SI - Articles

Under the Hood: Mature devices get Rolly rocking

info@semiconductor.com — Tue, 13 May 2008 00:00:00 -0600

The Sony Rolly, shown at the Consumer Electronics Show in January, is a "dancing" MP3 player: When songs are loaded or streamed via Bluetooth, the Rolly can roll around and flap its speaker coverings in time with the music. The speaker flaps can also muffle the sound and give it a bit more flare when noise is channeled through one side or the other. www.techonline.com

Moving up to DDR2 at printed circuit board layout

info@semiconductor.com — Tue, 06 May 2008 00:00:00 -0600

As increasing processor speeds require more and more from memory, designers´ path to lower latency lies through informed board layout that minimizes performance issues such as power supply jitter, reflections and crosstalk.

Under the Hood: Inside Sony´s OLED TV

info@semiconductor.com — Mon, 28 Apr 2008 00:00:00 -0600

For its first organic LED (OLED) TV, Sony chose to go with memory and processor components from the likes of Samsung, Elpida, Fujitsu, Texas Instruments, NEC and Altera. www.techonline.com

Under the Hood: Designers boost DRAM efficiency

info@semiconductor.com — Tue, 15 Apr 2008 00:00:00 -0600

Analysis of some of the latest DDR2 and DDR3 DRAM devices from leading manufacturers has revealed some interesting trends: DRAM manufactures are responding to the harsh DRAM market conditions with more efficient designs for both the mainstream DDR2 market and the next-generation DDR3 market.

Under the Hood: GPS Special - Garmin nuvi 750 vs. HP iPaq 310

info@semiconductor.com — Mon, 14 Apr 2008 00:00:00 -0600

TechOnline´s Greg Quirk went inside the Garmin nuvi 750 and HP iPaq 310 GPS navigation systems to find components from Texas Instruments, SiRF Technologies, SiGe Semiconductor, Wolfson Microelectronics, National Semiconductor, Linear Technology and CSR. www.techonline.com

16-Gbit MLC NAND flash a step up

info@semiconductor.com — Mon, 07 Apr 2008 00:00:00 -0600

The cutting-edge processes used by IM Flash Technologies can dramatically change the way consumer electronics are built and used.

Find the Company´s Hidden Treasures - Part 2 of 2

info@semiconductor.com — Tue, 01 Apr 2008 00:00:00 -0600

The prime factor in choosing any target will depend on how well the company´s patents read against the target´s product line. Research of product data sheets, press releases, journal publications, conference proceedings and so on will be required; and when possible, detailed analysis of a sample product through teardown or reverse engineering should be undertaken.

Under the Hood: Next steps in NAND flash evolution

info@semiconductor.com — Tue, 18 Mar 2008 00:00:00 -0600

This article analyzes the latest trends of NAND flash devices from the point of view of device technology by examining process nodes, cell types, chip sizes and cell sizes.

Under the Hood: The next gold rush - solar power

info@semiconductor.com — Mon, 10 Mar 2008 00:00:00 -0600

There is almost palpable excitement about the environmental and political benefits of solar power technology. This article helps to identify the different types of solar cells and their efficiency, the solar market and regional demographic imapact, and the intellectual property aspects of this USD$13B space.

Under the Hood: Evolution of the smart phone

info@semiconductor.com — Mon, 03 Mar 2008 00:00:00 -0600

It is interesting to look at the different ways that HTC and Nokia, two companies that have very competitive and successful smart-phone offerings, arrived at their latest products. HTC used its background as a PDA manufacturer to create the TyTN 2, essentially incorporating phone functionality into a PDA. Nokia came into the smart-phone market from cell phones, so it needed to find ways to increase functionality without substantially increasing the size of its latest phone, the N95.