Aries Electronics

New Aries CSP Sockets Enable

Mon, 19 Dec 2011 10:57:51 -0500

Testing of Any Area-array Device to +200°C

Roy Larsen of Larsen Associates Receives Aries Electronics’ (ARI-A-7540)

Tue, 29 Mar 2011 11:33:32 -0400

2010 Rep of the Year Award

Fine Pitch Bump Adapters from Aries (ARI-A-7547)

Tue, 8 Feb 2011 12:20:34 -0500

Allow for SMT Adaptation of TSSOP, QFP and other Fine-Pitch Devices

Aries’ Machined High-Frequency Center Probe Test Sockets (ARI-A-7406)

Fri, 7 Jan 2011 14:40:52 -0500

Sockets Now Available in Pitch Sizes Down to 0.30 mm

New Fine Pitch Bump Adapters from Aries (ARI-A-7521)

Tue, 3 Aug 2010 11:39:41 -0400

Allow BGA Devices of Any Pitch to be Used with 0.40 mm Pitch Boards

Aries announces New CSP Optical FA Test Sockets (ARI-A-7509)

Fri, 25 Jun 2010 09:31:54 -0400

for EMMI or Optical Sensor Applications

Aries Electronics Honors Joe Midili of JMA Inc. as 2009 Representative of the Year (ARI-A-7513)

Fri, 21 May 2010 11:02:15 -0400

Midili receives award for best sales increase in Aries' representative network

Aries' BGA Switch-A-Pitch Adapters Enable Cost-Effective Use of 0.40 mm Pitch Devices (ARI-A-7438)

Fri, 5 Feb 2010 10:06:20 -0500

with 1.00 mm Pitch Boards

New Kelvin Test Socket from Aries Ideal for Low Resistance Testing of Devices (ARI-A-7394)

Tue, 5 Jan 2010 09:50:08 -0500

with Lead Pitch down to 0.4 mm

Aries' New Fine Pitch Bump Adapters Adapt BGA Devices (ARI-A-7440)

Wed, 4 Nov 2009 14:24:01 -0500

of Any Pitch to 0.40 mm Pitch Boards

New BGA Switch-A-Pitch Adapters from Aries (ARI-A-7360)

Wed, 30 Sep 2009 09:22:05 -0400

Now Adapt 0.50 mm Devices to 1.00 mm Boards

New CSP Test Socket for Smaller Devices Up to 13 mm Squared Joins Aries’ Family of Sockets Featuring Adjustable Pressure Pad (ARI-A-7447)

Sat, 15 Aug 2009 13:15:36 -0400

Has expanded its line of CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a version that accommodates devices 13 mm squared or smaller, with a pitch of 0.30 mm or higher.

New Switch-A-Pitch Adapters from Aries (ARI-A-7439)

Tue, 7 Jul 2009 12:38:40 -0400

Provide Even Smaller Pitch Landing Pads for Use on Larger Pitch Boards

Duerfeldt Engineering Inc. Now Offers Aries Electronics’ Connector Products (ARI-A-7452)

Wed, 17 Jun 2009 11:00:22 -0400

in the Pacific Northwest

New Fine Pitch Bump Adapters from Aries (ARI-A-7435)

Wed, 3 Jun 2009 11:53:52 -0400

Enable Use of Alternate ICs on PCBs Originally Designed for TSSOPs and QFP Packages

Adjustable Pressure Pad on New Aries Electronics' CSP Test Socket (ARI-A-7441)

Fri, 1 May 2009 11:35:01 -0400

Enables Testing of Extremely Small and Fragile Devices without Damage

Aries Electronics Names Roy Larsen of Larsen Associates (ARI-A-7450)

Wed, 22 Apr 2009 11:02:26 -0400

2008 Representative of the Year

New Switch-A-Pitch Adapters from Aries Electronics (ARI-A-7437)

Fri, 20 Mar 2009 10:49:25 -0400

Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards

Aries Electronics Patented CSP/BallNest Hybrid Socket (ARI-A-7399)

Wed, 7 Jan 2009 13:28:45 -0500

Provides Reliable, Consistent Test and Burn-in Down to 0.30 mm Pitch

New 0.3 mm Pitch RF and Test & Burn-In Sockets for Devices Up to 6.5 mm sq. (ARI-A-7393)

Fri, 7 Nov 2008 12:41:38 -0500

Available from Aries Electronics

Aries Electronics’ New 6.5 mm Center Probe Test Socket (ARI-A-7410)

Tue, 7 Oct 2008 12:39:31 -0500

Provides Reliable, Consistent Test and Burn-in Down to 0.30 mm Pitch

Aries Electronics’ New Test and Burn-In and RF Sockets (ARI-A-7364)

Fri, 5 Sep 2008 14:30:47 -0500

Now Accommodate Pitches Down to 0.3 mm

Aries Electronics’ New CSP/MicroBGA Test and Burn-In Socket (ARI-A-7409)

Wed, 20 Aug 2008 12:40:38 -0500

Now Accommodates Devices up to 6.5 mm sq.