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<title>Perspectives From the Leading Edge</title>
<description>Covering leading-edge microelectronics activity.</description>
<language>en-us</language>
<link>http://www.semiconductor.net/blog/200000420.html?nid=3797</link>
<copyright>Copyright 2008 Reed Business Information.  Subject to its Terms of Use</copyright>
<pubDate>July 23, 2008</pubDate><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" href="http://feeds.feedburner.com/PerspectivesFromTheLeadingEdge" type="application/rss+xml" /><item>
<title>Intel 45 nm Processor Technology for Mobile Products</title>
<link>http://www.semiconductor.net/blog/200000420/post/600030060.html?nid=3797</link>
<description>Those of you that keep an eye on the Intel Technology Journal have probably seen the write up on their 45 nm Processor Technology. For those that d...</description>
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<title>IITC on the 3D Integration Bandwagon</title>
<link>http://www.semiconductor.net/blog/200000420/post/270029427.html?nid=3797</link>
<description>Back in February I welcomed the IEEE IITC Conference aboard the 3D Integration bandwagon [ Perspectives From the Leading Edge &amp;ndash; 2/26/2008 &amp;ld...</description>
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<title>More 3D Integration at ECTC 2008</title>
<link>http://www.semiconductor.net/blog/200000420/post/640029064.html?nid=3797</link>
<description> 
Replisaurus Update
 
Before I update on recent presentations at the Electronic Component Technology Conference (ECTC) I wanted to co...</description>
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<title>ASET drives 3D Integration workshop in Tokyo</title>
<link>http://www.semiconductor.net/blog/200000420/post/310028631.html?nid=3797</link>
<description>I think it was Charles Lassen (who retired from Prismark several years ago and is now sailing the Mediterranean with wife Susan) who once showed me...</description>
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<title>.......If it's Thursday it must be San Jose</title>
<link>http://www.semiconductor.net/blog/200000420/post/560027856.html?nid=3797</link>
<description>A few weeks back, while on the Suss / STS / NeXX road tour across the US, I felt like I was on one of those tours of Europe that were popular back ...</description>
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<title>3D Road Tour contd</title>
<link>http://www.semiconductor.net/blog/200000420/post/850027285.html?nid=3797</link>
<description>Picking up where we left off last blog with 3D Integration news from the recent Suss/STS/NeXX road tour I’d like to point out some highlights...</description>
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<title>Road Trip Revelations</title>
<link>http://www.semiconductor.net/blog/200000420/post/1600026760.html?nid=3797</link>
<description>We can all remember the great John Belushi character in Animal House who, when things got a little dull called for a &amp;ldquo;...ROAD TRIP&amp;rdquo; Wel...</description>
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<title>SMTA 3D Meeting in Research Triangle PArk</title>
<link>http://www.semiconductor.net/blog/200000420/post/1380026338.html?nid=3797</link>
<description>It must be nice for those of you living in the Bay area where conferences on every microelectronic topic imaginable are held on an almost weekly ba...</description>
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<title>Foundry TSVs are a comin' - TSMC makes their play for a bigger portion of the pie</title>
<link>http://www.semiconductor.net/blog/200000420/post/1480025948.html?nid=3797</link>
<description>At the recent TSMC &amp;ldquo;open innovation platform&amp;rdquo; meeting they described among other things their plans to &amp;ldquo;&amp;hellip;collaborate in th...</description>
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<title>COSMOS</title>
<link>http://www.semiconductor.net/blog/200000420/post/1890025189.html?nid=3797</link>
<description>By now, if you’re a reader of this blog, you know that I am preaching that 3D IC intregration will happen in an evolutionary not revolutionar...</description>
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<title>NXP Proposes Passive Integration in 3D IC Stacks</title>
<link>http://www.semiconductor.net/blog/200000420/post/620024862.html?nid=3797</link>
<description>Finishing up on my coverage of the 3D Integration technology from last months IMAPS Device Packaging Conference in AZ........
 
NXP Passive ...</description>
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<title>More 3D IC Integration from Ft McDowell</title>
<link>http://www.semiconductor.net/blog/200000420/post/1470024147.html?nid=3797</link>
<description>This week I’m continuing to share information from the recent IMAPS Device Pkging meeting that was held on the Ft. McDowell reservation north...</description>
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<title>3D Practitioners Assemble at Ft McDowell</title>
<link>http://www.semiconductor.net/blog/200000420/post/1880023788.html?nid=3797</link>
<description>The casino was second rate, the food in the casino was third rate but the information on 3D IC integration was priceless. The IMAPS Device Packagin...</description>
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<title>3D IC Integration : Evolution or Revolution ?</title>
<link>http://www.semiconductor.net/blog/200000420/post/420023442.html?nid=3797</link>
<description>As we get older we begin to understand that most technological advances are made in an evolutionary, not a revolutionary manner. I would further co...</description>
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<title>ST Micro announces more CMOS Image Sensor Packaging Capacity with TSV</title>
<link>http://www.semiconductor.net/blog/200000420/post/1080022908.html?nid=3797</link>
<description>ST enters CIS camera market place with 3D TSV technology
 
ST's claims its latest 2M pixel mobile-phone camera module VD6725 is the worlds s...</description>
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<title>IMEC arrives in Hsinchu and other 3D IC News</title>
<link>http://www.semiconductor.net/blog/200000420/post/770022477.html?nid=3797</link>
<description> 
Hsinchu
 
I have a special feeling of kinship with the island and people of Taiwan. You see, I was on the island on Sept 21st1999 an...</description>
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<title>High Throughput Laser Drilling for 3D IC TSV</title>
<link>http://www.semiconductor.net/blog/200000420/post/60022006.html?nid=3797</link>
<description>There will be a major presentation by XSil at the upcoming IMAPS Device Packaging meeting in Phoenix in March. In keeping with Semiconductor Intern...</description>
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<title>3D IC Integration: Rumors and Ruminations</title>
<link>http://www.semiconductor.net/blog/200000420/post/1510021551.html?nid=3797</link>
<description>Down here in Research Triangle Park NC it’s hard to believe that it’s early February. It’s been in the low 70’s which is ab...</description>
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<title>EVG discusses status of 3D Integration</title>
<link>http://www.semiconductor.net/blog/200000420/post/300020430.html?nid=3797</link>
<description>As I’ve mentioned before when it comes to really knowing what’s going on in the microelectronics industry there are only two knowledgab...</description>
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<title>Semprius</title>
<link>http://www.semiconductor.net/blog/200000420/post/20020202.html?nid=3797</link>
<description>Semprius ! &amp;ndash; wasn’t that the chant the crowd gave the Russell Crowe character in Gladiator every time he took out the competition? Mayb...</description>
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<title>ECPR for short</title>
<link>http://www.semiconductor.net/blog/200000420/post/480019648.html?nid=3797</link>
<description>Hope everyone has had a great holiday season, I know I did since I got to spend a week with my granddaughter Hannah in TX.

To start off 2008, I ...</description>
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<title>October in Munich</title>
<link>http://www.semiconductor.net/blog/200000420/post/1060018906.html?nid=3797</link>
<description>If my title is &amp;ldquo;October in Munich&amp;rdquo; I must be getting ready to talk about my experiences at Octoberfest &amp;ndash; correct ? Well no.....I&amp;...</description>
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<title>More TSV commercial capacity on line.....</title>
<link>http://www.semiconductor.net/blog/200000420/post/1020018302.html?nid=3797</link>
<description>As these blogs have mentioned before, the first signs of the commercialization of 3D IC technology will be face to face stacking of two thinned chi...</description>
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<title>A Rose by any other name is not 3D IC Integration</title>
<link>http://www.semiconductor.net/blog/200000420/post/570017657.html?nid=3797</link>
<description>First of all, thanks for visiting this blog. Evidently 2750 of you dropped by to see what was happening &amp;ldquo;on the leading edge&amp;rdquo; in Octobe...</description>
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<title>3D discussions in the valley... continued</title>
<link>http://www.semiconductor.net/blog/200000420/post/470016847.html?nid=3797</link>
<description>Continuing with coverage on the RTI "3D Architecture for Semiconductor Integration &amp; Pkging meeting that occurred Oct 22-24th................</description>
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