http://powerelectronics.com/thermal_management/ en-us This is an XML content feed. It is intended to be viewed in a newsreader or syndicated to another site, subject to copyright and fair use. http://powerelectronics.com/thermal_management/heatsinks/flared-pin-heat-sink-provides-alternative-natural-convection-0526 Cool Innovations Inc. introduced a line of flared pin fin heat sinks that provide cooling power specifically optimized for natural convection environments. They feature a rugged array of round pins and are suitable for harsh industrial environments. heatsinks Tue, 26 May 2009 11:12:00 EDT http://powerelectronics.com/thermal_management/thermal_management_tools_0309 ICs and the Packages that house them continue to shrink. In the meantime, they are operating at higher frequencies and offering higher-performance levels while generating more power much of it in the form of heat. As a result, this is dramatically raising the challenge of thermal management for electronic devices, subsystems and systems. The latest forecast by the International Technology Roadmap thermal_management Sun, 01 Mar 2009 12:00:00 EDT http://powerelectronics.com/thermal_management/news/erpi-solar-energy-coal-plants-0211 The Electric Power Research Institute (EPRI) announced that it has launched the second of two projects to help electric power companies add solar energy to fossil-fueled electric power plants, reducing fuel costs and plant emissions news Wed, 11 Feb 2009 16:14:00 EDT http://powerelectronics.com/thermal_management/optimize_thermal_derating_performance_pwm_ics_0209 Because the end-use environment often is not well-known during the IC evaluation stage, and the environment can vary greatly from application to application, thermal derating graphs are included in data sheets for pulse-wide-modulated (PWM) controller ICs with internal MOSFETs. The derating curves show how much power can be drawn from the chip under given airflow and ambient temperature. To ensure thermal_management Sun, 01 Feb 2009 12:00:00 EDT http://powerelectronics.com/thermal_management/news/MHW_keratherm_u-90_thermal_interface-0114 MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices news Wed, 14 Jan 2009 17:18:00 EDT