<?xml version='1.0' encoding='UTF-8'?><?xml-stylesheet href="http://www.blogger.com/styles/atom.css" type="text/css"?><feed xmlns='http://www.w3.org/2005/Atom' xmlns:openSearch='http://a9.com/-/spec/opensearchrss/1.0/' xmlns:blogger='http://schemas.google.com/blogger/2008' xmlns:georss='http://www.georss.org/georss' xmlns:gd="http://schemas.google.com/g/2005" xmlns:thr='http://purl.org/syndication/thread/1.0'><id>tag:blogger.com,1999:blog-3177702370682225642</id><updated>2024-09-21T08:14:05.137+08:00</updated><category term="科技快報"/><category term="國外公司"/><category term="微機電"/><category term="Optical MEMS"/><category term="國內公司"/><category term="Patent"/><category term="paper"/><category term="研討會"/><category term="energy harvesting"/><category term="其他"/><category term="顯示器"/><category term="accelerometer"/><category term="碎碎念"/><category term="inertial sensor"/><category term="Display"/><category term="Microphone"/><category term="加速規"/><category term="股票"/><category term="Packaging"/><category term="RF-MEMS"/><category term="矽麥克風"/><category term="BioMEMS"/><category term="CMOS-MEMS"/><category term="COMSOL"/><category term="E-PAPER"/><category term="FOUNDRY"/><category term="Fluidics"/><category term="LiDAR"/><category term="Medical"/><category term="Oscillator"/><category term="QMEMS"/><category term="Robot"/><category term="Sensor"/><category term="Solar"/><category term="lens"/><category term="scanning mirror"/><category term="書籍"/><category term="Assembly"/><category term="BOOK"/><category term="Bluetooth"/><category term="Cellular phone"/><category term="Chemical Sensor"/><category term="Dimple"/><category term="Electroplating"/><category term="Enerlgy"/><category term="Fuel cell"/><category term="Game"/><category term="Gyro"/><category term="IMU"/><category term="IPHONE"/><category term="Infrared sensor"/><category term="MicroLED"/><category term="Musical"/><category term="NEMS"/><category term="News"/><category term="Piezoelectric"/><category term="Pressure sonsor"/><category term="Projector"/><category term="Pump"/><category term="Relay"/><category term="Resonator"/><category term="SEMICON TAIWAN"/><category term="Shutter"/><category term="Sound"/><category term="Stanford"/><category term="University of Michigan"/><category term="minimal FAB"/><category term="thermal acutator"/><category term="transducer"/><category term="代工"/><category term="太陽能"/><title type='text'>MEMS一級棒</title><subtitle type='html'>MEMS is GOOD</subtitle><link rel='http://schemas.google.com/g/2005#feed' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/posts/default'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default?redirect=false'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/'/><link rel='hub' href='http://pubsubhubbub.appspot.com/'/><link rel='next' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default?start-index=26&amp;max-results=25&amp;redirect=false'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><generator version='7.00' uri='http://www.blogger.com'>Blogger</generator><openSearch:totalResults>209</openSearch:totalResults><openSearch:startIndex>1</openSearch:startIndex><openSearch:itemsPerPage>25</openSearch:itemsPerPage><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-1145497240469391510</id><published>2019-05-15T15:23:00.002+08:00</published><updated>2019-05-15T15:25:02.357+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="研討會"/><title type='text'>微機電與感測器的全球商機及技術革新</title><summary type="text">
5/29 SEMI 線上研討邀請到安侯建業 (KPMG) 會計師事務所合夥人 Scott Jones ，分享 KPMG最新發布的「2019 半導體展望報告」(Semiconductor Executive Outlook for 2019) 中對於今年全球半導體發展態勢的分析，亦綜合探究微機電及感測器(MEMS and Sensors)對於驅動半導體產業成長所扮演之關鍵角色。
除此之外，在本次線上論壇中也將深入剖析微機電及感測器(MEMS and Sensors) 在車用、智慧製造、智慧醫療及穿戴裝置等應用市場中的商機。



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日期：2019 年 5 月 29 日 (三)
時間：8:00 AM-9:00 AM(加州) / 11:00 PM-12:00 AM(台灣)

*若無法即時線上觀看，我們將於會後提供影片連結予報名者。


活動聯絡人:
SEMI Ms.</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/1145497240469391510/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/1145497240469391510' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1145497240469391510'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1145497240469391510'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/05/blog-post.html' title='微機電與感測器的全球商機及技術革新'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhC5XtbuijXEf6-eWCiwDZDOUh3foG2LrhXCUfhyphenhyphen8L8catThSAn6LAiIphxX5wor29_PMSNullFuEjo9-9QmqyV606w8WND0etRzD8YqWqbK00e5_dWi4LELjwomLbx7FL57H4P3iKhHUk/s72-c/%25E5%25BE%25AE%25E6%25A9%259F%25E9%259B%25BB%25E8%2588%2587%25E6%2584%259F%25E6%25B8%25AC%25E5%2599%25A8%25E7%259A%2584%25E5%2585%25A8%25E7%2590%2583%25E5%2595%2586%25E6%25A9%259F%25E5%258F%258A%25E6%258A%2580%25E8%25A1%2593%25E9%259D%25A9%25E6%2596%25B0.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-5704630185485224809</id><published>2019-05-14T16:32:00.001+08:00</published><updated>2019-05-14T16:36:23.254+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="LiDAR"/><category scheme="http://www.blogger.com/atom/ns#" term="國外公司"/><title type='text'>AEye Granted Foundational Patents For Core Solid-State MEMs-Based Agile LiDAR And Embedded AI Technology</title><summary type="text">AEye，專注於LiDAR產品的公司，目前有的產品為AE110，AEYE的技術結合世界首款靈敏的MOEMS LiDAR，預融合弱光攝像頭，嵌入式人工智能，實現軟件可定義和硬件可擴展，並可根據實時需求進行動態調整。


Pleasanton, CA – March 7, 2018 – On the heels of its automotive product debut at the January Consumer Electronics Show (CES), artificial perception pioneer AEye today announced it has been awarded foundational patents with numerous claims for its solid state MEMs-based agile LiDAR and </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/5704630185485224809/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/5704630185485224809' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5704630185485224809'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5704630185485224809'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/05/aeye-granted-foundational-patents-for.html' title='AEye Granted Foundational Patents For Core Solid-State MEMs-Based Agile LiDAR And Embedded AI Technology'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjkEzyQC9OzPz1c_49es2VuRDa47FCdiBP1qKc0Bfqt9sGovn0FzWLpPWmwZNb0F6cZQsqdvpCztaDW09btmBJXfFFooIF_mpThQ8RY5GbzPs8Utxdu2sEzOJh1pn5Vz41sqMYrHHppsuQ/s72-c/AEye+Granted+Foundational+Patents+For+Core+Solid-State+MEMs-Based+Agile+LiDAR+And+Embedded+AI+Technology.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-5748527873903277845</id><published>2019-05-08T16:45:00.000+08:00</published><updated>2019-05-14T16:52:13.677+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="LiDAR"/><category scheme="http://www.blogger.com/atom/ns#" term="國外公司"/><title type='text'>MicroVision to Ship the Explorer Edition of its MEMS-based 3D Consumer LiDAR</title><summary type="text">MicroVision，預計開始在2019年三月供貨，基於MEMS-BASED的LiDAR，特點為


“Our Explorer Edition offers our customers the opportunity to begin developing potential smart products leveraging this new class of compact, mid-range, depth sensors,” said Perry Mulligan, MicroVision’s Chief Executive Officer.

特色重點如下：

15.5 million points/sec depth data throughput
10 m range (1 Klux ambient)
0.1° x 0.1° native angular </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/5748527873903277845/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/5748527873903277845' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5748527873903277845'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5748527873903277845'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/05/microvision-to-ship-explorer-edition-of.html' title='MicroVision to Ship the Explorer Edition of its MEMS-based 3D Consumer LiDAR'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgqMbDE4WFMEFSVn4iIpPQBhg_Fxm6jx33U9FHHNN6W5MAPdY75TLjYWY8v2u67sXoVELhZdgCMJQEzc8qA73hf7uLRgLrmf9Xr5lnAr7UOyPyd0Cu8MhTOWrw21IBPtEYU4-1PuGsxr3Q/s72-c/MEMS+Based+Consumer+LiDAR.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-8261200705167594762</id><published>2019-04-25T16:24:00.001+08:00</published><updated>2019-04-25T16:24:07.529+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="研討會"/><title type='text'>IEEE International Conference on Micro Electro Mechanical Systems (MEMS)</title><summary type="text">The 33rd International Conference on&amp;nbsp; Micro Electro Mechanical Systems (IEEE MEMS 2020)




今年2019年，在韓國舉辦了第32屆的IEEE MEMS研討會；明年，也是IEEE MEMS的第33屆研討會了，2020年，是在加拿大的溫哥華舉辦，整理了一下歷年舉辦的研討會的日期及點地點，如下表所示：


 
 
 
 

  IEEE
  Date
  Place/Country
 

  MEMS 2020
  18-22 January 2020
  Vancouver
  Convention Centre/CANADA
 

  MEMS 2019
  27-31 January 2019
  Seoul/Korea
 

  MEMS 2018
  21-25 January </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/8261200705167594762/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/8261200705167594762' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8261200705167594762'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8261200705167594762'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/ieee-international-conference-on-micro.html' title='IEEE International Conference on Micro Electro Mechanical Systems (MEMS)'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEg5N_LBQ7iOLQM3FE5BJkJRcdeJjR_klUTFF0ZH1bCWzee5Z0qBVy1addAPA0SKzHObOas9NZMhWU0JJV2jFquzR2eryVCIpdRPylIR7LvBCeD_e9zGtdh6QWpr17Se9TE8BrPbWupkZFc/s72-c/MEMS+2020.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-1642988889905159493</id><published>2019-04-23T18:48:00.000+08:00</published><updated>2019-04-23T18:48:08.356+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><title type='text'>Asymmetric mems mirror assembly</title><summary type="text">Title: Asymmetric mems mirror assembly
USPTO Applicaton #: #20170090184
Assignee: Apple Inc.

A mirror assembly includes a frame having a central opening and a mirror plate, which is contained within the central opening of the frame and is shaped to define separate first and second mirrors connected by a bridge extending between the first and second mirrors. A pair of hinges are connected between</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/1642988889905159493/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/1642988889905159493' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1642988889905159493'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1642988889905159493'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/asymmetric-mems-mirror-assembly.html' title='Asymmetric mems mirror assembly'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiu7269tCaeF19jUQMBxSdYB3OLA3DzvBjuCsR9z8-X6ppAP-rbH_kO6LDF56iBTJrINYKlpn-3qSbVNkn0gPWdfcDHWN4mtzAblH4i8woetU4yiohEKKDJkOxKYWRqn5q4YAJC2457SrA/s72-c/Asymmetric+mems+mirror+assembly.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-6909349582492537060</id><published>2019-04-20T18:32:00.000+08:00</published><updated>2019-04-20T18:32:00.300+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><category scheme="http://www.blogger.com/atom/ns#" term="scanning mirror"/><title type='text'>Multi-hinge mirror assembly</title><summary type="text">Title:Multi-hinge mirror assembly
USPTO Applicaton #: #20170090186
Assignee: Apple Inc.

A scanning device includes a substrate, which is etched to define a recess in the substrate and to define the following structures contained in the recess: At least first and second mirrors are disposed along a common axis of rotation. Torsion hinges extend collinearly along the axis of rotation and connect </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/6909349582492537060/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/6909349582492537060' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6909349582492537060'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6909349582492537060'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/multi-hinge-mirror-assembly.html' title='Multi-hinge mirror assembly'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEisTxAjynrJZQkvShIotqkBMGCH5EYqj3J-SixWnZcAbnnjP88OEBS7SUlYL7NCFvb52SWT1TofdikrexS9AJikD8R6uQZzHDC9EWe5LfA9Pk4DIa1gRGjPSqIm_J5icOtNeyXAPOPAbCU/s72-c/Multi-hinge+mirror+assembly.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-3138928111657013374</id><published>2019-04-16T16:38:00.000+08:00</published><updated>2019-04-16T16:38:20.141+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><category scheme="http://www.blogger.com/atom/ns#" term="scanning mirror"/><title type='text'>Multi-mirror scanning depth engine</title><summary type="text">Title: Multi-mirror scanning depth engine
US Patent: 10,247,812
Assignee: Apple Inc.

Abstract: A scanning device includes a scanner, which includes a base and a gimbal, mounted within the base so as to rotate relative to the base about a first axis of rotation. A transmit mirror and at least one receive mirror are mounted within the gimbal so as to rotate in mutual synchronization about </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/3138928111657013374/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/3138928111657013374' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/3138928111657013374'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/3138928111657013374'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/multi-mirror-scanning-depth-engine.html' title='Multi-mirror scanning depth engine'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgqt0uHpIV8YmyMGCXbP7awEvSBtZcmHCxYFkcOtSqwsF-m0qSAS5KJwwdCLr_MSjx28mCfXOn3XU3qjHhgtLVsWUalE0qkTH9fe_-gNmYkc8fhyphenhyphen3e6Cpuk_KyvAJGbOEVcQZ7IHc9iVps/s72-c/Multi-mirror+scanning+depth+engine.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-1228806482930740054</id><published>2019-04-10T13:16:00.003+08:00</published><updated>2019-04-10T16:52:38.049+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><category scheme="http://www.blogger.com/atom/ns#" term="國內公司"/><title type='text'>台灣專利檢索 MEMS AND TSMC </title><summary type="text">在台灣，很少人沒有聽過台積電的，趁此機會，分析一下台積在做MEMS的狀況

透過中華民國專利檢索系統，使用快速版=&amp;gt;專利檢索=&amp;gt;簡易檢索，條件如下：
1、關鍵字：『MEMS AND 台灣積體電路製造股份有限公司』
2、公開/公告日：不限
3、條列式簡目欄位：專利編號、公告/公開日、申請號、專利名稱、國際分類號、申請人、案件狀態
結果顯示，全部共有104篇：發明：104篇。新型：0篇。新式樣/設計：0篇。

分析結果，可以發現，依國際分類號IPC來分，前四大比例為：16.3%，15.4%、6.7%及5.8%
B81B-007/02(包含個別特定功能相異的電氣或光學裝置，如：微電子機械系統（MEMS）)-共有17篇
B81C-001/00(在基片內或其上的裝置或系統之製造或處理)-共有16篇
B81B-007/00(微米結構系統 )-共有7篇
B81B-003/00(具有可撓或可</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/1228806482930740054/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/1228806482930740054' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1228806482930740054'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/1228806482930740054'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/mems-1mems-and-2-3-10410400-ipc16.html' title='台灣專利檢索 MEMS AND TSMC '/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiqmYoM9ItNjOkTGtFaJwOZREangiU_hok227np1zuZp9It1X5b7SG4vM7zaQmZx1W5sWqBmVo4QmTjKmevjMNCrClmrldNEfmodzVqHbO9lFybN5ULcct-0QmaBVNrcm97cOSGg1gV4nk/s72-c/MEMS+AND+TSMC.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-2800662207168881183</id><published>2019-04-03T10:37:00.000+08:00</published><updated>2019-04-03T19:08:58.869+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Microphone"/><category scheme="http://www.blogger.com/atom/ns#" term="國內公司"/><category scheme="http://www.blogger.com/atom/ns#" term="矽麥克風"/><title type='text'>鈺太科技</title><summary type="text">
邱景宏對技術遠景的樂觀，讓他多年來堅持研發布局。如今，鈺太科技靠著MEMS麥克風的技術優勢，成為全球筆電廠、耳機大廠的關鍵供應商，要助攻Acer、Asus、Dell等國際企業開發新一代智能產品。
本公司成立於民國94年，公司的成就，來自於每個員工的付出，我們重視每一位員工，除了有良好的工作環境之外，也提供學習及成長的空間，歡迎優秀的朋友一起加入。公司地址：新竹市新竹科學園區篤行路6-1號5樓

麥克風專利，目前還沒有找到，是有幾篇跟大陸公司一起的專利。後續會持續關注





Refs
鈺太麥克風超展開 宏碁、華碩新品都靠它
鈺太科技上櫃案過關
全台首家微機電聲學系統廠鈺太　 5月9日登興櫃
政府看優勢／鈺太匯聚產學能量 合攻穿戴裝置
http://www.zilltek.com/
Zilltek社製MEMSマイクロフォン
</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/2800662207168881183/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/2800662207168881183' title='1 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2800662207168881183'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2800662207168881183'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/04/blog-post.html' title='鈺太科技'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjt-JeYe84kegC4crtPOpg0bcRFidd1qiJ-2QVJACeLWvtR0rrK0zZgAbHoER4gf-dUI6N9BmwD4XxbvZKy7zKKvlFgoOb2Ln7hY_Y3dKMTFwrSFyJBdIvEa5YebtNXbGSa9PBOs0Uuboo/s72-c/%25E9%2588%25BA%25E5%25A4%25AA.png" height="72" width="72"/><thr:total>1</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-4914211920047092600</id><published>2019-03-29T18:56:00.002+08:00</published><updated>2019-03-29T18:56:47.715+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="IMU"/><category scheme="http://www.blogger.com/atom/ns#" term="國外公司"/><category scheme="http://www.blogger.com/atom/ns#" term="科技快報"/><title type='text'>Micro-Inertial – High-precision MEMS Inertial Sensors and IMUs</title><summary type="text">專業MEMS製造商，專精於高精密的MEMS慣性感測器和慣性測量單元

Our innovative core technologies in ruggedized high-performance sensing, MEMS manufacturing, 3D packaging, and integrated electronics have been developed over nearly a decade of research and testing, with partial support from National Aeronautics and Space Administration (NASA), Air Force Research Laboratory (ARFL), and Defense Advanced Research Projects Agency </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/4914211920047092600/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/4914211920047092600' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4914211920047092600'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4914211920047092600'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/03/micro-inertial-high-precision-mems.html' title='Micro-Inertial – High-precision MEMS Inertial Sensors and IMUs'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEilgVxp-tTy9p5quvTlC662N7hrNIB0CkhGXqVxYRcgpX91njcNUrx6-XuAaYeH0V-K1adOecJ9Z7pgXbmloEb8EK6tmAiS0C_qWiMBSOVeGX2GwLULsn4lya44XM8MqE2r_TN8p5Y5JCs/s72-c/micro-inertial.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-3586398458859981613</id><published>2019-03-28T10:05:00.002+08:00</published><updated>2019-03-28T10:08:28.070+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Microphone"/><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><title type='text'>MEMS microphone encapsulation structure(一种mems麦克风封装结构)</title><summary type="text">MEMS microphone encapsulation structure
申請公佈號：CN106604190A
申請人：无锡红光微电子股份有限公司
Abstract
The invention provides an MEMS microphone encapsulation structure. With the structure adopted, the back cavity volume of MEMS microphones is increased, and the sensitivity and signal-to-noise ratio of MEMS microphones are increased. The MEMS microphone encapsulation structure comprises a PCB, and further </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/3586398458859981613/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/3586398458859981613' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/3586398458859981613'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/3586398458859981613'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/03/mems-microphone-encapsulation-structure.html' title='MEMS microphone encapsulation structure(一种mems麦克风封装结构)'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjh-QSjH_rNqOakDFQ0IxvVAVwz62UNUlbxN8jwds94zDbh4vd7-Plsx-ygNI2auCfQv7AzSBL6XejWHOgozUgLqWFd2oUGfgYHEKnOs9PRJNXlhm3rn3NPywcJY8XImGpDiqiLnlrn38M/s72-c/MEMS+microphone+encapsulation+structure.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-852419165343264688</id><published>2019-03-26T12:44:00.000+08:00</published><updated>2019-03-26T12:46:48.388+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><category scheme="http://www.blogger.com/atom/ns#" term="transducer"/><title type='text'>Sound transducer with housing and MEMS structure</title><summary type="text">


Title: Sound transducer with housing and MEMS structure
US Patent: 10,231,061
Assignee: Infineon Technologies AG
Abstract:
&amp;nbsp;A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/852419165343264688/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/852419165343264688' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/852419165343264688'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/852419165343264688'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/03/sound-transducer-with-housing-and-mems.html' title='Sound transducer with housing and MEMS structure'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhjPQDXuN9rcodQSFGIgJUQZfgJ0K-igx6N27wECE2uPg2148UjozbpYQSe5881Z6uXfXynZAvF3rLtvTy9nBJ9-D1udJeY1Yaua8yowQIWgI5N5JwmVsob46ZRAOK7p9PcgRe4_exU3aQ/s72-c/SOUND+TRANSDUCER+WITH+HOUSING+AND+MEMS+STRUCTURE.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-2906812936405881868</id><published>2019-03-20T13:36:00.000+08:00</published><updated>2019-04-12T13:37:16.697+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="研討會"/><title type='text'>高性能慣性感測器助力運動物聯網</title><summary type="text">
研討會介紹高度可靠、智慧和互連感測器的可用性推動工業效率邁上新臺階。在許多情況下，不斷提高這些感測器節點的自動化和移動化程度有許多好處，因此感測器節點的精密運動跟蹤對應用成功來說至關重要。新一代工業感測器尺寸更小、性價比更高，支持厘米級定位精度；實現運動物聯網(IoMT)。


演講專家

Bob Scannell-業務開發經理&amp;nbsp;Bob Scannell是ADI公司MEMS慣性感測器產品的業務開發經理。他在ADI公司工作已超過20年，先後從事感測器、DSP、無線產品的各種技術行銷和業務開發工作。之前他曾在Rockwell International公司從事設計和市場方面的工作。他擁有加州大學洛杉磯分校電氣工程學士學位和南加州大學電腦工程碩士學位

Ref

高性能慣性感測器助力運動物聯網
</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/2906812936405881868/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/2906812936405881868' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2906812936405881868'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2906812936405881868'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/03/blog-post.html' title='高性能慣性感測器助力運動物聯網'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-126652894721908986</id><published>2019-02-20T14:29:00.000+08:00</published><updated>2019-03-27T14:34:09.465+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="MicroLED"/><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><title type='text'>MicroLED patent survey</title><summary type="text">依照中華民國專利檢索系統，關鍵字：『MICROLED』來檢索

在檢索頁面，不做任何的判斷，直接找，共有15筆發明專利，其中

其中，未審查/公開：9篇，核准：4篇，核駁：1篇，結案1篇。

核准的4篇，都是同一家公司：啟端光電股份有限公司。分別：

1、BOTTOM EMISSION MICROLED DISPLAY AND A REPAIR METHOD THEREOF



2、MICROLED DISPLAY PANEL



3、DATA DRIVER OF A MICROLED DISPLAY



4、TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME







檢索15篇如下：



 
 
 
 
 
 

  專利編號</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/126652894721908986/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/126652894721908986' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/126652894721908986'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/126652894721908986'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/02/microled-patent-survey.html' title='MicroLED patent survey'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhgLVTO9q-SJHXJD2alZxPDDBdt2FXyKUjgH6iSgg7eDhgKp9kqVGrFGxIbq-_LGYISb085H6DvkHo2Y76aK6htVA-I8mtpp4NlMmwvghyvdf43lRMxUfJt9TmcHdQ1up_0D5VEyYzTFuE/s72-c/BOTTOM+EMISSION%25C2%25A0MICROLED%25C2%25A0DISPLAY+AND+A+REPAIR+METHOD+THEREOF.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-5670391170788050307</id><published>2019-01-31T13:22:00.000+08:00</published><updated>2019-03-28T13:28:26.331+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><title type='text'>2018~2019 MEMS 專利分析 MEMS patent survey</title><summary type="text">透過中華民國專利檢索系統，使用快速版=&amp;gt;專利檢索=&amp;gt;簡易檢索，條件如下：
1、關鍵字：『MEMS』
2、公開/公告日：2018/01/01~2018/12/31
3、條列式簡目欄位：專利編號、公告/公開日、申請號、專利名稱、國際分類號、申請人、案件狀態

結果顯示：發明：120篇。新型：1篇。新式樣/設計：0篇。



分析結果，可以發現，依國際分類號IPC來分，前三大分別為：
B81B-007/02(包含個別特定功能相異的電氣或光學裝置)-26篇
B81B-003/00(具有可撓或可變形元件的裝置)-15篇
B81C-001/00在基片內或其上的裝置或系統之製造或處理)-7篇



在IPC分類，B81B-007/02的26篇中，進一步分析申請人，前三名分別為：
英國商席瑞斯邏輯國際半導體有限公司CIRRUS LOGIC INTERNATIONAL </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/5670391170788050307/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/5670391170788050307' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5670391170788050307'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/5670391170788050307'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2019/01/20182019-mems.html' title='2018~2019 MEMS 專利分析 MEMS patent survey'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjLlAbdxftpB__zuq3owygVWyUQQ3bU-JS4aoqcLBbob8Ftt3QhQKMIN-mjIsdzQ4e39to_GGwcC92xjb06Pff5tYfOChZ7wc0gpncqNEX8v64fm9VOlphJoN0k503GuCpD2HpVag5z8kM/s72-c/MEMS+PATENT-3.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-7096355618750616304</id><published>2018-10-10T15:52:00.000+08:00</published><updated>2019-03-26T15:58:54.067+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="minimal FAB"/><title type='text'>minimal FAB</title><summary type="text">從半導體展看到的專題，還蠻有意思的，就google一下相關訊息

Minimal fab提供高價值和小體積的半導體工廠，包括了半英寸晶圓的超小型等器具，橫河電機(Yokogawa)於2016年4月在東京武藏野市建立了最小的Fab應用實驗室。


其中關鍵作動因子為其將直徑12.5mm或13.5mm的小尺寸晶圓放入稱為「Shuttle」的密閉容器，透過設備進行製程處理，在非無塵室環境下進行晶圓製造。隨著晶圓及生產設備小型化，可以減少或不需要半導體生產所需化學藥劑及廢液處理設備，設備電源也可以用家用 110V 的電力，大幅降低工廠建設成本及空間。

從表中可以看到：Minimal Fab Equipment List，目前可以用的機台，及待開發的機台生產時間



Focused Light Heating CVD及Ion Implanter預計可以在2020年可以完成

其它如</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/7096355618750616304/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/7096355618750616304' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/7096355618750616304'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/7096355618750616304'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2018/10/minimal-fab.html' title='minimal FAB'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEivqNLELMVBPW88OcNHeQVQUc5Vj6QkMxz75EdLUHVd8qIkv6vNt1XNKRWJmgiRaJIfnbsnmwJe0wIO3UTChXYYxp1JGYMjeorTNFQxdASrUh_1fWp8IgzHkwFIuEswRFuY_Eu9meu1UJE/s72-c/Minimal+Fab+Equipment+List.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-8030773490709152927</id><published>2018-09-08T14:52:00.000+08:00</published><updated>2019-03-26T14:55:50.893+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="SEMICON TAIWAN"/><category scheme="http://www.blogger.com/atom/ns#" term="研討會"/><title type='text'>SEMICON Taiwan 2018 </title><summary type="text">時間：2018.09.05~2018.09.07

天氣，不是很好，但即來之，則安之，先來一張看過很多次的外觀：



參觀展覽，有興趣的2個主題：

1、MICRO LED 製程顯示器相關運用技術




2、minimal FAB















實際機台展演



其它花絮








</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/8030773490709152927/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/8030773490709152927' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8030773490709152927'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8030773490709152927'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2018/09/semicon-taiwan-2018.html' title='SEMICON Taiwan 2018 '/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjcR2iJHT1amIOdc-YdaJkjXYxJF0PIScHo683IiprETE4XBgLEHbi2o2QwfyV2YNTN7ZmOls5HDMsfSy3o_8uQoLkYLRjJMYtsOiJyHBq5IxZ3zFRxCxlQrmsxCokLVJJyUJyoy8Yaap0/s72-c/IMG_2533.JPG" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-4005247831574584178</id><published>2011-11-20T13:46:00.000+08:00</published><updated>2011-11-20T13:46:24.133+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Packaging"/><category scheme="http://www.blogger.com/atom/ns#" term="Patent"/><title type='text'>Method for capping a MEMS wafer</title><summary type="text"> &amp;nbsp;
Title:  Method for capping a MEMS wafer &amp;nbsp;&amp;nbsp;  
US. Patent: 8,058,144  Assignee: Analog Devices, Inc.   Abstract: A method for capping a MEMS wafer to form a hermetically sealed  device. The method includes applying a glass bonding agent to the cap wafer and  burning off organic material in the glass bonding agent. The cap wafer/glass  bonding agent combination is then cleaned to </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/4005247831574584178/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/4005247831574584178' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4005247831574584178'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4005247831574584178'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/11/method-for-capping-mems-wafer.html' title='Method for capping a MEMS wafer'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhqDQoKooCyeMSZrb7Aioq4pR6gnzNy6C2JabFNNdmrysiB_LMc7olwU2rLE4VVMPmB9FHliPjo5V2R9mjtgb9GmaLEbl2wa3PS5DQotpnHCWIASCP1idgxIUw8sqLN59FfO1NtyWkaW_I/s72-c/patenr111.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-4631302049621764330</id><published>2011-11-20T13:41:00.002+08:00</published><updated>2011-11-20T13:48:05.142+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="科技快報"/><title type='text'></title><summary type="text">

Researchers at the University of Twente&#39;s MESA+ research institute, together with ASML, TNO (the Netherlands Organisation for Applied Scientific Research) and TU/e (Eindhoven University of Technology) have developed a method for etching 3D structures in silicon. These structures behave as photonic crystals (semiconductors for light), making it possible to manipulate light in all sorts of novel </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/4631302049621764330/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/4631302049621764330' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4631302049621764330'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4631302049621764330'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/11/researchers-at-university-of-twentes.html' title=''/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhB0y0tVKhjpb7KdEgYiBitvDLUef7uFo5pNly5VjIDKzC19dutj1Ni-HwFNrp9DB1CJ4-oTusdkdV5NMlgZBFqr8wq3DcWTKnUM5X9Q2qkMWc22z-ZgwiwkICZyMz74qOEFXayIS-25bk/s72-c/electronmic3Ddiax250.jpg" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-2241210653081356309</id><published>2011-08-11T00:27:00.000+08:00</published><updated>2011-08-11T00:27:08.155+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="COMSOL"/><title type='text'>Electrostatic force for comsol simulation</title><summary type="text">

ES FORCE VS DISPLACEMENT

靜電力模擬 
真的有這麼簡單就模擬出來了嗎???
我還很懷疑耶


</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/2241210653081356309/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/2241210653081356309' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2241210653081356309'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/2241210653081356309'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/08/electrostatic-force-for-comsol.html' title='Electrostatic force for comsol simulation'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgXEyTzOzk5JDZwxINWrn1fnNX6AR0_GqySQEtDmLI6mbH11lAU5x8p7dx8kw-om5ytuciIFKnYuKT9tsqf2V2sQcEVonXSz49kPSpRbQTj2SLMErXNVyDsqwS9IXTSnkFxDRkdESyDBNo/s72-c/sshot-1.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-4989169890978519030</id><published>2011-08-07T15:57:00.001+08:00</published><updated>2011-08-07T15:58:50.140+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="COMSOL"/><title type='text'>COMSOL simulation</title><summary type="text">


好吧
這是什麼，我也不知道

COMSOL SIMULATION FOR MEMBER DEFOREM</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/4989169890978519030/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/4989169890978519030' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4989169890978519030'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4989169890978519030'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/08/comsol-simulate.html' title='COMSOL simulation'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEhsFiqvK2i8bPapE1Ry9SWdNy8mEyEhhbnDFERELLvF1dnENx0F9olk6q4nf6EOLjEPhLa91fdL6ZqHiCXLW-MAGs3HXDPuWVPOYnL1lOum05NahLgftenDMv9itaagpy7oHirQKMb944k/s72-c/sshot-1.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-6485237021945879946</id><published>2011-07-02T10:55:00.001+08:00</published><updated>2011-07-02T10:55:37.749+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Display"/><category scheme="http://www.blogger.com/atom/ns#" term="Projector"/><category scheme="http://www.blogger.com/atom/ns#" term="科技快報"/><title type='text'>Why the future of mobile is screenless, touchless</title><summary type="text">
&amp;nbsp;“A phone today is a a value-added service, a ‘teleputer,’  a creature born with genes coming from a cell phone and a personal  computer,” according to independent researcher Szymon Slupik.
Speaking yesterday at the invitation-only Emerging Communications Conference &amp;amp; Awards  (eComm), the Krakow-based futurist explained that by 2020, a mobile  phone as we know it will disappear, </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/6485237021945879946/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/6485237021945879946' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6485237021945879946'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6485237021945879946'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/07/why-future-of-mobile-is-screenless.html' title='Why the future of mobile is screenless, touchless'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiz8Cr5ubihX-Z2ZYef33oM-qoe8QHZHeuNwo66UZTX66rap972hXHtPbDQ-DfoB_wGTQq7X0sPYYq4oMxjplD8tymFvIaOszCNQMqCbYiApK0o4Q9BzyQJDVgcsZniiKQj3tmGB2oHgAw/s72-c/img_1612.jpg" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-6750980773004298429</id><published>2011-06-19T23:34:00.000+08:00</published><updated>2011-06-19T23:34:09.595+08:00</updated><title type='text'>Microchemomechanical Systems: Surgeons We Can Swallow</title><summary type="text">

by Hilary Gallagher                                              published: 2011-06-08                         &amp;nbsp;                                            
Since Richard Feynman coined the phrase  &quot;swallow-the-surgeon&quot;, scientists have been attempting to create tiny  devices that can do the work of the surgeon – but from inside the body.  Such a device must be tiny but responsive – </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/6750980773004298429/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/6750980773004298429' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6750980773004298429'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/6750980773004298429'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/06/microchemomechanical-systems-surgeons.html' title='Microchemomechanical Systems: Surgeons We Can Swallow'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEi5o9waccT0ISS033YvZ0aD86TSnvA1ZnLFV9qfuPO2yRsSSaxZi3CtrP6lp_u7hfikUUkRzPt-sw9zWBp9Wx4djA98yvgrZmeOpPffwhxHiyx80NbLTqck7hLVa9w7UYzGs-kvhbJCCC0/s72-c/12fbbd7ac4c.jpg" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-4839136233698323270</id><published>2011-06-19T23:28:00.000+08:00</published><updated>2011-06-19T23:28:45.970+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="Microphone"/><title type='text'>Implantable microphone for hearing systems</title><summary type="text"> &amp;nbsp;
Title:  Implantable microphone for  hearing systems &amp;nbsp; &amp;nbsp; &amp;nbsp;&amp;nbsp;&amp;nbsp;Application Number: 20110144415 Assignee: MED-EL Corporation Abstract: An implantable microphone for use in  hearing systems includes a housing having a sidewall, a first membrane coupled  to a top portion of the housing and configured to move in response to movement  from an auditory ossicle, and a second</summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/4839136233698323270/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/4839136233698323270' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4839136233698323270'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/4839136233698323270'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/06/implantable-microphone-for-hearing.html' title='Implantable microphone for hearing systems'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiYt4WDBswSU7XALshVad8JlEzDoJHQs4pAunkO0xHrCKcH3RNwNjplCNP5UJrRv-pC6trYOhKff6ygWkc7EgAruHz_ZQllEycnH4YrlWipQyMN7ywCk5tBEevKoViOaeBIQLihACSgl84/s72-c/PATENR.png" height="72" width="72"/><thr:total>0</thr:total></entry><entry><id>tag:blogger.com,1999:blog-3177702370682225642.post-8715480840018722713</id><published>2011-05-20T17:30:00.001+08:00</published><updated>2011-05-20T17:30:50.227+08:00</updated><category scheme="http://www.blogger.com/atom/ns#" term="科技快報"/><title type='text'>MEMS Market Outlook: Yole Développement ups its forecast on current market strength</title><summary type="text">Medical Design Technology | Monday, May 9, 2011After three relatively flat years in 2007 to 2009, final figures  indicate total MEMS sales jumped some 25% in 2010, to $8.6 billion,  thanks largely to the surprisingly fast recovery of the automotive  industry and its inventory restocking, as well as the boom in smart  phones and tablets with motion sensing.&amp;nbsp; But stronger than anticipated  </summary><link rel='replies' type='application/atom+xml' href='http://tzjwinfcha.blogspot.com/feeds/8715480840018722713/comments/default' title='張貼留言'/><link rel='replies' type='text/html' href='http://www.blogger.com/comment/fullpage/post/3177702370682225642/8715480840018722713' title='0 個意見'/><link rel='edit' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8715480840018722713'/><link rel='self' type='application/atom+xml' href='http://www.blogger.com/feeds/3177702370682225642/posts/default/8715480840018722713'/><link rel='alternate' type='text/html' href='http://tzjwinfcha.blogspot.com/2011/05/mems-market-outlook-yole-developpement.html' title='MEMS Market Outlook: Yole Développement ups its forecast on current market strength'/><author><name>TZJ</name><uri>http://www.blogger.com/profile/14385352994088148015</uri><email>noreply@blogger.com</email><gd:image rel='http://schemas.google.com/g/2005#thumbnail' width='32' height='32' src='//blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiWOb900fkbR3IJdGUX-IkvlwhV8F1NmqAksgv2Z32DPvXWEggcmn6DT_n5kfYacQNnrX1MOhcBz4anSkvpVp8tUTLa6_DloufeIzhjDLtD4lc6p-zPIqiljiHUeRgGsEg/s151/40.bmp'/></author><media:thumbnail xmlns:media="http://search.yahoo.com/mrss/" url="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiI8dyKaV3rhSFEFsovg3GO-cYKxdE7VF8xhlmXTktQhaXDoZiDwa_LOitXKa4WAuWnlJ2IeNJlPHeTVhnCUCu2ardQhUaZPbwpKfkc-BPkTFaCX7pf7PEwKVK7MhzYYSRzEv2KRW8Fr1o/s72-c/Analyst+Corner.jpg" height="72" width="72"/><thr:total>0</thr:total></entry></feed>