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	<title>PCB Design and Fabrication Institute</title>
	
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	<description>A beginner's guide to printed circuit boards.</description>
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		<title>Etch Factor</title>
		<link>http://feedproxy.google.com/~r/PcbDesignAndFabricationInstitute/~3/lMoifLBfHsw/</link>
		<comments>http://www.pcbdesignschool.com/2013/02/10/etch-factor/#comments</comments>
		<pubDate>Sun, 10 Feb 2013 21:43:42 +0000</pubDate>
		<dc:creator>David Duross</dc:creator>
				<category><![CDATA[01 Data Preparation]]></category>
		<category><![CDATA[board]]></category>
		<category><![CDATA[circuit]]></category>
		<category><![CDATA[compensation]]></category>
		<category><![CDATA[dam]]></category>
		<category><![CDATA[etch]]></category>
		<category><![CDATA[factor]]></category>
		<category><![CDATA[mask]]></category>
		<category><![CDATA[minimum]]></category>
		<category><![CDATA[pcb]]></category>
		<category><![CDATA[printed]]></category>
		<category><![CDATA[solder]]></category>
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		<guid isPermaLink="false">http://www.pcbdesignschool.com/?p=1023</guid>
		<description>An etch factor or etch compensation is a process modification made by the Printed Circuit Board (PCB) manufacturer to compensate for the chemical etching process. The chemical etching process is a subtractive operation that removes copper gradually when forming the circuit pattern. The size of the features at the end of the process are smaller [...]&lt;img src="http://feeds.feedburner.com/~r/PcbDesignAndFabricationInstitute/~4/lMoifLBfHsw" height="1" width="1"/&gt;</description>
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		<title>Simple Yield Improvement. (Part 2)</title>
		<link>http://feedproxy.google.com/~r/PcbDesignAndFabricationInstitute/~3/LB5PzSQSCKM/</link>
		<comments>http://www.pcbdesignschool.com/2013/01/06/simple-yield-improvement-part-2/#comments</comments>
		<pubDate>Sun, 06 Jan 2013 22:20:16 +0000</pubDate>
		<dc:creator>David Duross</dc:creator>
				<category><![CDATA[Dry Baking]]></category>
		<category><![CDATA[baking]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cratering]]></category>
		<category><![CDATA[dicy]]></category>
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		<category><![CDATA[FR4]]></category>
		<category><![CDATA[laminate]]></category>
		<category><![CDATA[Lead Free]]></category>
		<category><![CDATA[moisture]]></category>
		<category><![CDATA[pad]]></category>
		<category><![CDATA[pcb]]></category>
		<category><![CDATA[phenolic]]></category>
		<category><![CDATA[Tg]]></category>

		<guid isPermaLink="false">http://www.pcbdesignschool.com/?p=985</guid>
		<description>In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a Printed Circuit Board (PCB). We also discussed how moisture absorption can increase the degree [...]&lt;img src="http://feeds.feedburner.com/~r/PcbDesignAndFabricationInstitute/~4/LB5PzSQSCKM" height="1" width="1"/&gt;</description>
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		<title>Simple Yield Improvement. (Part 1)</title>
		<link>http://feedproxy.google.com/~r/PcbDesignAndFabricationInstitute/~3/XuWRCCJFBDQ/</link>
		<comments>http://www.pcbdesignschool.com/2012/12/31/simple-yield-improvement-part-1/#comments</comments>
		<pubDate>Tue, 01 Jan 2013 04:34:04 +0000</pubDate>
		<dc:creator>David Duross</dc:creator>
				<category><![CDATA[Dry Baking]]></category>
		<category><![CDATA[Assembly]]></category>
		<category><![CDATA[baking]]></category>
		<category><![CDATA[board]]></category>
		<category><![CDATA[CAF]]></category>
		<category><![CDATA[circuit]]></category>
		<category><![CDATA[Lead Free]]></category>
		<category><![CDATA[moisture]]></category>
		<category><![CDATA[pcb]]></category>
		<category><![CDATA[printed]]></category>
		<category><![CDATA[RoHS]]></category>
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		<category><![CDATA[Tg]]></category>

		<guid isPermaLink="false">http://www.pcbdesignschool.com/?p=959</guid>
		<description>Over the past 15 years we have seen some very amazing advancements in technology. Our electronic devices have become smaller, faster and more powerful. The capabilities of these new devices have brought science fiction to life for many of us. What the common consumer does not realize is that these advancements have occurred in a [...]&lt;img src="http://feeds.feedburner.com/~r/PcbDesignAndFabricationInstitute/~4/XuWRCCJFBDQ" height="1" width="1"/&gt;</description>
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