MCU DESIGN

LPC2134FBD64 ARM decryption

2012-11-19T22:41:00.001-08:00

LPC2134FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC
16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 or HVQFN64 package.
8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip flash program memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader software. Single flash sector or full chip erase in 400 ms and programming of 256 B in 1 ms.

LPC2132FHN64 ARM decryption

2012-11-19T22:39:00.002-08:00

LPC2132FHN64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Enhancements brought by LPC213x/01 devices
Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original LPC213x. They also allow for a port pin to be read at any time regardless of its function.
Dedicated result registers for ADC(s) reduce interrupt overhead.
UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware.
Additional BOD control enables further reduction of power consumption.

LPC2132FBD64 ARM decryption

2012-11-19T22:37:00.002-08:00

LPC2132FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.

LPC2131FBD64 ARM decryption

2012-11-19T22:37:00.000-08:00

LPC2131FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.

LPC2124FBD64 arm crack

2012-11-19T22:36:00.002-08:00

LPC2124FBD64 arm crack，ARM decryption，arm code extraction.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC.
With their compact 64-pin package, low power consumption, various 32-bit timers, 4-channel 10-bit ADC, PWM channels and 46 fast GPIO lines with up to nine external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. With a wide range of serial communications interfaces, they are also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.

LPC2114FBD64 arm crack

2012-11-19T22:36:00.000-08:00

LPC2114FBD64 arm crack，ARM decryption，arm code extraction.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC。
The LPC2114/2124 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128/256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.

LPC2106FHN48 mcu crack

2012-11-19T22:35:00.008-08:00

LPC2106FHN48 mcu crack，NXP ARM decryption, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM.
16/32-bit ARM7TDMI-S processor.
16/32/64 kB on-chip static RAM.
128 kB on-chip flash program memory. 128-bit-wide interface/accelerator enables high speed 60 MHz operation.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or full chip erase takes 400 ms.
Vectored Interrupt Controller with configurable priorities and vector addresses.
EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute whilst the foreground task is debugged with the on-chip RealMonitor software.
Embedded Trace Macrocell enables non-intrusive high speed real-time tracing of instruction execution.
Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s), and SPI.
Two 32-bit timers (7 capture/compare channels), PWM unit (6 outputs), Real Time Clock and Watchdog.
Up to thirty-two 5 V tolerant general purpose I/O pins in a tiny LQFP48 (7 mm x 7 mm) package.
60 MHz maximum CPU clock available from programmable on-chip Phase-Locked Loop with settling time of 100 us.
The on-chip crystal oscillator should have an operating range of 1 MHz to 25 MHz.
Two low power modes, Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V +- 8.3 pct).
I/O power supply range of 3.0 V to 3.6 V (3.3 V +- 10 pct) with 5 V tolerant I/O pads.

LPC2106FBD48 mcu crack

2012-11-19T22:35:00.004-08:00

LPC2106FBD48 mcu crack，NXP ARM decryption, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
New features implemented in LPC2104/2105/2106/01 devices
Fast GPIO port enables port pin toggling up to 3.5 times faster than the original device and also allows for a port pin to be read at any time regardless of its function.
UART 0/1 include fractional baud rate generator, autobauding capabilities, and handshake flow-control fully implemented in hardware.
Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.
SPI programmable data length and master mode enhancement.
Diversified Code Read Protection (CRP) enables different security levels to be implemented.
General purpose timers can operate as external event counters.

LPC2105FBD48 mcu crack

2012-11-19T22:35:00.001-08:00

LPC2105FBD48 mcu crack， NXP ARM DECRYPTION, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options up to 64 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, PWM channels, and 32 GPIO lines make these microcontrollers particularly suitable for industrial control and medical systems.

LPC2104FBD48 mcu crack

2012-11-19T22:34:00.001-08:00

LPC2104FBD48 mcu crack， NXP ARM DECRYPTION, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
The UART are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128 kB of embedded high speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty.

CY8C20496A-24LQXIT Microcontroller Reverse Engineering

2012-11-05T01:52:00.002-08:00

CY8C20496A-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.

Flexible on-chip memory
Three program/data storage size options:
8 KB flash/1 KB SRAM
16 KB flash/2 KB SRAM
32 KB flash/2 KB SRAM
50,000 flash erase/write cycles
Partial flash updates
Flexible protection modes
In-system serial programming (ISSP)
Full-speed USB
12 Mbps USB 2.0 compliant
Precision, programmable clocking
Internal main oscillator (IMO): 6/12/24 MHz ± 5%
Internal low speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
Precision 32 kHz oscillator for optional external crystal
Programmable pin configurations
Up to 36 general-purpose I/Os (GPIOs) (depending on
package)

CY8C20496A-24LQXI Microcontroller Reverse Engineering

2012-11-05T01:51:00.002-08:00

CY8C20496A-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.
Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
SPI master and slave: Configurable 46.9 kHz to 12 MHz
Three 16-bit timers
Watchdog and sleep timers
Integrated supervisory circuit
Emulated E2PROM using flash memory
Complete development tools
Free development tool (PSoC Designer?)
Full-featured, in-circuit emulator (ICE) and programmer
Full-speed emulation
Complex breakpoint structure
128 KB trace memory
Versatile package options
16-pin 3 × 3 × 0.6 mm QFN
24-pin 4 × 4 × 0.6 mm QFN
32-pin 5 × 5 × 0.6 mm QFN
48-pin SSOP
48-pin 7 × 7 × 1.0 mm QFN
30-ball WLCSP

CY8C20467-24LQXI Microcontroller Reverse Engineering

2012-11-05T01:50:00.004-08:00

CY8C20467-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .
QuietZone? Controller
Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
Ideal for proximity solutions
Overlay thickness of 15 mm for glass and 5 mm plastic
Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
Reliable and robust touch performance in noisy environments
Standardized user modules for overcoming noise
Low power CapSense? block with SmartSense? auto-tuning
Supports a combination of up to 31 buttons or 6 sliders, proximity
sensors
Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
SmartSense auto-tuning
Sets and maintains optimal sensor performance during
runtime
Eliminates system tuning during development and production
Compensates for variations in manufacturing process

CY8C20467-24LQXIT Microcontroller Reverse Engineering

2012-11-05T01:50:00.002-08:00

CY8C20467-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .
Programmable pin configurations
Up to 32 general-purpose I/Os (GPIOs)
Dual mode GPIO
High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
Configurable internal pull-up, high-Z, and open drain modes
Selectable, regulated digital I/O on port 1
Configurable input threshold on port 1
Versatile analog mux
Common internal analog bus
Simultaneous connection of I/O
High power supply rejection ratio (PSRR) comparator
Low-dropout voltage regulator for all analog resources

CY8C20467S-24LQXI Microcontroller Reverse Engineering

2012-11-05T01:49:00.004-08:00

CY8C20467S-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .

The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
The core
CapSense analog system
System resources
A common, versatile bus allows connection between I/O and the
analog system.
Each CY8C20x37/47/67/S PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 34 GPIOs are also included. The GPIOs
provide access to the MCU and analog mux.

CY8C20467S-24LQXIT Microcontroller Reverse Engineering

2012-11-05T01:49:00.002-08:00

CY8C20467S-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.
CapSense System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. The analog system is composed of the
CapSense PSoC block and an internal 1 V or 1.2 V analog
reference, which together support capacitive sensing of up to 31
inputs[3]. Capacitive sensing is configurable on each GPIO pin.
Scanning of enabled CapSense pins is completed quickly and
easily across multiple ports.
SmartSense? Auto-tuning
SmartSense auto-tuning is an innovative solution from Cypress
that removes manual tuning of CapSense applications. This
solution is easy to use and provides robust noise immunity. It is
the only auto-tuning solution that establishes, monitors, and
maintains all required tuning parameters of each sensor during
run time. SmartSense auto-tuning allows engineers to go from
prototyping to mass production without retuning for
manufacturing variations in PCB and/or overlay material
properties.

CY7C1041CV33-20VXE code extraction

2012-10-18T02:45:00.001-07:00

CY7C1041CV33-20VXE code extraction, chip decryption, mcu crack,
dsp crack .
The CY7C1041CV33 Automotive is a high performance CMOS
static RAM organized as 262,144 words by 16 bits.
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on I/O0
to I/O7
. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8
to I/O15
. For more information, see the Truth
Table on page 11 for a complete description of Read and Write
modes.
The input and output pins (I/O0
through I/O15
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).

CY7C1041CV33-20VXE code extraction

2012-10-18T02:41:00.001-07:00

CY7C1041CV33-20VXE code extraction, chip decryption, mcu crack,

dsp crack .
4-Mbit (256 K × 16) Static RAM
Features
Temperature ranges
Automotive-A: –40 °C to 85 °C
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1041BNV33
High speed
tAA = 10 ns (Automotive-A)
tAA = 10 ns (Automotive-E)
Low active power
432 mW (max)
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free and non Pb-free 44-pin 400 Mil SOJ, 44-pin
TSOP II and 48-ball FBGA packages

CY7C1041D-10VXIT code extraction

2012-10-18T02:35:00.001-07:00

CY7C1041D-10VXIT code extraction, chip decryption, mcu crack,

dsp crack .
The CY7C1041D is a high-performance CMOS static RAM
organized as 256K words by 16 bits. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0
to I/O7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8
to I/O15
. See the truth table
at the back of this data sheet for a complete description of

read
and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1041D is available in a standard 44-pin 400-mil-wide
body width SOJ and 44-pin TSOP II package with center power
and ground (revolutionary) pinout.

CY7C1041D-10VXIT code extraction

2012-10-18T02:30:00.001-07:00

CY7C1041D-10VXIT code extraction, chip decryption, mcu crack, dsp crack .
The CY7C1041D is a high-performance CMOS static RAM
organized as 256K words by 16 bits. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0
to I/O7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8
to I/O15
. See the truth table
at the back of this data sheet for a complete description of read
and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1041D is available in a standard 44-pin 400-mil-wide
body width SOJ and 44-pin TSOP II package with center power
and ground (revolutionary) pinout.

CY7C1041DV33-10BVXIT code extraction

2012-10-18T02:28:00.001-07:00

CY7C1041DV33-10BVXIT code extraction, chip decryption, mcu crack, dsp crack .
Features
Temperature ranges
Industrial: –40 °C to 85 °C
Pin and function compatible with CY7C1041CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power-down when deselected
TTL compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 48-ball VFBGA, 44-pin (400-mil) molded
SOJ, and 44-pin TSOP II Packages

CY7C1010DV33-10ZSXI code extraction

2012-10-18T02:22:00.001-07:00

CY7C1010DV33-10ZSXI code extraction, chip decryption, mcu crack,

dsp crack .
Features
Pin and function compatible with CY7C1010CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA at 10 ns
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 36-pin SOJ and 44-pin TSOP II packages

CY7C026A-20AXCT MCU Code Reading

2012-10-16T02:16:00.003-07:00

CY7C026A-20AXCT MCU Code Reading, Programm Reading, MCU Crack,

Chip Decryption.

The CY7C026A is a low power CMOS 16K x 16 dual-port static
RAM. Various arbitration schemes are included on the devices
to handle situations when multiple processors access the same
piece of data. Two ports are provided, permitting independent,
asynchronous access for reads and writes to any location in
memory. The device can be utilized as standalone 16-bit
dual-port static RAM or multiple devices can be combined to
function as a 32-bit or wider master/slave dual-port static RAM.
An M/S pin is provided for implementing 32-bit or wider memory
applications without the need for separate master and slave
devices or additional discrete logic. Application areas include
interprocessor/multiprocessor designs, communications status
buffering, and dual-port video/graphics memory.
Each port has independent control pins: Chip Enable (CE), Read
or Write Enable (R/W), and Output Enable (OE). Two flags are
provided on each port (BUSY and INT). BUSY signals that the
port is trying to access the same location currently being
accessed by the other port. The Interrupt flag (INT) permits
communication between ports or systems by means of a mail
box. The semaphores are used to pass a flag, or token, from one
port to the other to indicate that a shared resource is in use.

The
semaphore logic is comprised of eight shared latches. Only one
side can control the latch (semaphore) at any time. Control of a
semaphore indicates that a shared resource is in use. An
automatic power down feature is controlled independently on
each port by the chip enable pin.
The CY7C026A is available in 100-pin thin quad plastic flatpack
(TQFP) packages.

CY7C026AV-25AC MCU Code Reading

2012-10-16T02:16:00.000-07:00

CY7C026AV-25AC MCU Code Reading, Programm Reading, MCU Crack,

Chip Decryption.

Features
True dual-ported memory cells which enable simultaneous
access of the same memory location
4, 8 or 16 K × 16 organization
(CY7C024AV/025AV/026AV)
0.35 micron CMOS for optimum speed and power
High speed access: 20 ns and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master and Slave
chip select when using more than one device
On chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper byte and lower byte control
Pin select for Master or Slave (M/S)
Commercial and industrial temperature ranges
Available in 100-pin Pb-free TQFP and 100-pin TQFP

CY7C027AV-25AXI MCU Code Reading

2012-10-16T02:15:00.003-07:00

CY7C027AV-25AXI MCU Code Reading, Programm Reading, MCU Crack,

Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
[1]
)
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP