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<title>Power Electronics Passive Components RSS Feed</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/</link>
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<language>en-us</language>

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<title>Ruggedized Double Point Series Of Card Edge Connectors</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/connectors/ruggedized-double-point-series-card-edge-connectors-0708</link>
<description>Sullins Connector Solutions, Inc., released the full RDPS Series (Ruggedized Double Point Series) of card edge connectors optimized for superior durability in high-temperature, harsh environment applications.</description>
<category>connectors</category>
<pubDate>Tue, 07 Jul 2009 14:13:00 EDT</pubDate>
</item>

<item>
<title>Hermetic Feedthroughs Allow Interchangeability</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/connectors/hermetic-feedthroughs-allow-interchangeability-0708</link>
<description>Douglas Electrical Components, Inc. introduces its PotCon line of hermetic feedthroughs, which incorporate standard connectors and/or wire harnesses in a single, fully-sealed housing. </description>
<category>connectors</category>
<pubDate>Tue, 07 Jul 2009 14:11:00 EDT</pubDate>
</item>

<item>
<title>D-Sub Pin-in-Paste Product Portfolio Expanded</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/connectors/d-sub-pin-in-paste-prod-portfolio-expand-0708</link>
<description>CI has extended its reflow process-compatible D-Sub family of connectors by adding 37-position connectors to the existing range of right-angle version Pin-In-Paste connectors offered in 9 to 25 positions with through-hole technology. </description>
<category>connectors</category>
<pubDate>Tue, 07 Jul 2009 14:09:00 EDT</pubDate>
</item>

<item>
<title>Power Resistors Meet High Temperature Soldering Requirements</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/resistors/power-resistors-meet-high-temp-soldering-reqs-0622</link>
<description>Bourns, Inc. introduced a power resistor specifically engineered to meet high temperature soldering requirements that enable improved automated board assembly. </description>
<category>resistors</category>
<pubDate>Mon, 22 Jun 2009 14:33:00 EDT</pubDate>
</item>

<item>
<title>Ultra-Thin 0402 Surface Mount Ceramic Capacitors for Low Profile Applications</title>
<link>http://powerelectronics.com/passive_components_packaging_interconnects/capacitors/ultra-thin-0402-surface-mount-ceramic-capacitors-low-profile-apps-0622</link>
<description>AVX Corporation has developed the UT series of ultra thin ceramic capacitors targeted at applications where low profile is vital, such as smart cards, high-density SIM cards, and memory modules. </description>
<category>capacitors</category>
<pubDate>Mon, 22 Jun 2009 14:32:00 EDT</pubDate>
</item>

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