 2-in-1 Computing


WHAT:	Intel Corporation will host a keynote and series of events at Computex Taipei 2013 to outline how the company delivers innovative computing experiences across a range of devices in strong collaboration with the IT industry. The company will also officially introduce its flagship 4th Generation Intel® Core™ processor family with amazing performance and stunning power efficiency to deliver on the company’s vision to reinvent personal computing with the Ultrabook™. Press kit materials and multimedia available at: www.intel.com/newsroom/computex
DATES:	June 4-8, 2013
WHERE:	Taipei World Trade Center (TWTC) Nangang Exhibition Hall (No. 1, Jing Mao 2^nd Road, Nangang District, Taipei) Intel Booth #M410 Taipei International Convention Center (TICC) (No. 1, Sec. 5, Hsin-Yi Road, Taipei) Computex Opening Keynote: Plenary Hall, 3F Grand Hyatt Hotel (No. 2, Sung-Show Road, Taipei) Computing Reinvented Satellite Event: Ball Room, 3F Mobile and Communications Satellite Event: Ball Room, 3F Intel Booth Guided Tour for News Media June 4, 11:00 a.m. – 12:00 p.m. Intel Booth, Nangang Exhibition Hall #M410, TWTC
MEDIA ACTIVITIES:	To request a media credential, register at http://220.135.105.245/Press2013/2013-Media-en_2.html or onsite at the 1F reception counter of the Nangang Exhibition Hall. Computex Opening Keynote June 4, 2-3 p.m. (Reception: 1:20 p.m.) Plenary Hall 3F, Taipei International Convention Center (TICC), Tom Kilroy, executive vice president and general manager, Intel's Sales and Marketing Group, will deliver a keynote on Intel's vision for continued innovation to reinvent people's computing experiences across a range of devices. To request a media credential, please register at www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or onsite at the 1F reception counter of TICC. The keynote will also be broadcast via live webcast at http://intelstudios.edgesuite.net/computex/2013/index.html Post-Keynote Media Q&A Session with Kilroy June 4, 3:15-3:40 p.m. Drawing Room, 2F, Grand Hyatt Hotel Tom Kilroy, executive vice president and general manager of Intel's Sales and Marketing Group. Computing Reinvented Satellite Event and Media Q&A June 4, 3:45-5 p.m. (Reception: 3:15 p.m.) Ball Room, 3F, Grand Hyatt Hotel Kirk Skaugen, senior vice president and general manager of the PC Client Group, will host the computing reinvented satellite event from 3:45-4:35 p.m. where he'll demonstrate and provide details on the new experiences delivered by 4th generation Intel Core processor-based Ultrabooks, laptops, desktops and all-in-one devices. A media Q&A session with the speaker will immediately follow from 4:35-5 p.m. Mobile and Communications Satellite Event and Media Q&A June 5, 12:45-1:55 p.m. (Reception: 12:15 p.m.) Ball Room, 3F, Grand Hyatt Hotel Hermann Eul, vice president and general manager, Mobile and Communications Group, will host a satellite event from 12:45-1:35 p.m. to showcase the growing number of tablets for Windows and Android, smartphones and other ultra-mobile devices with Intel Inside and share new details of Intel's next-generation technology for these devices. A media Q&A session with the speaker will immediately follow from 1:35-1:55 p.m. Computex Taipei Cloud Industry Forum June 6, 2-5 p.m. Room3, 4, 5, 2F, TWTC Exhibition Hall 1 Lisa Graff, vice president of Intel Architecture Group and general manager of Data Center Marketing Group, will speak.
MEDIA SUPPORT:	Please visit the reception counter of the Intel Exhibition Showcase at 4F, TWTC Nangang Exhibition Hall, to access the latest Intel news releases and other media materials.
MEDIA CONTACTS:	Intel Corporation: Kari Aakre, Intel PR manager (U.S.), +1-503-696-5068, kari.e.aakre@intel.com Shardae Chiu, Intel PR manager, +886-2-2544-7752, shardae.chiu@intel.com Pallas PR Agency: Jennifer Chen, Pallas PR, +886-928-179-500, jennifer@pallaspr.com.tw Elsa Chang, Pallas PR, +886-953-129-126, elsa.chang@pallasrp.com.tw
MAPS:	3F, Plenary Hall, Taipei International Convention Center (TICC) 2F, Drawing Room, Grand Hyatt Hotel 3F, Ballroom, Grand Hyatt Hotel

Intel, Intel Atom, Intel Core, Xeon, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Chip Shot: Intel Partners in Cybersecurity Center of Excellence

webadmin@intel.com — Thu, 09 May 2013 15:24:34 GMT

Intel joined the National Institute of Standards and Technology (NIST) in a National Cybersecurity Center of Excellence (NCCoE) partnership, along with 10 other industry leaders: Cisco, HP, HyTrust, McAfee, Microsoft, RSA, Splunk, Symantec, Vanguard and Venafi. The NCCoE is a unique partnership of public and private sectors created by NIST to bring the best minds together to focus on the growing problem of cybertheft. The group aims to enable shared cybersecurity best practices, tools and solutions to reduce risk and enhance trust in our national IT systems, electronic communications and transactions. According to industry surveys, in 2011 more than 174 million records were compromised in breaches and technical errors worldwide, costing businesses billions of dollars, threatening national security and undermining consumer privacy and confidence. Cybersecurity is a challenge for companies large and small, as well as private and public institutions, states and the federal government. “The complexity of the global Cybersecurity threat environment requires the best thinking and innovation of the public and private sectors to develop the open standards and best practices to address this daunting challenge,” said Dave Patterson, president of Intel Federal.

Chip Shot: Intel Expands Capabilities in Software and Services through Aepona, Mashery Acquisitions

webadmin@intel.com — Thu, 09 May 2013 15:02:53 GMT

Intel today announced the completion of two concurrent company acquisitions. Aepona is an industry leader in API exposure and monetization platforms for service providers around the world, based in Belfast, Northern Ireland. Mashery provides world class technology solution for API Management and monetization, headquartered in San Francisco, California. These services allow Independent Software Vendors (ISVs), network providers, enterprises and OEMs to securely grant access to their network resources while achieving monetization opportunities. The acquisitions are part of Intel’s efforts to build a portfolio of services that bring compelling experiences across all platforms and hardware architectures, further accelerating the delivery of integrated, cross-platform solutions. Aepona and Mashery teams will be integrated into the Intel Services Division.

Chip Shot: University of Pennsylvania Team Wins Cornell Cup for Innovative Titan Arm Project

webadmin@intel.com — Wed, 08 May 2013 20:54:09 GMT

Like something out of the new "Iron Man 3" movie, the University of Pennsylvania engineering team’s Titan Arm is a wireless and ergonomic exoskeleton system designed to provide augmented strength. The Titan Arm was developed using Intel® Atom™ processor technology and is intended for rehabilitation and therapeutic applications, as well as physically intensive occupations requiring heavy lifting. The team took first place and won $10,000 at the second annual Cornell Cup USA presented by Intel, an embedded engineering competition that challenges student design teams from universities across America to develop innovative prototypes that address real-world issues.

Chip Shot: Intel Releases SDK with OpenCL* 1.2 Support for Intel® Xeon Phi™ Coprocessors

webadmin@intel.com — Wed, 08 May 2013 16:54:24 GMT

Intel has announced the production release of the Intel® SDK for Open CL* Applications XE 2013 that launched as a beta program in December. The new SDK broadens options for developers on Intel® architecture and includes tools, optimization guides and training. The SDK helps OpenCL developers improve performance and efficiency on Intel® Xeon Phi™ coprocessors and Intel® Xeon® processors as well as create highly parallel applications for high performance computing workstations, data analytics and other uses. Download the Intel SDK for OpenCL Applications XE 2013.

Chip Shot: Katie Couric Highlights Amazing Possibilities of Intel-inspired Ultrabooks

webadmin@intel.com — Wed, 08 May 2013 16:20:22 GMT

Intel-inspired Ultrabooks were featured by Katie Couric in her daytime talk show, “Katie,” on ABC. The episode, which aired March 7, is part of a special "Katie Takes Hollywood" week. The Lenovo Yoga Ultrabook, a tablet and laptop in one device, was used to help contestants in a game show type segment with Couric, comedian Mindy Kaling and two audience members. The contest was hosted by Justin Willman of Cupcake Wars, and each contestant took home a brand new Lenovo Yoga Ultrabook. The Yoga Ultrabook wowed the audience when converting from a tablet to a laptop. At-home viewers also have the opportunity to win an Intel-inspired Ultrabook by visiting http://ktie.tv/17ItWn8.

Television personality and Cupcake Wars host Justin Willman shows Katie Couric the Intel-inspired Ultrabook, called Lenovo Yoga, and how the device is a tablet and laptop all-in-one. Willman used his Yoga Ultrabook to ask questions as he hosted a contest during Couric’s daytime talk show, “Katie.”

Katie Couric tells Justin Willman, host of Cupcake Wars, why people watching at home should think about replacing their older computer with an amazing Intel-inspired Ultrabook; great performance, light weight, and long battery life. In the background, a screen shows how the Yoga Ultrabook can convert from a laptop into a tablet.

Chip Shot: Password Day on May 7th

webadmin@intel.com — Tue, 07 May 2013 20:36:57 GMT

Intel wants to remind people everywhere to switch to more secure passwords by adding a new day to the calendar: May 7th for Password Day. Find simple tips and guides towards digital strength at intel.com/mobile-security. Over the three weeks following password day, those who pledge to change their passwords at intel.com/mobile-security will be entered to win one of three touch-enabled Ultrabook convertibles as well as the latest McAfee security software. Join us today to eradicate your vulnerable passwords!

Chip Shot: Open for Entries - Phase 2 of Intel Perceptual Computing Challenge

webadmin@intel.com — Tue, 07 May 2013 15:58:54 GMT

Phase 2 of the Intel Perceptual Computing Challenge is now open to application developers in 16 countries for the opportunity to win prizes worth more than $800,000. The competition calls on developers to use the Intel Perceptual Computing SDK to create new and innovative applications or games that integrate voice control, gesture control, facial recognition or augmented reality. Developers can submit applications in one of four categories: perceptual computing, productivity, creative user interfaces and open innovation. Submissions for Phase 2 are open until September. Enter the Intel Perceptual Computing Challenge.

Intel Launches Low-Power, High-Performance Silvermont Microarchitecture

webadmin@intel.com — Mon, 06 May 2013 17:00:27 GMT

NEWS HIGHLIGHTS:

Intel announces Silvermont microarchitecture, a new design in Intel's 22nm Tri-Gate SoC process delivering significant increases in performance and energy efficiency.
Silvermont microarchitecture delivers ~3x more peak performance or the same performance at ~5x lower power over current-generation Intel® Atom™ processor core.¹
Silvermont to serve as the foundation for a breadth of 22nm products targeted at tablets, smartphones, microservers, network infrastructure, storage and other market segments including entry laptops and in-vehicle infotainment.

SANTA CLARA, Calif., May 6, 2013 – Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.

The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

The Silvermont microarchitecture delivers industry-leading performance-per-watt efficiency.² The highly balanced design brings increased support for a wider dynamic range and seamlessly scales up and down in performance and power efficiency. On a variety of standard metrics, Silvermont also enables ~3x peak performance or the same performance at ~5x lower power over the current-generation Intel® Atom™ processor core.¹

Silvermont: Next-Generation Microarchitecture

Intel's Silvermont microarchitecture was designed and co-optimized with Intel's 22nm SoC process using revolutionary 3-D Tri-gate transistors. By taking advantage of this industry-leading technology, Intel is able to provide a significant performance increase and improved energy efficiency.

Additional highlights of the Silvermont microarchitecture include:

A new out-of-order execution engine enables best-in-class, single-threaded performance.¹
A new multi-core and system fabric architecture scalable up to eight cores and enabling greater performance for higher bandwidth, lower latency and more efficient out-of-order support for a more balanced and responsive system.
New IA instructions and technologies bringing enhanced performance, virtualization and security management capabilities to support a wide range of products. These instructions build on Intel's existing support for 64-bit and the breadth of the IA software installed base.
Enhanced power management capabilities including a new intelligent burst technology, low- power C states and a wider dynamic range of operation taking advantage of Intel's 3-D transistors. Intel® Burst Technology 2.0 support for single- and multi-core offers great responsiveness scaled for power efficiency.

"Through our design and process technology co-optimization we exceeded our goals for Silvermont," said Belli Kuttanna, Intel Fellow and chief architect. "By taking advantage of our strengths in microarchitecture development and leading-edge process technology, we delivered a technology package that enables significantly improved performance and power efficiency – all while delivering higher frequencies. We're proud of this accomplishment and believe that Silvermont will offer a strong and flexible foundation for a range of new, low-power Intel SoCs."

Architecting Across a Spectrum of Computing

Silvermont will serve as the foundation for a breadth of 22nm products expected in market later this year. The performance-per-watt improvements with the new microarchitecture will enable a significant difference in performance and responsiveness for the compute devices built around these products.

Intel's quad-core "Bay Trail" SoC is scheduled for holiday 2013 tablets and will more than double the compute performance capability of Intel's current-generation tablet offering¹. Due to the flexibility of Silvermont, variants of the "Bay Trail" platform will also be used in market segments including entry laptop and desktop computers in innovative form factors.

Intel's "Merrifield" is scheduled to ship to customers by the end of this year. It will enable increased performance and battery life over current-generation products¹ and brings support for context aware and personal services, ultra-fast connections for Web streaming, and increased data, device and privacy protection.

Intel's "Avoton" will enable industry-leading energy efficiency and performance-per-watt for microservers², storage and scale out workloads in the data center. "Avoton" is Intel's second-generation Intel® Atom™ processor SoC to provide full server product capability that customers require including 64-bit, integrated fabric, error code correction, Intel virtualization technologies and software compatibility. "Rangeley" is aimed at the network and communication infrastructure, specifically for entry-level to mid-range routers, switches and security appliances. Both products are scheduled for the second half of this year.

Concurrently, Intel is delivering industry-leading advancements on its next-generation, 22nm Haswell microarchitecture for Intel® Core™ processors to enable full-PC performance at lower power levels for innovative "2-in-1" form factors, and other mobile devices available later this year. Intel also plans to refresh its line of Intel® Xeon® processor families across the data center on 22nm technology, delivering better performance-per-watt and other features.

"By taking advantage of both the Silvermont and Haswell microarchitectures, Intel is well positioned to enable great products and experiences across the full spectrum of computing," Perlmutter said.

View the Webcast Replay - Intel Next Generation Low Power Micro-Architecture

Intel, Intel Atom, Intel Core, Xeon, and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

* Other names and brands may be claimed as the property of others.

1 Based on the geometric mean of a variety of power and performance measurements across various benchmarks. Benchmarks included in this geomean are measurements on browsing benchmarks and workloads including SunSpider* and page load tests on Internet Explorer*, FireFox*, & Chrome*; Dhrystone*; EEMBC* workloads including CoreMark*; Android* workloads including CaffineMark*, AnTutu*, Linpack* and Quadrant* as well as measured estimates on SPECint* rate_base2000 & SPECfp* rate_base2000; on Silvermont preproduction systems compared to Atom processor Z2580. Individual results will vary. SPEC* CPU2000* is a retired benchmark. *Other names and brands may be claimed as the property of others.

2 Based on a geometric mean of the measured and projected power and performance of SPECint* rate_base2000 on Silvermont compared to expected configurations of main ARM*-based mobile competitors using descriptions of the architectures; assumes similar configurations. Numbers may be subject to change once verified with the actual parts. Individual results will vary. SPEC* CPU2000* is a retired benchmark; results are estimates. *Other names and brands may be claimed as the property of others.

Chip Shot: Intel 'PUSH for Ultrabook' Super-Sizes a Classic Arcade Game

webadmin@intel.com — Fri, 03 May 2013 15:32:45 GMT

How does Intel engage on-line audiences with a game in a crowded gaming market? By taking the game out of the virtual world and building it in the real one. New PUSH for Ultrabook has a fun and engaging retro-appeal, familiar to anyone who’s spent time in an arcade. For players in this game, that means "dropping" their name could literally win them an Ultrabook. For details, watch the teaser and then give it a try yourself.

Intel Board Elects Brian Krzanich as CEO

webadmin@intel.com — Thu, 02 May 2013 13:00:03 GMT

Renée James Elected President

SANTA CLARA, Calif., May 2, 2013 – Intel Corporation announced today that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. Krzanich will assume his new role at the company’s annual stockholders’ meeting on May 16.

Krzanich, Intel’s chief operating officer since January 2012, will become the sixth CEO in Intel’s history. As previously announced, Otellini will step down as CEO and from the board of directors on May 16.

“After a thorough and deliberate selection process, the board of directors is delighted that Krzanich will lead Intel as we define and invent the next generation of technology that will shape the future of computing,” said Andy Bryant, chairman of Intel.

“Brian is a strong leader with a passion for technology and deep understanding of the business,” Bryant added. “His track record of execution and strategic leadership, combined with his open-minded approach to problem solving has earned him the respect of employees, customers and partners worldwide. He has the right combination of knowledge, depth and experience to lead the company during this period of rapid technology and industry change.”

Krzanich, 52, has progressed through a series of technical and leadership roles since joining Intel in 1982.

“I am deeply honored by the opportunity to lead Intel,” said Krzanich. “We have amazing assets, tremendous talent, and an unmatched legacy of innovation and execution. I look forward to working with our leadership team and employees worldwide to continue our proud legacy, while moving even faster into ultra-mobility, to lead Intel into the next era.”

The board of directors elected Renée James, 48, to be president of Intel. She will also assume her new role on May 16, joining Krzanich in Intel’s executive office.

"I look forward to partnering with Renée as we begin a new chapter in Intel’s history," said Krzanich. "Her deep understanding and vision for the future of computing architecture, combined with her broad experience running product R&D and one of the world’s largest software organizations, are extraordinary assets for Intel.”

As chief operating officer, Krzanich led an organization of more than 50,000 employees spanning Intel’s Technology and Manufacturing Group, Intel Custom Foundry, NAND Solutions group, Human Resources, Information Technology and Intel’s China strategy.

James, 48, has broad knowledge of the computing industry, spanning hardware, security, software and services, which she developed through leadership positions at Intel and as chairman of Intel’s software subsidiaries -- Havok, McAfee and Wind River. She also currently serves on the board of directors of Vodafone Group Plc and VMware Inc. and was chief of staff for former Intel CEO Andy Grove.

Additional career background on both executives is available at newsroom.intel.com.

View the Multimedia Press Kit
(includes the full story with high resolution photos, and more)

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: What if Cars Could Talk? How Technology Can Make Driving Safer

webadmin@intel.com — Wed, 01 May 2013 21:29:59 GMT

How many car accidents are avoidable? Potentially all of them. This new TED Talk by Jennifer Healey, a research scientist at Intel, paints the picture of a not-so-far-away world without accidents. Cars will soon be able to share data with each other about their position and velocity and use predictive models to calculate the safest routes for everyone on the road. The days of talking cars are closer than the Jetsons would suggest.

Chip Shot: Intel Awards LIVE! With Kelly and Michael "Top Teachers" with New Ultrabooks and Tablets

webadmin@intel.com — Wed, 01 May 2013 15:51:54 GMT

This week, Intel participated in the fourth annual LIVE! With Kelly and Michael' "Top Teacher Week" program which honors school teachers across the U.S. Intel gifted two "Top Teacher" finalists with cutting-edge technology for their entire classrooms. On Monday, Intel awarded Rick Zano of Princess Anne High School in Virginia Beach, Virginia with 30 Intel Atom-powered Lenovo ThinkPad 2 Tablets for his classroom. These thin and light tablets feature all-day battery life and always-on connectivity. On Tuesday, Intel awarded Kathy Green from Summerville Elementary School in Summerville, South Carolina with 30 Intel-Inspired Toshiba Satellite U925T Ultrabook Convertibles for her classroom. This 3.2 pound Ultrabook easily converts from laptop to tablet. Intel is committed to advancing education and transforming the lives of millions by providing the tools and resources necessary to bring 21st century learning into each and every classroom.

Chip Shot: Intel Capital Portfolio Company ASPEED Celebrates Initial Public Offering

webadmin@intel.com — Tue, 30 Apr 2013 16:08:33 GMT

Intel Capital congratulates ASPEED Technology Inc. (5274: Taiwan) on its initial public offering (IPO) on the GreTai Securities Market (GTSM) in Taiwan. Intel Capital invested in Aspeed in 2011 with the goal of helping the company grow its leadership within the semiconductor ecosystem. ASPEED used the investment to expand its research and development team and extend the company’s marketing programs. This IPO marks another successful collaboration between Intel Capital and the IT industry in Taiwan and is Intel Capital’s first portfolio company IPO this year. For more information view the release.

Chip Shot: 4th Generation Intel® Core™ Processors Coming Soon

webadmin@intel.com — Fri, 26 Apr 2013 15:00:37 GMT

In approximately 3,337,200,000,000,000 nanoseconds, Intel will reveal all there is to know about the highly anticipated 4th generation Intel® Core™ processor family. The new family of processors will surpass old technology expectations and usher in a host of striking new designs with incredible performance and extraordinarily long battery life. Stay tuned to the Intel Newsroom for more information as we get closer to the big day.

Chip Shot: Sixense Studios Wins Ultimate Coder Challenge - Going Perceptual

webadmin@intel.com — Wed, 24 Apr 2013 19:11:20 GMT

The results of the second Ultimate Coder Challenge: Going Perceptual are in and Sixsense Studios won the title of “Ultimate Coder.” Seven developer teams competed to create the “ultimate app” using the Lenovo Yoga Ultrabook™ and the Intel Perceptual Computing SDK to showcase cutting edge Perceptual Computing technology. Sixense was chosen for its “Puppet in Motion” entry, an interactive storytelling app that uses natural hand gestures and voice-driven menus to enable children and families to control virtual puppets on the screen, creating their own imaginative stories. For more information, check out the Ultimate Coder Challenge: Going Perceptual portal.

Chip Shot: Intel Tops Forbes' "America's Most Reputable Companies"

webadmin@intel.com — Wed, 24 Apr 2013 18:43:53 GMT

Today Intel ranked #2 on Forbes’ List of “America’s Most Reputable Companies,” up from #30 in 2012. View the full list here. Forbes, in conjunction with the Reputation Institute, surveyed nearly 5,000 consumers on their perceptions of the 150 largest companies. Intel has an active and transparent commitment to corporate responsibility, including its work in education, environment, and community engagement through volunteerism.

Chip Shot: Intel® Solid-State Drive 910 Series Certified for VMware

webadmin@intel.com — Wed, 24 Apr 2013 17:19:00 GMT

The Intel® Solid-State Drive 910 Series adds VMware certification to a long list of desirable features, assuring solution support from the two providers. Now, VMware servers can obtain greater hypervisor guest scalability taking advantage of the 910’s 2000 MB/s and 180k IOPS throughput versus a few hundred IOPS from high rpm hard drives. With the 910’s greater storage throughput, today’s VMware servers can scale for tomorrow’s virtualization workloads by achieving higher CPU utilization, reducing the need to deploy additional servers. Intel SSD 910 Series certification by VMware was initiated from customer demand and achieved through joint company collaboration. To find out more about the 910 Series, please visit the product page.

Chip Shot: Intel® Solid-State Drive 335 Series Adds 80GB Model

webadmin@intel.com — Tue, 23 Apr 2013 17:23:57 GMT

The Intel® Solid-State Drive (SSD) 335 Series is adding a new 80 gigabyte (GB) capacity version to its current 180GB and 240GB product offerings. All capacities are available in a standard 2.5-inch form factor. As with the recently announced 180GB model, the 80GB drive will be offered in a new case design. Current pricing and availability is available from resellers or online retailers. Visit the Intel Solid-State Drive press kit for information.

Chip Shot: Out With the Old, In With the New: Time to Refresh Your PC

webadmin@intel.com — Tue, 23 Apr 2013 15:15:01 GMT

You've changed with the times. Has your PC? Did you know 33 percent of U.S. computers are over 4 years old and 65 percent of them are large desktops? These computers are often big, bulky and slow. PCs today look and act differently than their 4-year-old predecessors. They’re three times faster, half the weight, boast double the battery life, and boot up in less than 7 seconds. Not sure if it is time to upgrade your PC? Check out the latest PC buyers guide to find a new device that is right for you.

Chip Shot: Intel Science Fair Honorees at the White House

webadmin@intel.com — Mon, 22 Apr 2013 19:27:44 GMT

Today seven Intel science competition finalists are participating in the White House Science Fair: Jack Andraka, Easton LaChapelle, Caleb Meyer, Naethan Mundkur, Sara Volz, Megan Waples and Brittany Wenger. Like the White House, Intel’s science competitions, the Intel Science Talent Search and the Intel International Science and Engineering Fair, programs of Society for Science & the Public, aim to encourage bright, young innovators and challenge youth to engage in math and science. Learn more at the Intel Education press kit.

Etisalat Misr and Intel Introduce Smartphone for Egyptian Consumers

webadmin@intel.com — Mon, 22 Apr 2013 18:59:47 GMT

Etisalat E-20 is First Smartphone in Middle East & North Africa Region with Intel Inside®

CAIRO, April 22, 2013 - Etisalat Misr, one of the leading telecom operators in Egypt, today announced the Etisalat E-20 smartphone with Intel Inside®, the first in the Middle East and North Africa region.The Etisalat E-20 smartphone is targeted at the growing number of smartphone buyers in Egypt who do not want to sacrifice device performance or user experience. With more than 91 million mobile subscribers¹ and mobile penetration that has increased to 116.94 percent¹ in Egypt in the last year (representing an annual growth rate of 14.19 percent compared to 2011)¹, Intel and Etisalat Misr see this as good growth for Smartphone business potential in Egypt.

The handset will be available at all Etisalat stores across Egypt, and is equipped with the Intel® Atom™ Z2420 processor with Intel® Hyper-Threading Technology that can achieve speeds of up to 1.2 GHz. The powerful device offers consumers fast Web browsing, impressive multimedia capabilities and a great Android* applications experience. The Intel® Atom™ Z2420 processor brings Intel's classic product strengths and impressive performance to the value segment of the smartphone market. It enables a smooth and responsive user experience, which includes support for 1080p HD video capture, and a camera with advanced imaging capabilities, including burst mode that allows people to capture seven pictures in a second in 5-megapixel quality.

"Our new E-20 smartphone is yet another breakthrough for Etisalat Misr as a market leader in offering the latest technology to its customers" stated Saeed Al Hamli, Etisalat Misr CEO. He added, "We always strive to partner with the best, and this is why we chose Intel to provide this superior processor for our phone. We are optimistic about this partnership, and believe it will be fruitful for both of us."

"We are delighted to partner with Etisalat Misr to bring first smartphone with Intel Inside® to Egyptian consumers," said Mike Bell, vice president and general manager of Intel's Mobile and Communications Group. "The new handset will extend the rich capabilities and benefits of Intel technology to more smartphone users around the world and we believe that Egyptian consumers will welcome the overall value and functionality of the device."

"Today's announcement builds on Intel's growing device portfolio worldwide," said Aysegul Ildeniz, Intel regional director of the Middle East Turkey and Africa region. "Intel has been collaborating with worldwide customers from around the world to address the growing demands of consumers seeking smartphones with higher performance capabilities, which is why we are so excited to introduce the first Intel-based smartphone in Middle East and North Africa region with Etisalat."

The device is housed in a compact design and features a 3.5-inch touchscreen display for crisp text and images, support for FM radio and an expandable memory slot for greater flexibility, and HSPA+ modem support with Intel's XMM 6265 modem for global roaming.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

About Etisalat
Etisalat Misr is a subsidiary of Emirati Etisalat Group. It started its operation in Egypt in 2007, and in a very short time, was able to become an important market player. It is leading the Egyptian market with its innovative products and services, and has had major milestones.

1 Source: The Egyptian Ministry of Communication and Information Technology - MCIT

Chip Shot: Intel and Oregon Health & Science University Join to Fight Cancer with HPC

webadmin@intel.com — Mon, 22 Apr 2013 17:57:10 GMT

Today, Intel and Oregon Health & Science University (OHSU) announced a strategic collaboration to use high-performance computing technologies in fighting cancer. While analyzing the individual human genome and finding the root cause of a patient’s disease is possible today, detecting patterns based on hundreds of thousands of cases that would allow cancer treatment for every patient even before it shows its presence requires massive amounts of both data and compute capacity. Eric Dishman, general manager of Intel’s Health Strategy and Solutions group, discusses the Intel-OHSU collaboration in his blog while Gans Srinivasa, senior principal engineer at Intel, is working to find an answer to whether next-generation computing may lead to precise cancer treatments. Dr. Joe Gray from OHSU also provides his view on how extreme scale computing may help to explore solutions for the most challenging problems in delivering personalized medicine to treat complex diseases.

Chip Shot: Renée James Selected as Recipient of C200's STEM Innovator Luminary Award

webadmin@intel.com — Thu, 18 Apr 2013 16:31:38 GMT

Renée J. James, Intel executive vice president and general manager of the Software and Services Group, has earned the prestigious honor of being the recipient of the STEM Innovator Luminary Award, presented by the Committee of 200 (C200). C200 is an international, non-profit organization of the most powerful women who own or run companies, or who lead major divisions of large corporations. A STEM Innovator is the leader of a technology-based business who has exemplified unique vision and success in science, technology, engineering or math-based industries, which James has continually demonstrated throughout her career at Intel. This includes growing Intel’s software and services business worldwide, driving open standards within the software ecosystem and providing leadership as chairman for both McAfee and Wind River Systems, Intel wholly owned subsidiaries.

Intel, 10x10 Announce New Efforts to Empower Girls, Transform Developing Economies through Education

webadmin@intel.com — Thu, 18 Apr 2013 14:00:01 GMT

NEWS HIGHLIGHTS

Intel and the 10x10 campaign, partners on the new feature film "Girl Rising," will develop policy frameworks with local leaders aimed at achieving gender equity in education and accelerating economic development.
Workshops will be held in low- and middle-income countries with the end goal of developing regional policy frameworks that will empower girls and achieve gender equity in education.
Each year of secondary schooling increases a girl's future wages by 10 to 20 percent. At the national level, increasing the share of women with secondary education by just 1 percent increases a country's annual GDP by an average of .3 percent.

WASHINGTON, D.C., April 18, 2013 – Intel Corporation and the 10x10 campaign, partners on the new feature film "Girl Rising," today announced they will work with policymakers in low- and middle-income countries to develop transformative education and technology policies that empower women, achieve gender equity in access to quality education and accelerate economic development.

Together, Intel and 10x10 will develop and host gender equity and education policy workshops, and develop regional policy frameworks based on key gender needs. The workshops will help governments think deeply about issues of gender equity as they develop national policy plans for broader education transformation.

According to the Council on Foreign Relations report, "What Works in Girls' Education," each year of secondary schooling increases a girl's future wages by 10 to 20 percent. At the national level, increasing the share of women with secondary education by just 1 percent increases a country's annual GDP by an average of .3 percent. Yet studies from the United Nations and International Labour Organization show that in 2009, girls accounted for 53 percent of all out-of-school children and 87 million women were unemployed in 2010, up from 76 million in 2007.

Underscoring the humanitarian and economic imperative of improving access to quality education for girls and women around the world, Intel and 10x10 will join U.N. Secretary-General Ban Ki-moon, World Bank President Jim Yong Kim and actress Freida Pinto for a "Girl Rising" rally today at World Bank headquarters. Directed by Academy Award nominee Richard Robbins, the film spotlights the stories of nine girls born into unforgiving circumstances, delivering a single message: Educating girls in developing nations will change the world.

"We've seen first-hand the transformational change that can occur when girls have access to an education," said Shelly Esque, vice president of Intel's Corporate Affairs Group and president of the Intel Foundation. "By working with 10x10 and policymakers to improve gender equity in education, Intel is taking the vital message of 'Girl Rising' into action. Together, we can empower girls and help them become agents of positive change in their communities."

"By sharing the personal stories of these nine girls, 'Girl Rising' illustrates just how important education is in the movement to empower women and girls," said Holly Gordon, 10x10's executive director. "Our partnership with Intel to provide decision makers in developing countries with scalable policy solutions to expand gender equity in education marks the next step in our commitment to change both minds and policy to positively impact girls' lives."

"Improving access to education for girls is a critical step in our efforts to end poverty and improve the lives of people around the world," said Elizabeth King, the World Bank's education director. "Good quality education helps unlock the potential of girls and women everywhere, and has enormous benefits for them and broader society. We in the development community can help by sharpening the technical tools and knowledge to design and implement better policies and programs to get girls to school, keep them safe, and support their learning."

Countries with less gender inequality in education and employment have lower levels of child mortality, more transparent businesses and faster economic growth, according to the World Bank report, "Engendering Development: Through Gender Equality in Rights, Resources and Voice."

Through the policy workshops, Intel and 10x10 will help leaders determine how to utilize technology to facilitate gender equity across school policy, curriculum and assessment, teacher development, and research and evaluation. These efforts will build on Intel's existing policy framework, which leverages education policy and information and communications technologies (ICTs) to create mechanisms for empowering girls and achieving gender equity in education at scale.

About Intel's Girls and Women Commitment
Today, millions of girls around the world have little or no access to education. Intel believes that education should be a fundamental right for everyone and recognizes the major role technology plays in improving both the quality of and access to education. Through access to technology, scholarships and community learning programs, Intel provides girls and women with opportunities for quality education and personal growth.

About 10x10
10x10 was founded by award-winning journalists at the Documentary Group and Vulcan Productions, along with strategic partner, Intel Corporation. 10x10 is built on a foundation of partnerships with NGOs, corporations, policy makers, and grassroots organizations – all working to change minds, lives, and policy. 10x10’s coalition of NGO partners include a high-impact network of champions and leaders in girls’ education. These organizations provide life-changing services to girls every day, and are among the best practitioners of their kind. They include: A New Day Cambodia, CARE USA, Girl Up/UN Foundation, Partners in Health, Plan International USA, Room to Read, and World Vision.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Accelerates Data Center Network Transformation

webadmin@intel.com — Wed, 17 Apr 2013 18:17:02 GMT

Today at the Open Networking Summit, Rose Schooler, vice president of the Intel Architecture Group and general manager of the Communications and Storage Infrastructure Group announced the Intel® Open Network Platform, introducing several hardware and software tools aimed at boosting data center networking efficiency and performance. During her keynote, Schooler discussed how using standard x86 servers and programmable switches to deploy and manage virtualized networking infrastructure with software-defined networking will radically lower costs and enable data center and telecom networks to deploy new services. To see how software-defined networking and Intel's network function virtualization as complementary networking technologies are poised to transform the way networks are designed, deployed and managed across data center and telecom infrastructure environments, watch this video.

Intel Accelerates the Data Center and Telecom Network Transformation with New Reference Architectures

webadmin@intel.com — Wed, 17 Apr 2013 16:29:54 GMT

Reference Designs Built to Improve the Flexibility and Economics of Networks

NEWS HIGHLIGHTS

Using standard x86 servers and programmable switches to deploy and manage virtualized networking infrastructure with software-defined networking will radically lower costs and enable datacenter and telecom networks to deploy new services.
Intel announces several hardware and software tools aimed to boost data center networking efficiency and performance, including Intel® Open Network Platform Switch and Intel® Open Network Platform Server reference designs and Intel® Data Plane Development Kit Accelerated Open vSwitch.
Several ISVs, OEMs and service providers including Big Switch Network*, HP*, NEC*, NTT Data*, Quanta*, Super Micro, VMware* and Vyatta* (a Brocade company) are building innovative solutions based on new Intel reference architectures.

SANTA CLARA, Calif., April 17, 2013 – Three strategic reference architectures that will enable the IT and telecom industries to accelerate hardware and software development for software-defined networking (SDN) and network function virtualization (NFV) were announced today by Intel Corporation at the Open Networking Summit conference.

These reference architectures, aimed for the telecommunications, cloud data center and enterprise data center infrastructure market segments, combine open standards for SDN and NFV with industry-leading Intel hardware and software to enable networks to be more agile and intelligent so they can adapt to changing market dynamics. Integrating SDN and NFV on standard x86 platforms allows lowering the acquisition and management costs as well as enabling new innovative services never before possible in networking infrastructure.

"SDN and NFV are critical elements of Intel's vision to transform the expensive, complex networks of today to a virtualized, programmable, standards-based architecture running commercial off-the-shelf hardware," said Rose Schooler, vice president of Intel Architecture Group and general manager of Intel's Communications and Storage Infrastructure Group. "The reference designs announced today enable a new phase in the evolution of the network and represent Intel's commitment to driving an open environment that fosters business agility and smart economics."

Data centers and network infrastructure providers are under constant pressure to support new, revenue-generating services in the public and private cloud, yet the costs of building the infrastructure are often too high to do so. The reference designs and development kits are an important part of Intel's strategy to enable the industry to move toward open, standards-based technologies such as SDN and NFV. In doing so, telecommunications and cloud service providers will be better able to reduce capital and operating expenses while also delivering new services for revenue growth.

SDN and NFV are complementary networking technologies poised to transform how networks are designed, deployed and managed across data center and telecom infrastructure environments. By separating control and data planes, SDN allows the network to be programmed and managed externally at much larger and more dynamic scale for better traffic control across the entire datacenter. NFV allows service providers to virtualize and manage networking functions such as firewall, VPN or intrusion detection service as virtual applications running on a high-volume x86-based server.

Many ISVs, OEMs and service providers are building innovative solutions on top of Intel's switch reference architecture, including ATT Foundry*, Big Switch Network*, Chunghwa Telecom*, HP*, NEC*, NTT Data*, Quanta*, Super Micro and VMware*.

"By decoupling the network from underlying hardware and enabling a new network architecture based on industry-standard x86 technology, network virtualization can transform the operational model of networking to help customers dramatically lower operational and capital expenses," said Allwyn Sequeira, vice president, Networking and Security, VMware. "VMware and Intel have built a strong relationship driving server virtualization on x86 platforms, and we are pleased to be working together to continue this transformation through network virtualization to enable the software-defined data center."

"We share Intel's vision of enabling the network transformation with SDN and NFV across the telecom industry," said Atsuo Kawamura, General Manager Telecom Carrier Business Unit, 1st Carrier Services Division, NEC Corporation. "We are excited to work with Intel to design with the Intel DPDK Accelerated Open vSwitch into our virtual Evolved Packet Core to deliver industry leading packet throughput and performance on Intel architecture."

The Intel® Open Network Platform Switch Reference Design

Codenamed "Seacliff Trail," the Intel® Open Network Platform (ONP) Switch Reference Design is based on scalable Intel processors, Intel® Ethernet Switch 6700 series and Intel® Communications Chipset 89xx series, and is available now. The ONP Switch Reference Design will include Wind River Open Network Software (ONS), an open and fully customizable network switching software stack using Wind River Linux. Wind River ONS allows for key networking capabilities such as advanced tunneling as well as modular, open control plane and management interface supporting SDN standards such as OpenFlow and Open vSwitch. Common, open programming interfaces allow for automated network management, and coordination between the server switching elements and network switches enabling more cost-effective, secure, efficient and extensible services.

The Intel® Data Plane Development Kit (Intel® DPDK) Accelerated Open vSwitch

Network architectures have traditionally been optimized for large packet throughput to meet the needs of enterprise end-point applications. Intel is executing a project aimed at improving small packet throughput and workload performance that can be achieved on the Open vSwitch using the Intel DPDK. Intel is specifically re-creating the kernel forwarding module (data plane) to take advantage of the Intel® DPDK library. The Intel® DPDK Accelerated Open vSwitch is planned to initially be released with the Intel® ONP Server Reference Design in the third quarter of this year.

The Intel® Open Network Platform Server Reference Design

This server reference platform, codenamed "Sunrise Trail," is based on the Intel® Xeon® processor, Intel 82599 Ethernet Controller and Intel Communications Chipset 89xx series. The ONP Server Reference Design enables virtual appliance workloads on standard Intel architecture servers using SDN and NFV open standards for datacenter and telecom. Wind River Open Network Software includes an Intel DPDK Accelerated Open vSwitch, fast packet acceleration and deep packet inspection capabilities, as well as support for open SDN standards such as OpenFlow, Open vSwitch and OpenStack. The project is in development now: the first alpha series is slated to be available in the second half of this year.

Intel, the Intel logo and Intel Xeon are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Reports First-Quarter Revenue of $12.6 Billion

webadmin@intel.com — Tue, 16 Apr 2013 20:01:10 GMT

SANTA CLARA, Calif., Apr. 16, 2013 – Intel Corporation today reported first-quarter revenue of $12.6 billion, operating income of $2.5 billion, net income of $2.0 billion and EPS of $0.40. The company generated approximately $4.3 billion in cash from operations, paid dividends of $1.1 billion, and used $533 million to repurchase 25 million shares of stock.

"Amidst market softness, Intel performed well in the first quarter and I'm excited about what lies ahead for the company," said Paul Otellini, Intel president and CEO. "We shipped our next generation PC microprocessors, introduced a new family of products for micro-servers and will ship our new tablet and smartphone microprocessors this quarter. We are working with our customers to introduce innovative new products across multiple operating systems. The transition to 14nm technology this year will significantly increase the value provided by Intel architecture and process technology for our customers and in the marketplace."

Q1 Key Financial Information and Business Unit Trends

PC Client Group revenue of $8.0 billion, down 6.6 percent sequentially and down 6.0 percent year-over-year.
Data Center Group revenue of $2.6 billion, down 6.9 percent sequentially and up 7.5 percent year-over-year.
Other Intel® Architecture Group revenue of $1.0 billion, down 3.9 percent sequentially and down 9.0 percent year-over-year.
Gross margin of 56 percent, down 2 percentage points sequentially and down 8 percentage points year-over-year.
R&D plus MG&A spending of $4.5 billion, in line with the company's expectation of approximately $4.6 billion.
Tax rate of 16 percent.

Business Outlook

Intel's Business Outlook does not include the potential impact of any business combinations, asset acquisitions, divestitures or other investments that may be completed after April 16.

Q2 2013

Revenue: $12.9 billion, plus or minus $500 million.
Gross margin percentage: 58 percent, plus or minus a couple percentage points.
R&D plus MG&A spending: approximately $4.7 billion.
Amortization of acquisition-related intangibles: approximately $70 million.
Impact of equity investments and interest and other: approximately zero.
Depreciation: approximately $1.7 billion.

Full-Year 2013

Revenue: low single-digit percentage increase, unchanged from prior expectations.
Gross margin percentage: 60 percent, plus or minus a few percentage points, unchanged from prior expectations.
R&D plus MG&A spending: $18.9 billion, plus or minus $200 million, unchanged from prior expectations.
Amortization of acquisition-related intangibles: approximately $300 million, unchanged from prior expectations.
Depreciation: $6.8 billion, plus or minus $100 million, unchanged from prior expectations.
Tax Rate: approximately 27 percent for each of the remaining quarters of the year.
Full-year capital spending: $12.0 billion, plus or minus $500 million, down $1.0 billion from prior expectations.

For additional information regarding Intel's results and Business Outlook, please see the CFO commentary at: www.intc.com/results.cfm.

Status of Business Outlook

Intel's Business Outlook is posted on intc.com and may be reiterated in public or private meetings with investors and others. The Business Outlook will be effective through the close of business June 14 unless earlier updated; except that the Business Outlook for amortization of acquisition-related intangibles, impact of equity investments and interest and other, and tax rate, will be effective only through the close of business on April 23. Intel's Quiet Period will start from the close of business on June 14 until publication of the company's second-quarter earnings release, scheduled for July 17, 2013. During the Quiet Period, all of the Business Outlook and other forward-looking statements disclosed in the company's news releases and filings with the SEC should be considered as historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.

Financial Comparison
Quarterly
	Q1 2013	Q4 2012	vs. Q4 2012
Revenue	$12.6 billion	$13.5 billion	down 7%
Gross Margin	56.2%	58.0%	down 1.8 pts.
Operating Income	$2.5 billion	$3.2 billion	down 20%
Net Income	$2.0 billion	$2.5 billion	down 17%
Earnings Per Share	40 cents	48 cents	down 17%

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company's expectations.

Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; customer acceptance of Intel's and competitors' products; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel's response to such actions; and Intel's ability to respond quickly to technological developments and to incorporate new features into its products.
The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments. The majority of our marketable equity security portfolio balance is concentrated in ASML Holding, N.V, and declines in value could result in impairment charges, impacting gains or losses on equity securities.
Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
Intel's results could be affected by the timing of closing of acquisitions and divestitures.
Intel's current chief executive officer plans to retire in May 2013 and the Board of Directors is working to choose a successor. The succession and transition process may have a direct and/or indirect effect on the business and operations of the company. In connection with the appointment of the new CEO, the company will seek to retain our executive management team (some of whom are being considered for the CEO position), and keep employees focused on achieving the company's strategic goals and objectives.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel's ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

A detailed discussion of these and other factors that could affect Intel's results is included in Intel's SEC filings, including the company's most recent report on Form 10-K.

Earnings Webcast

Intel will hold a public webcast at 2 p.m. PDT today on its Investor Relations website at www.intc.com. A webcast replay and MP3 download will also be available on the site.

Intel plans to report its earnings for the second quarter of 2013 on July 17, 2013. Immediately following the earnings report, the company plans to publish a commentary by Stacy J. Smith, executive vice president, chief financial officer, and director of corporate strategy, at www.intc.com/results.cfm. A public webcast of Intel's earnings conference call will follow at 2 p.m. PDT at www.intc.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Shines On Best Corporate Citizens Ranking

webadmin@intel.com — Fri, 12 Apr 2013 17:50:48 GMT

This week, Intel ranked fifth on Corporate Responsibility Magazine’s "100 Best Corporate Citizens 2013" list. Intel was selected for its strong corporate citizenship within areas including environment, employee relations and philanthropy. Learn more about Intel’s sustainability initiatives.

Chip Shot: Eric Dishman TED Talk - Healthcare is a Team Sport

webadmin@intel.com — Fri, 12 Apr 2013 16:09:58 GMT

In today's featured TED Talk, Intel Fellow and GM Eric Dishman calls into question our current approach to healthcare. In college he suffered a fainting spell and ended up in the hospital. He was diagnosed with a rare kidney disease and given only a few years to live. But for 25 years his rare disease was wrongly diagnosed. And it took a genomic test to put his doctors on the right course and a coworker he had never met to save his life – by giving him the kidney he never thought his body could accept. He discusses how he took his future into his own hands and learned all he could about his illness and his options, refusing to be a "passive" patient. Enjoy this powerful and insightful TED talk.

Chip Shot: Intel® Silicon Photonics Demonstrated at 100 Gbps

webadmin@intel.com — Thu, 11 Apr 2013 15:00:37 GMT

Intel CTO Justin Rattner has for the first time publicly demonstrated a fully functional silicon photonics module incorporating Intel® Silicon Photonics Technology and operating at 100 gigabits per second. This is a completely integrated module that includes silicon modulators, detectors, waveguides and circuitry. Intel believes this is the only module in the world that uses a hybrid silicon laser. The demonstration was made via a video during Rattner’s keynote at the Intel Developer Forum in Beijing. Earlier this year, Rattner and Silicon Valley luminary Andy Bechtolsheim discussed this technology.

Chip Shot: Intel Expands Support of HTML5 with Launch of App Development Environment

webadmin@intel.com — Thu, 11 Apr 2013 02:00:01 GMT

At IDF Beijing, Intel launched the Intel® HTML5 Development Environment that provides a cross-platform environment to develop, test and deploy applications that can run across multiple device types and operating system environments as well as be available in various application stores. Based on web standards and supported by W3C, HTML5 makes it easier for software developers to create applications once to run across multiple platforms. Intel continues to invest in HTML5 to help mobile application developers lower total costs and improve time-to-market for cross-platform app development and deployment. Developers can access the Intel HTML5 Development Environment from the Intel® Developer Zone at no cost.

Intel Developer Forum: Transforming Computing Experiences from the Device to the Cloud

webadmin@intel.com — Wed, 10 Apr 2013 01:01:29 GMT

Company Accelerates Expansion of 22nm Data Center Processor Families; Graphics Innovations, Intel® Wireless Display Coming to Next-Generation Ultrabooks

NEWS HIGHLIGHTS

Accelerates expansion of offerings across the data center processor product lines based on Intel's innovative 22nm manufacturing technology.
Aims to revolutionize the server rack design by delivering an Intel rack scale architecture for increased flexibility, density and utilization of servers leading to lower total cost of ownership.
Next-generation, 64-bit Intel® Atom™ processor for microservers, codenamed "Avoton," is being sampled to customers with broad availability expected in the second half of this year.
4th generation Intel® Core™ processors are now shipping to customers and will launch later this quarter.

INTEL DEVELOPER FORUM, Beijing, April 10, 2013 – During Intel Corporation's annual developer forum this week, company executives announced new technologies and partnerships aimed at transforming how people experience technology from the device to the cloud. The announcements included details on new data center product lines based on the 22-nanometer (nm) process technology and the new Intel rack scale architecture, along with details on the forthcoming 4th generation Intel® Core™ processor family.

During her keynote, Diane Bryant, Intel senior vice president and general manager of the Datacenter and Connected Systems Group, underscored the importance of the data center in enabling amazing personal computing experiences to deliver real-time information and services. She also outlined the steps Intel is taking to provide the hardware and software needed for data analytics to improve the capabilities of intelligent devices and data center infrastructure.

"People are increasingly demanding more from their devices through applications and services whether at home, at work or wherever they may be," Bryant said. "Intel is delivering a powerful portfolio of hardware and software computing technologies from the device to the data center that can improve experiences and enable new services."

Bryant outlined plans to accelerate the expansion of Intel's offerings across the data center processor product lines based on its innovative 22nm manufacturing technology before the end of the year, thereby enabling a more cost-effective and efficient data center infrastructure. Intel's broad portfolio of data center intellectual property enables Intel to quickly integrate features into new products and bring them to market. For example, Intel is launching the new Intel® Atom™ S12x9 processor family customized for storage today, just four months after the debut of the Intel Atom S1200 processor for microservers.

Intel plans to deliver two more Intel Atom processor-based products this year that promise to deliver new architectures, improved performance-per-watt and an expanded feature set. Bryant demonstrated for the first time the next-generation Intel Atom processor family for microservers, codenamed "Avoton," and confirmed it is currently shipping samples to customers for evaluation. Avoton will feature an integrated Ethernet controller and is expected to deliver industry-leading energy efficiency and performance-per-watt for microservers and scale out workloads.

Re-Architecting the Data Center

Bryant also revealed details on Intel's plans to develop a reference design for rack scale architecture that uses a suite of Intel technologies optimized for deployment as a full rack. Hyper-scale data centers run by companies that maintain thousands of servers and store vast amounts of data require continued advancements in rack designs that make it easier and more cost effective to deal with major growth in users, data and devices. Traditional rack systems are designed to handle a wide variety of application workloads and may not always achieve the highest efficiency under all hyper-scale usages. The reference design will help re-architect a rack level solution that is modular at the subsystem level (storage, CPU, memory, network) while providing the ability to provision and refresh or logically allocate resources based on application specific workload requirements. Benefits include increased flexibility, higher density and higher utilization leading to a lower total cost of ownership.

Additional information on these announcements as well as the new Intel Atom processor S12x9 product family for storage servers, Intel® Xeon® processor E3v3 product family, Intel Xeon processor E7v2 product family and Intel Atom processor for communication and networking devices codenamed "Rangeley" is available in the news fact sheet.

Reinventing the Computing Experience

During his keynote, Kirk Skaugen, Intel senior vice president and general manager of the PC Client Group, provided a deeper look at the forthcoming 4th generation Intel Core processor family, which he said is now shipping to OEM customers and will launch later this quarter.

"Ultrabooks based on the 4th generation Intel Core processor family will enable exciting, new computing experiences and all-day battery life delivering the most significant battery life capability improvement in Intel's history," said Skaugen. "It will also bring to consumers a new wave of 'two-for-one' convertible and detachable systems that combine the best of a full PC experience with the best of a tablet in amazing new form factors."

The new Intel Core microarchitecture will allow the company to deliver up to double the graphics performance over the previous generation. In addition, the new graphics solution will have high levels of integration to enable new form factors and designs with excellent visual quality built in. Skaugen demonstrated these graphics improvements on the 4th generation Intel Core processor-based Ultrabook reference design called "Harris Beach." The demo featured Dirt 3*, a popular gaming title, showing the same visual experience and game play as a discrete graphics card that users would otherwise have to add separately. He also showed the 4th generation Intel Core processor-based concept, codenamed "Niagara," a premium notebook with the ability to play the unreleased enthusiast title Grid 2* from CodeMasters* without the aid of a discrete graphics card.

Along with touch capability, Intel® Wireless Display (Intel WiDi) will be enabled on all 4th generation Intel Core processor-based Ultrabook devices to allow people to quickly and securely stream content and apps from devices to the big screen, free from the burden of cables. Skaugen said the China ecosystem is taking the lead on integrating Intel WiDi into systems, and announced that the leading television manufacturer in China, TCL*, has a new model with the Intel WiDi technology built in. He also announced new receivers certified for Intel WiDi from QVOD* and Lenovo* and a set-top box from Gehua*.

Illustrating the low-power advances in Ultrabook devices, Skaugen showed off the new Toshiba Portege* Ultrabook detachable, based on the new low-power line of the 3rd generation Intel® Core™ processors.

Furthermore, Skaugen revealed that voice interaction in Mandarin is now available on Ultrabook devices from Intel through Nuance*.

Augmenting the company's offerings for computing at a variety of price points, Skaugen announced plans for new market variants of its "Bay Trail" 22nm SoC with PC feature sets specifically designed for value convertibles, clamshell laptops, desktops and value all-in-one computers to ship later this year.

Mobile Inside

Tan Weng Kuan, vice president and general manager of the Mobile Communications Group, Intel China, highlighted how the company is working with ecosystem partners to deliver the best smartphone and tablet experiences with Intel inside. Tan discussed the company's progress with the new Intel® Atom™ processor Z2580 ("Clover Trail+") for smartphones and the Intel Atom Processor Z2760 ("Clover Trail") for tablets, both of which are helping to usher in a range of new devices and user experiences.

Taking full advantage of the broad spectrum of capabilities enabled by Intel® architecture, processor technology leadership, manufacturing and multi OS support across Windows* 8 and Android*, Tan discussed the company's forthcoming smartphone and tablet products based on Intel's leading-edge 22nm process and an entirely new Atom microarchitecture.Intel's quad-core Atom SoC ("Bay Trail") will be the most powerful Atom processor to-date, doubling the computing performance of Intel's current-generation tablet offering¹. Scheduled for holiday 2013 tablets, "Bay Trail" will help enable new experiences and designs as thin as 8mm that have all-day battery life and weeks of standby.

Tan also highlighted Intel's Atom SoC, codenamed "Merrifield," which is scheduled to ship to customers by the end of this year. The product will deliver increased smartphone performance, power efficiency and battery life over the current-generation offering.

Tan closed his remarks by calling upon China developers for collective innovation in helping to accelerate and grow the mobile market together. He announced the creation of a China-specific expansion of the company's platform and ecosystem enabling efforts, focused initially on Atom processor-based tablets running Android*, and designed to speed time-to-market of leading-edge mobile devices based on Intel technology. He added that China developers are instrumental to this effort and will bring speed, scale and ingenuity that will drive new innovation globally.

Day 2 IDF Preview

Doug Fisher, vice president and general manager of Intel's System Software Division, will open the second day of IDF, addressing several myths surrounding the industry and providing a vision on the vast opportunities that await developers. Specifically, he will showcase Intel's transformation of the PC experience and advances in device segments, support of multiple operating environments and efforts to help developers scale and modernize computing with new hardware features and software advancements for more compelling user experiences. He will discuss how developers can utilize HTML5 to help lower total costs and improve time-to-market for cross-platform applications development and deployment, incorporate touch and sensor interfaces to modernize applications, and use perceptual compute technologies to enable consumers to interact with PCs via voice control, gesture recognition and more.

Intel Chief Technology Officer Justin Rattner will also take the stage to discuss how Intel Labs is drawing up plans for a bright future. He will reveal a vision for connected and sustainable cities where information technology helps to address challenges of clean air, clean water, better health and improved safety. He will also explain how today's mobile, urban lifestyle is demanding faster and cheaper wireless broadband communications. Forecasting a move beyond the information age, Rattner will describe a new era coined "the data society" and show how information in the cloud will work on everyone's behalf, collaboratively and safely, by analyzing and relating different data to deliver new value to individuals, enterprises and society as a whole. Rattner plans to surprise the audience with an exclusive first look at Intel® Silicon Photonics Technology.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

Intel Developer Forum
IDF spans the worlds of mobility, digital enterprise, digital home, and technology and research. Held at the China National Convention Center on April 10-11, the event is geared toward the Chinese market in support of local innovation and Intel’s industry leadership in the region. Next up on the IDF schedule is a 3-day event in San Francisco, which will be held Sept. 10-12 at Moscone Center West. Further information is available at www.intel.com/idf.

Intel, Intel Atom, Intel Core, Intel Xeon, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice

Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn About Intel® Processor Numbers

Chip Shot: Intel Celebrates International Internet of Things Day

webadmin@intel.com — Tue, 09 Apr 2013 19:32:20 GMT

Billions of connected devices and intelligent systems are generating enormous volumes of digital information and spurring the next wave of “Big Data.” In recognition of the International Internet of Things Day, Intel issued a blog post and infographic to illustrate how the Internet of Things touches many aspects of our lives. From connectivity in the car to digital signs in the mall, we’re contributing data to the Internet of Things most of the time without even noticing it. To celebrate the day, try making an online purchase with your tablet or downloading some new music to your smartphone.

Intel Honors 20 Companies with Preferred Quality Supplier and Achievement Awards

webadmin@intel.com — Tue, 09 Apr 2013 13:59:53 GMT

SANTA CLARA, Calif., April 9, 2013 – Intel Corporation today announced that 17 companies will receive the 2012 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement. These companies distinguish themselves from the thousands of suppliers that work with Intel by exceeding high expectations and challenging performance goals while demonstrating industry-leading commitment to quality.

In addition to the PQS award, Intel recognized three suppliers with the Supplier Achievement Award, which recognizes extraordinary accomplishments in one or more key performance areas. This year's winners were recognized for high-impact contributions to Intel's success in the areas of velocity, customer orientation and reduced cycle time. The 2012 PQS and Achievement winners will be honored at a ceremony tonight in San Jose, Calif.

"This year's Intel Preferred Quality Supplier award winners have done a tremendous job of driving and executing to world-class supply chain performance," said Jacklyn Sturm, vice president, Technology and Manufacturing Group and general manager of Global Sourcing and Procurement. "2012 was a year that put all aspects of the supply chain to the test, from core challenges of business continuity, agility and affordability to the need for continuous innovation, improved velocity and rising to the growing expectations of sustainability. These companies distinguished themselves from the thousands of other suppliers that work with Intel by providing strategic capabilities that enable our technology roadmaps, demonstrating performance that exceeds our very demanding expectations, and by maintaining a long-term commitment to quality leadership in the semiconductor industry."

"Intel's 2012 Preferred Quality Suppliers have excelled across an extremely demanding set of expectations and have distinguished themselves as industry leaders in technology innovation, supply chain excellence, and corporate responsibility," added Robert Bruck, corporate vice president and general manager of Technology Manufacturing Engineering. "These suppliers have made a substantial contribution to Intel's success through their commitment to quality in support of Intel's industry-leading silicon, packaging and test technologies."

The PQS award is part of Intel's Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to innovate and continually improve. To qualify for PQS status, suppliers must score at least 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology, and environmental, social and governance goals. Suppliers must also achieve 80 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

The PQS winners provide Intel with the following products or services:

Applied Materials, Inc.: semiconductor equipment, software and support services
ASML: semiconductor lithography equipment
Carl Zeiss SMS GmbH: photomask qualification, repair, metrology and tuning equipment
DAEWON Semiconductor Packaging Industrial Co., Ltd.: plastic injection molded shipping tray, BDTR
DAINIPPON SCREEN Mfg. Co., LTD.: cleaning and annealing equipment and services for semiconductor manufacturing
EBARA Corporation: plating systems, chemical mechanical polishing systems, dry vacuum pumps, and gas abatement
FUJIFILM Electronic Materials: formulated chemicals, developers, precursors, slurries, and advanced photoresists
Hitachi High-Technologies Corporation: CD SEM, dry etching, ashing and defect metrology systems
JX Nippon Mining & Metals Corporation: sputtering targets for physical vapor deposition process
KLA-Tencor Corporation: process control capital equipment and services
Linde Electronics, a Member of the Linde Group: ultra-high purity gases, equipment and onsite services
Munters Corporation: VOC abatement and energy efficient air handling equipment
Murata Manufacturing Co., Ltd.: multilayer ceramic capacitors and LTCC device products
Shinko Electric Industries Co., Ltd.: plastic laminated packages and heat spreaders
Siltronic: polished and epitaxial silicon wafers
Siliconware Precision Industries Co., Ltd.: semiconductor assembly and test services
Tosoh Quartz Inc.: quartzware for semiconductor wafer processing equipment

The Supplier Achievement Award winners are:

Amkor Technology: semiconductor assembly and test services
Daifuku Co.,Ltd.: fab automated material handling systems
Lam Research Corporation: wafer fabrication equipment and services

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Honors Eight Companies with Supplier Continuous Quality Improvement Award

webadmin@intel.com — Tue, 09 Apr 2013 13:59:32 GMT

SANTA CLARA, Calif., April 9, 2013 – Intel Corporation today announced the eight winners of the company's most prestigious award for suppliers, the Supplier Continuous Quality Improvement (SCQI) award. This honor, which recognizes outstanding commitment to quality and performance excellence, distinguishes these suppliers as world-class within Intel's greater supply chain.

Providing products and services deemed essential to Intel's business success, the 2012 winners will be honored at a ceremony tonight in San Jose, Calif. "We are pleased to recognize these world-class suppliers for their exceptional performance and commitment to excellence," said William Holt, executive vice president and general manager of Intel's Technology and Manufacturing Group. "Delivering a sustained pace of innovation requires continuously improving and we are delighted to work with such nimble and distinguished companies."

The SCQI award is part of Intel's SCQI program, which encourages Intel's key suppliers to strive for excellence and continuous improvement. To qualify for SCQI status, suppliers must score at least 95 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and environmental, social and governance goals. Suppliers must also achieve 90 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

The SCQI winners provide Intel with the following products or services:

Cabot Microelectronics Corporation: CMP polishing slurries and CMP polishing pads
Hitachi Kokusai Electric, Inc.: diffusion furnaces
JSR Corporation: advanced lithography solutions, packaging materials and CMP consumables
Mitsubishi Gas Chemical Company, Inc: chemicals for semiconductor device manufacturing
Moses Lake Industries (Tama Chemical): plating, lithography, cleans and reagent chemicals
Senju Metal Industry Co., Ltd.: soldering material (solder sphere, flux, paste, bar, wire)
SUMCO Corporation: polished and epitaxial silicon wafer
Tokyo Electron Limited: coater-developers, dry etch, wet etch and test systems

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Ultrabooks Inspire New Industrial Design at Milan Design Week 2013

webadmin@intel.com — Mon, 08 Apr 2013 22:08:53 GMT

Intel joins Milan Design Week 2013 with a special showcase of technology and creativity in the heart of the Milan Design District. Four young and talented Italian designers have been chosen by Intel Italy to develop interesting objects which demonstrate industrial design inspired by multiple Ultrabook convertibles. The designs will be on display at the Rizieri Boutique. To learn more, visit http://www.ultradesign.barabinolabs.com.

Six design objects can be seen here: http://www.flickr.com/photos/intel_italia/sets/72157633155587047/.

Six Ultrabook Convertible are showcased here: http://www.flickr.com/photos/intel_italia/sets/72157633155699327/.

Chip Shot: New Intel Thunderbolt™ Advancements at the NAB Show

webadmin@intel.com — Mon, 08 Apr 2013 20:00:51 GMT

At the National Association of Broadcasters (NAB) show this week in Las Vegas, Intel made some key announcements regarding Thunderbolt™ technology, the fastest data connection available in your personal computer. Intel introduced the Intel® DSL4510/4410 Thunderbolt controllers which add DisplayPort 1.2 capability when connecting to native DP displays, improve power management, and reduce platform BOM cost. Intel also previewed early prototype silicon of its next-generation Thunderbolt controller codenamed Falcon Ridge, which runs at 20Gbs, enabling 4K video file transfer and display simultaneously. Initial production is expected before the end of this year, with ramp in 2014. Stop by Intel booth LVCC #SL9610 at NAB or read more about Thunderbolt technology.

Chip Shot: Two Generations of Intel® Atom™ SoCs to Power HP's Moonshot Servers in 2013

webadmin@intel.com — Mon, 08 Apr 2013 19:00:55 GMT

Yesterday HP announced the availability of the first production HP ProLiant Moonshot servers. These systems are based on 64-bit Intel Atom S1200 processor family and are shipping to customers now. In the second half of 2013, HP Moonshot servers will feature also the entirely new generation of Intel Atom processors codenamed Avoton. Avoton is build using 3D tri-gate 22nm transistors and new micro-architecture "Silvermont". Intel's second generation of 64-bit server SoCs will provide a significant increase in performance and performance per watt vs. currently available Intel Atom S1200. In her blog, Raejeanne Skillern - Intel's Director of Cloud Marketing, shares her thoughts on HP's Moonshot launch and how Intel is excited to see two generations of Intel Atom SoCs powering new HP ProLiant Moonshot servers this year. Additionally Jason Waxman, General Manager of Intel Cloud Infrastructure Group in this video talks about Intel and HP long collaboration and how current and new generations of Intel Atom SoC will help HP ProLiant Moonshot servers to success.

Chip Shot: Intel Media SDK 2013 for Linux Servers Debuts at NAB

webadmin@intel.com — Mon, 08 Apr 2013 15:30:29 GMT

For the first time, Intel® enables developers to easily create high density, energy efficient datacenter and embedded media solutions with Intel HD Graphics. Intel Media SDK 2013 for Linux* Servers now supports hardware acceleration for video on the Intel Xeon® E3-1285Lv2 and 3rd Generation Intel Core™ processors with Linux operating systems. The new SDK simplifies the development of enterprise media applications, improves video processing performance, and reduces the complexities of accessing hardware acceleration for real-time streaming, teleconferencing, and video analytics. Developers have the opportunity to sign up for the limited beta here, and visit the Intel NAB booth #SL9610 for more information.

Chip Shot: Performance Boost with New Intel® HD Graphics Drivers

webadmin@intel.com — Wed, 03 Apr 2013 15:00:45 GMT

The latest Intel® HD Graphics driver includes a new driver architecture and optimizations that reduce CPU overhead and increase game performance by up to 10% in games like Starcraft* II, Batman Arkham City* and WoW: Mists of Pandaria*. These drivers support OpenCL* 1.2 for general purpose programming using CPU, GPU and hardware acceleration on Intel HD Graphics. Download the latest 32-bit drivers and 64-bit drivers.

Chip Shot: OpenCL Developers Kit 2013 Supports OpenCL 1.2 and Future 4th Generation Intel® Core™ Processors

webadmin@intel.com — Tue, 02 Apr 2013 15:39:56 GMT

For cutting-edge visual computing applications, Intel today released the Intel® Software Development Kit (SDK) for OpenCL Applications 2013 supporting the OpenCL 1.2 standard on 3^rd and future 4^th generation Intel® Core™ processors. General purpose programing using OpenCL, coupled with the hardware acceleration capability of Intel HD Graphics, helps provide better performance and improved battery life on low-power Intel Core platforms running Microsoft Windows* 7 and 8 operating systems. The SDK is ideal for content creation applications like video editing, music creation, and photo editing. Developers can now download a free copy of Intel SDK for OpenCL Applications 2013.

Chip Shot: MashUp Radio Hosts Startups Enhancing Children's Reading

webadmin@intel.com — Mon, 01 Apr 2013 20:25:23 GMT

The latest episode of Intel’s MashUp Radio with Peter Biddle welcomed San Francisco-based startups, including FarFaria, Drawp, and PlayTell, to discuss how the companies are encouraging young children to explore their world through reading and creative expression. During the show, Biddle and the startup executives and founders discuss how mobile apps can help children develop a love of reading, establish a stronger bond with long distance loved ones, and more creatively explore their world. MashUp Radio with Peter Biddle is an online radio program that brings together a variety of perspectives to discuss the fusion of technology, life, culture and science. Hosted by Peter Biddle, an Intel engineer and executive, the program strives to take on the hottest topics in order to create a lively and thought-provoking discussion.

Chip Shot: 10 Petaflops Supercomputer "Stampede" Powered by Intel® Xeon Phi™ Coprocessors Officially Dedicated Today

webadmin@intel.com — Wed, 27 Mar 2013 20:21:46 GMT

Today at Texas Advanced Computing Center in Austin, the supercomputer "Stampede" - currently the largest Intel® Xeon Phi™ coprocessors' based system was officially dedicated. "Stampede" delivers 10 Petaflops of performance and is powered by combination of 12.800 Intel Xeon processors E5 product family and 6.880 Intel Xeon Phi coprocessors. "Stampede" already allows researchers to increase the accuracy of MRI scans, more effectively predict earthquakes, and help to advance in many other sciences as well. Intel's John Hengeveld shares his thoughts in a blog on why this is an important milestone for the science and why HPC is the best example of a technology directly affecting lives of every humans on Earth. More information about Intel Xeon Phi coprocessors can be found here.

Intel Delivers New Range of Developer Tools for Gaming, Media

webadmin@intel.com — Wed, 27 Mar 2013 16:43:19 GMT

Rendering Extensions for Intel® HD Graphics Offer Unique Features for Game Developers

NEWS HIGHLIGHTS

New rendering extensions for Intel® HD Graphics debuted at GDC 2013.
HandBrake*, one of the most popular open source video transcoders, is being accelerated using Intel® Quick Sync Video.
The Intel® Graphics Performance Analyzers toolset has been updated to further help developers optimize performance on games, media and other graphic-intensive applications.
Updates to the popular Intel® Level Up Contest and million-dollar Perceptual Computing Contest were announced.

GAME DEVELOPERS CONFERENCE (GDC), San Francisco, March 27, 2013 – Intel Corporation today announced several tools and initiatives targeted at software developers, creating some of the most performance-hungry gaming and media titles on the market. Intel® Core™ processor performance, power efficiency and strong momentum for Intel HD Graphics are freeing developers to take applications in new directions.

Debuting at GDC 2013 were new graphics capabilities for forthcoming Intel HD Graphics platforms that are accessible through DirectX* extensions. The first of these extensions, called PixelSync, provides access to underlying hardware that allows programmers to properly composite partially transparent pixels without the need for an expensive sorting operation. Game developers have long awaited this capability in order to more realistically render smoke, hair, windows, foliage, fences and other complex geometry and natural phenomena.

"The artists working on 'Grid2' have been requesting this type of effect for years, and prior to this, it wasn't possible to achieve it at a reasonable cost," said Clive Moody, senior executive producer at Codemasters Racing*. "The fact that this capability will be available to millions of consumers on forthcoming 4th generation Intel® Core™ processors is very exciting to us."

InstantAccess, the second new extension, works by allowing physical memory to be written and read from either the CPU or from the built-in Intel HD Graphics.

"We have been working directly with Intel engineers to fully exploit the Intel-specific rendering extensions that most effectively enhance rendering performance and visual quality of 'Total War: ROME II,'” said Mike Simpson, the creative director of Creative Assembly¹. "With our upcoming game, 'Total War: ROME II,' we've shifted our focus toward ensuring that the game looks great whether you're running it on a slim and sexy Ultrabook or a monster desktop. Intel's 4th generation Intel Core platforms and the new rendering extensions they provide have been an enormous help in making that dream a reality."

These real-time rendering extensions are being released in advance of the launch of Intel's newest generation of Core processors in order to give developers extra time to begin incorporating them into their products. Initially, these extensions are available through Intel's implementation of DirectX and on Intel 4th gen Core platforms only. Documents describing these extensions are available now from Intel's Visual Computing Source web site.

In the area of media software, consumers access and share more video than ever, so tools to help them move content to multiple devices and formats are increasingly more important. HandBrake*, one of the most popular open source video transcoders, is being accelerated using Intel® Quick Sync Video – dedicated hardware built into the latest Intel Core processors. Intel and the HandBrake team are showcasing the new HandBrake optimized for Intel Quick Sync Video at GDC.

"The HandBrake team has been working closely with Intel to leverage the advantages of Intel Quick Sync Video," said Tim Walker of the HandBrake team. "While testing is in the early stages, initial results show promise in terms of performance and significantly reduced CPU usage during the decode/encode process, especially for mobile and low-power CPU parts. Early test builds will be available shortly."

Performance comparable to that of other Intel Quick Sync Video-optimized transcoding applications is expected.

Intel's suite of graphic and game development tools, Intel® Graphics Performance Analyzers (Intel® GPA), has also been updated to further help developers analyze and optimize performance on games, media and other graphic-intensive applications on Intel Core processor-based platforms with HD Graphics or on Intel® Atom™ processor-based Android* phones. Intel GPA 2013 R1 includes a Geometry Viewer with support for shader stages that aid developers in debugging performance bottlenecks. Other enhancements include additional Android support and platform updates for developers working with the latest Intel processors.

Development Kits, Contests to Speed Perceptual Computing, Gaming Innovation

In support of the company's efforts to make experiences with computing devices natural, intuitive and immersive, the production release of the Intel® Perceptual Computing Software Development Kit (SDK) 2013 is now available. With this release, developers can now make their applications available commercially. When used with the Creative* Interactive Gesture Camera, the Intel Perceptual Computing SDK 2013 enables developers to add human-like interaction to computers in the form of close-range finger or hand-tracking, speech recognition, facial analysis and augmented reality that has applications for gaming and beyond.

Intel also announced the 2013 version of its popular Intel Level Up Contest through which it continues to encourage game developer innovation. Entries will be judged by a panel of game industry luminaries, and once again the winning entries will have a chance to win a publishing contract from contest co-sponsor Valve Corporation.

In addition, to spark innovation around perceptual computing, Intel is launching the second phase of the million-dollar Intel Perceptual Computing Challenge, and announcing the winners of phase one. Now through September 2013, developers in 16 countries will compete in phase two for more than $800,000 in prizes in categories including Perceptual Gaming, Productivity, Creative User Interface and Open Innovation. Learn more about phase two and see the winners from phase one.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.

Chip Shot: Intel Celebrates World Water Day

webadmin@intel.com — Fri, 22 Mar 2013 19:16:23 GMT

In celebration of World Water Day, Intel is recognizing the winners of the Environmental Excellence Awards, which honor employees who help reduce Intel’s environmental footprint. In 2012, water conservation was a large theme in these awards, and it’s also a key aspect of Intel’s overarching sustainability commitment. In fact, to date, Intel’s efforts have saved more than 40 billion gallons of water – enough for roughly 400,000 U.S. homes for an entire year. To learn more about Intel’s water conservation commitment and sustainability initiatives, click here.

Chip Shot: Virtual Reality Gets More … Realistic

webadmin@intel.com — Fri, 22 Mar 2013 16:16:27 GMT

Intel Labs and the U.S. Army have signed an R&D agreement to dramatically improve virtual reality tools used to train troops. The work could allow thousands of soldiers to concurrently participate in virtual training exercises -- a 10-fold increase over the current technology. Eventually, the technology could aid other professions including first responders working on disaster simulations. It can also help model that massive paintball war you're planning this weekend. Intel research scientist Huaiyu Liu has additional thoughts on this technology.

Chip Shot: Intel Enables the Channel with a Big Bundle for Big Data

webadmin@intel.com — Thu, 21 Mar 2013 20:44:41 GMT

Building on the recently announced Intel® Distribution for Apache Hadoop* software, the Enterprise Platforms and Services Division (EPSD) announced that it would enable the channel to deliver big data solutions to IT customers. EPSD will offer bundles of Intel server hardware, including motherboards and chassis, with the Intel Distribution to the channel. Customers purchasing the bundle will receive a 30% or more discount versus purchasing the software and hardware components separately. The Intel Distribution has been optimized to run on Intel processors, storage and networking hardware. The combination is designed to deliver the cost-effective performance that the channel needs. For more information, visit EPSD’s website.

Intel Declares Quarterly Cash Dividend

webadmin@intel.com — Thu, 21 Mar 2013 13:00:35 GMT

SANTA CLARA, Calif., March 21, 2013 – Intel Corporation's board of directors has declared a 22.5 cents-per-share (90 cents-per-share on an annual basis) quarterly dividend on the company's common stock. The dividend will be payable on June 1, 2013 to stockholders of record on May 7, 2013.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Brazil:The Next Big Data Investment Frontier

webadmin@intel.com — Tue, 19 Mar 2013 17:12:29 GMT

Intel Capital has announced an investment in Geofusion, a Brazilian company providing geomarketing data analytics and intelligence to enterprise customers. Geofusion’s cloud-based OnMap platform combines geographic data with relevant market information, such as industry specific consumption statistics and census-based demographics, to help customers improve decision making on issues such as placement of key assets, distribution channel coverage and product pricing strategies. With the market for big data software applications in Brazil expected to achieve US $260 million, Intel Capital sees significant opportunities in the business analytics market due to Brazilian companies increasingly paying attention to the many ways in which technology can help business. Geofusion marks Intel Capital’s second investment in a Brazilian big data company, following its investment announced last month in WebRadar, an analytics company delivering operational intelligence for telecom, energy and transportation markets. More information can be found in the Intel Capital press release.

Chip Shot: Intel Free Press Updates Mobile App

webadmin@intel.com — Tue, 19 Mar 2013 15:29:48 GMT

Intel Free Press has revised and updated its mobile app to version 4.3 with a new look and new features. The app includes all the feature stories available at the main site, along with photos, videos, twitter feeds from the writers and more. It even includes real-time weather and a GPS-based Google traffic feature. Available for Android, Apple, and Blackberry phones at the following locations: Google Play, the iTunes store, and Blackberry World. Intel Free Press is a tech news site from Intel, with news and information focused on people, technology, events and topics relevant to Intel and the computing industry.

Chip Shot: Intel Announces Intel® Media Server Reference Design at TV Connect

webadmin@intel.com — Tue, 19 Mar 2013 15:06:48 GMT

Service providers around the globe continue to look for ways to innovate and deliver solutions to meet the growing demands of their customers. To help address those needs, Intel today launched its Intel® Media Server Reference Design (MSRD) at the TV Connect show in London. The MSRD, based on the Intel® Atom™ processor CE5300, is both a hardware and software design kit that allows OEMs and system integrators to quickly develop Intel-based set-top boxes and media servers. Want to learn more? Check out this blog post from the team.

Chip Shot: Intel Rolls out Intel Storage System for Data Center and Enterprise

webadmin@intel.com — Thu, 14 Mar 2013 17:41:37 GMT

The Enterprise Platforms and Services Division (EPSD) recently rolled out an the Intel® Storage System (JBOD2000) to meet the need for expandable storage in the enterprise and data centers. The straightforward option delivers up to 12 terabytes of storage capacity. JBOD2000 works seamlessly with Intel® Server Systems and Intel® RAID and has single or multi-cable connectivity, up to 24 SAS/SATA drive bays and sixteen external 6Gbps SAS ports. With products like JBOD2000 EPSD continues to create and deliver innovative solutions to partners and customers. Find out more about JBOD2000, or other EPSD solutions.

Chip Shot: Congratulations to ACM Turing Award Winners

webadmin@intel.com — Wed, 13 Mar 2013 16:09:17 GMT

Congratulations to Shafi Goldwasser and Silvio Micali, winners of the latest ACM Turing Award. Their work made modern cryptography possible, adding immeasurably to our ability to communicate and conduct commerce over the Internet.

Chip Shot: Samsung and Intel Collaborate in Africa

webadmin@intel.com — Wed, 13 Mar 2013 15:28:14 GMT

As part of Samsung’s ‘Built for Africa’ program, which focuses on developing products to meet the unique needs of Africa, Intel and Samsung have entered into a strategic collaboration to co-develop products and programs in the education, public sector and telco space to enhance the lives of consumers living in Sub-Saharan Africa. As a first step, this joint effort will expand on Intel’s holistic efforts toward educational transformation within the continent, where students and teachers alike are learning to equip themselves with employable skills in a digital age.

Teenage Girl Explores Algae-Powered Biofuel, Wins Intel Science Talent Search

webadmin@intel.com — Wed, 13 Mar 2013 00:56:08 GMT

Sara Volz of Colorado Springs, Colo. wins $100,000 Award from the Intel Foundation

NEWS HIGHLIGHTS

Sara Volz, who investigated increasing the oil content of algae to create an economically viable source of biofuel, received the top award of $100,000 at the Intel Science Talent Search 2013, a program of Society for Science & the Public.
Other finalists from across the United States took home additional awards totaling $530,000.
The Intel Science Talent Search, the nation's oldest and most prestigious high school science and math competition, recognizes 40 high school seniors who are leaders in innovation and seeking to solve some of the world's greatest challenges.

WASHINGTON, D.C., March 12, 2013 – First-place winner Sara Volz, 17, of Colorado Springs, Colo. (center), second-place winner Jonah Kallenbach, 17, of Ambler, Pa. (left), and third-place winner Adam Bowman, 17, of Brentwood, Tenn. (right) celebrate their awards at the Intel Science Talent Search, the nation's oldest and most prestigious high school science research competition. A program of Society for Science & the Public, the competition encourages high school seniors to seek solutions to some of the world’s largest problems, from medical treatments to environmental solutions.

WASHINGTON, D.C., March 12, 2013 – Innovation, from improving robot navigation to advancing treatment for breast cancer, is thriving today in the nation's capital. Honoring high school seniors with exceptional promise in math and science, Intel Corporation and Society for Science & the Public (SSP) recognized the winners of what is considered the nation's most elite and demanding high school research competition, the Intel Science Talent Search.

Sara Volz, 17, of Colorado Springs, Colo., won the top award of $100,000 from the Intel Foundation for her research of algae biofuels. Algae produces oil that can be converted into a sustainable, renewable fuel; however, the fuel can be costly. Sara used artificial selection to establish populations of algae cells with high oil content, which are essential for an economically feasible biofuel. Sara, who built a home lab under her loft bed, sleeps on the same light cycle as her algae.

Second-place honors and $75,000 went to Jonah Kallenbach, 17, of Ambler, Pa., whose bioinformatics study breaks new ground in predicting protein binding for drug therapy. Jonah solved an open problem first posed several years ago, and his work suggests a new path to drug design by targeting a protein's disordered regions. His research may open doors to treatment for diseases, such as breast cancer, ovarian cancer and tuberculosis.

Third-place honors and $50,000 went to Adam Bowman, 17, of Brentwood, Tenn., who successfully designed and built a compact and inexpensive, low-energy, pulsed plasma device. Typical plasma sources are large, complicated and expensive. Using his inexpensive technology, Adam believes plasma research can now be conducted in small-scale operations and even high school labs.

"The Intel Science Talent Search is an opportunity to reshape the dialogue around our nation's youth," said Wendy Hawkins, executive director of the Intel Foundation. "We believe it's crucial to U.S. innovation to bring greater attention to math and science achievement, encourage more youth to embrace these fields, and demonstrate the impact these subjects have on our country's future success."

Other top honors from the competition include:

Fourth Place: Hannah Larson of Eugene, Ore., received a $40,000 award for her research of an abstract mathematical structure that's important in many areas of theoretical physics and computer science.

Fifth Place: Peter Kraft of Munster, Ind., received a $30,000 award for his synthesis of 10 new coordination polymers, which are massive molecules with complex network structures that have applications in gas purification and the storage of hydrogen in fuel cells.

Sixth Place: Kensen Shi of College Station, Texas, received a $25,000 award for his development of a computer algorithm that makes it easier for a robot to avoid colliding with obstacles in its path.

Seventh Place: Samuel Zbarsky of Rockville, Md., received a $25,000 award for his math research that could improve the efficiency of 3-D computer networks.

Eighth Place: Brittany Wenger of Sarasota, Fla., received a $20,000 award for her development of an artificial neural network to help diagnose breast cancer using data from fine needle biopsy samples.

Ninth Place: Akshay Padmanabha of Collierville, Tenn., received a $20,000 award for his development of an algorithm that detects oncoming epileptic seizures.

Tenth Place: Sahana Vasudevan of Palo Alto, Calif. received a $20,000 award for her math research that proved a new, generalized way to minimize an important function of arithmetic.

In total, the Intel Foundation awarded $1.25 million for the Intel Science Talent Search 2013. When Intel assumed the title sponsorship 15 years ago, it increased the annual awards by more than $1 million.

This year's finalists hail from 20 states and represent 40 schools. Of the 1,712 high school seniors who entered the Intel Science Talent Search 2013, 300 were announced as semifinalists in January. Of those, 40 were chosen as finalists and invited to Washington, D.C. to compete for the top 10 awards. These finalists join the ranks of other notable Science Talent Search alumni who, over the past 72 years, have gone on to win seven Nobel Prizes, two Fields Medals, five National Medals of Science, 11 MacArthur Foundation Fellowships and even an Academy Award for Best Actress.

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, has owned and administered the Science Talent Search since its inception in 1942.

"Society for Science & the Public is proud to join Intel in congratulating Sara Volz for her scientific accomplishments," said Elizabeth Marincola, president of Society for Science & the Public. "Sara's work demonstrates how a young person who is fascinated by science, which she has been since a kindergarten science fair, can work with few sophisticated resources and have real impact on society. Sarah's research on a novel method to help make algae biofuel economically feasible has the potential to make a serious impact on a critical global challenge. Sara and the rest of the Intel Science Talent Search 2013 finalists serve as an inspiration for young researchers who are drawn to science. Their hard work and innovation will create solutions to the problems of tomorrow."

To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.

Because Intel views education as the foundation for innovation, Intel and the Intel Foundation have invested more than $1 billion over the past decade, and Intel employees have donated close to 3 million hours toward improving education in more than 60 countries.

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Science Talent Search Finalists Showcase Innovative Research

webadmin@intel.com — Mon, 11 Mar 2013 13:00:08 GMT

Yesterday, Jamie Solimano, 17, of New York chatted with young students about her research at the Intel Science Talent Search, a program of Society for Science & the Public. Jamie is one of 40 Intel Science Talent Search finalists competing this week in the nation's oldest and most prestigious high school science research competition. Additionally, U.S. Secretary of Education Arne Duncan surprised the finalists with a visit.

Chip Shot: Intel Hosts "Girl Rising" Premieres in NY, LA

webadmin@intel.com — Fri, 08 Mar 2013 22:22:03 GMT

This week, audiences in New York and Los Angeles were the first to watch “Girl Rising,” a feature film that spotlights the power of education to change the lives of girls around the world. The premieres, hosted by Intel, Vulcan Productions and CNN Films, drew celebrities including Allison Williams, Lauren Bush Lauren, Sami Gayle and John Hockenberry. Today, on International Women’s Day, the film was released on-demand in theatres nation-wide through Gathr, a new model for theatrical distribution.