<?xml version="1.0" encoding="UTF-8"?>
<?xml-stylesheet type="text/xsl" media="screen" href="/~d/styles/rss2full.xsl"?><?xml-stylesheet type="text/css" media="screen" href="http://feeds.feedburner.com/~d/styles/itemcontent.css"?><!-- generator="Kunena 1.6" --><rss xmlns:atom="http://www.w3.org/2005/Atom" xmlns:feedburner="http://rssnamespace.org/feedburner/ext/1.0" version="2.0">
	<channel>
		<title>MEMS Library - Forum</title>
		<description>Kunena Site Syndication</description>
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		<generator>Kunena 1.6</generator>
		<image>
			<url>http://memslibrary.com/components/com_kunena/template/example/images/icons/rss.png</url>
			<title>MEMS Library - Forum</title>
			<link>http://memslibrary.com/</link>
			<description><![CDATA[Kunena Site Syndication]]></description>
		</image>
		<language>en-gb</language>
		<atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" type="application/rss+xml" href="http://feeds.feedburner.com/MEMSForum" /><feedburner:info uri="memsforum" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com/" /><item>
			<title>Subject: Re: Sputtering for Lift-off - by: RH75</title>
			<link>http://feedproxy.google.com/~r/MEMSForum/~3/ashv3QDAdWs/315-sputtering-for-lift-off.html</link>
			<guid isPermaLink="false">http://memslibrary.com/forum/deposition-lithography-and-etching/315-sputtering-for-lift-off.html#316</guid>
			<description>Hi,&lt;br /&gt;
i am just wondering. usualy for lift off process we use evaporation. sputtering it is known to give side coverage. maybe what you see here is that the layer covering the side which under stress forms this ring? if it is possible can you switch to evaporation? i hope the problem will be solved.&lt;img src="http://feeds.feedburner.com/~r/MEMSForum/~4/ashv3QDAdWs" height="1" width="1"/&gt;</description>
			<category>Deposition, Lithography and Etching</category>
			<pubDate>Tue, 14 May 2013 15:01:13 +0000</pubDate>
		<feedburner:origLink>http://memslibrary.com/forum/deposition-lithography-and-etching/315-sputtering-for-lift-off.html#316</feedburner:origLink></item>
		<item>
			<title>Subject: Sputtering for Lift-off - by: moose87</title>
			<link>http://feedproxy.google.com/~r/MEMSForum/~3/yn-gaZ1lwig/315-sputtering-for-lift-off.html</link>
			<guid isPermaLink="false">http://memslibrary.com/forum/deposition-lithography-and-etching/315-sputtering-for-lift-off.html#315</guid>
			<description>I am working on lift-off process that uses a negative e-beam resist with a PMMA lift-off layer. The way it works is I am spincoating a 600nm layer of PMMA followed by a 110nm layer of HSQ, writing an array of circles, developing and then using oxygen plasma to transfer the pattern into PMMA. I think sputter a layer of metal or aluminum nitride, or both. Wierd thing is that I am getting a thicker deposition directly around my circular structures, which forms a ring. I have included a picture for clarity. Has anyone encountered this before? What could be causing it and how can I minimize it. Could this be due to a high surface mobility during sputtering? &lt;br /&gt;
&lt;br /&gt;
Thanks!&lt;img src="http://feeds.feedburner.com/~r/MEMSForum/~4/yn-gaZ1lwig" height="1" width="1"/&gt;</description>
			<category>Deposition, Lithography and Etching</category>
			<pubDate>Tue, 14 May 2013 14:55:14 +0000</pubDate>
		<feedburner:origLink>http://memslibrary.com/forum/deposition-lithography-and-etching/315-sputtering-for-lift-off.html#315</feedburner:origLink></item>
	</channel>
</rss>
