http://powerelectronics.com/thermal_management/ en-us This is an XML content feed. It is intended to be viewed in a newsreader or syndicated to another site, subject to copyright and fair use. http://powerelectronics.com/thermal_management/acquisition-combine-expertise-conduction-heat-transfer-100909 Thermacore, Inc. has announced the acquisition of k Technology, a business headquartered in Langhorne, PA, that designs and manufactures custom thermal management products for power electronics cooling. thermal_management Fri, 09 Oct 2009 10:49:00 EST http://powerelectronics.com/thermal_management/heatpipes_spreaders/heatpipeheatsink-technology-improves-20091009 The heat generated from large power semiconductors such as IGBTs, diodes, or thyristors can be as high as several kilowatts. While conventional extruded heat sinks have been one of the most widely used solutions for cooling high-power semiconductors, removing the heat created with current and future devices may require an alternative solution. Coupling tried-and-true heat-sink technology with a heat heatpipes_spreaders Thu, 01 Oct 2009 12:00:00 EST http://powerelectronics.com/thermal_management/nextreme-raises-8m-corp-funding-081109 Nextreme Thermal Solutions announced that it has raised $8 million in additional Series B financing from undisclosed corporate investors. Nextreme has now raised more than $21 million in Series B financing and $35 million since its inception in 2004. thermal_management Tue, 11 Aug 2009 13:33:00 EST http://powerelectronics.com/thermal_management/heatsinks/flared-pin-heat-sink-provides-alternative-natural-convection-0526 Cool Innovations Inc. introduced a line of flared pin fin heat sinks that provide cooling power specifically optimized for natural convection environments. They feature a rugged array of round pins and are suitable for harsh industrial environments. heatsinks Tue, 26 May 2009 11:12:00 EST http://powerelectronics.com/thermal_management/thermal_management_tools_0309 ICs and the Packages that house them continue to shrink. In the meantime, they are operating at higher frequencies and offering higher-performance levels while generating more power much of it in the form of heat. As a result, this is dramatically raising the challenge of thermal management for electronic devices, subsystems and systems. The latest forecast by the International Technology Roadmap thermal_management Sun, 01 Mar 2009 12:00:00 EST