March Plasma Systems

Plasma Processing Solutions Highlighted during Southern California Technology Seminar Series open to the Medical Device Assembly Industry

March Plasma Systems Opens Registration for their September Plasma Technology Seminar Series to be held in three Southern California areas which play host to the region’s hotbed of Life Science and Medical Device Assembly companies.

March Plasma Systems Releases New White Paper on Argon Plasma Cleaning for Improved Wire Bonding

Commercially-available plasma cleaning systems using Argon gas can be used for effectively cleaning Fluorine, organic, and metal oxide contamination from the surface of a variety of microelectronic wire bonding pads in order to measurably improve the performance and reliability of wire bonding.

How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and Optoelectronics

Over the past 30 years, plasma, the fourth state of matter, has become a very useful method for surface modification and deposition of variousmaterials. In IC packaging applications, plasma is employed to prepare surfaces for die attach, wirebonding and mold/encapsulation.

FexTRAK-SH Superior Plasma Technology For High Throughput Strip Processing

The universal architecture of the FlexTRAK-SH system accommodates a wide range of strip sizes in the same system, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.

Plasma Cleaning - Contamination Removal - Surface Modification Processes

Plasma cleaning is a universally applied environmentally benign process used in numerous manufacturing processes for removal of sub-micron contamination. Dry processing is advantageous in a wide variety of manufacturing operations for removal of many types of contamination including organic residues, polymer coatings or build-ups, waxes, metals and metal oxides, fluorine and other halogens.

March Plasma Systems PCB-1600 Plasma System selected by Labtech Microwave in the United Kingdom

March Plasma Systems, the global leader in advanced plasma treatment systems, announced today that one of the UK’s leading manufacturers of standard and custom microwave component technology has invested in a new PBC-1600 plasma system at its Presteigne microwave printed circuit board (PCB) production facility, with the aim of improving processes, efficiency and manufacturing capability.

March Plasma Systems Announces New Low-Cost Plasma Cleaning System

“The PM-100 plasma system opens up a new world of economical plasma processing for small-budget operations,” said Frank Huysmans, vice president of sales at March Plasma Systems. “These facilities typically know and understand the value of plasma treatments, but have been locked-out from acquiring equipment due to high system costs.

Plasma induced Crosslinking - Surface Modification Processes

The process of plasma induced crosslinking involves a physical or chemical reaction that breaks chemical bonds on the surface of the material. The resulting radicals in the polymer chain react with adjoining chains linking one polymer chain to another which improves the surface’s barrier and biocompatibility characteristics.

March Plasma Systems Ships Another FlexTRAK-WR System to Advanced MEMS Manufacturer in Europe

The FlexTRAK-WR system was specifically designed for advanced wafer processing and wafer level packaging (WLP) applications, including plasma etching, ashing and descum of semiconductor wafers and other advanced substrates.

March Plasma Systems Announces FP64 Plasma System for Flexible PCB Manufacturing Applications

The FP64 system enables advanced flexible PCB manufacturing. As the market expands from traditional rigid PCBs to flexible panels, it opens up new segments of PCB fabrication, with higher production efficiencies and lower costs than ever before.

March Plasma Systems Announces PROVIA Plasma System for Advanced PCB Applications

Target applications for the PROVIA plasma system include desmear and etch-back steps for PCB through holes and blind vias, surface activation of difficult-to-wet and difficult-to-bond layers/films, removal of carbon and hydrocarbon residues from PCB surfaces, PCB inner-layer preparation/treatment for improved bonding and adhesion, and general contamination removal.