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      <title>SEMATECH in the News</title>
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      <pubDate>Mon, 28 May 2012 21:23:46 +0000</pubDate>
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         <title>Semiconductor metrology beyond 22nm: FinFET metrology (three-part&amp;nbsp;series)</title>
         <link>http://www.electroiq.com/articles/sst/2012/02/semiconductor-metrology-beyond-22nm-finfet-metrology.html</link>
         <description>Semiconductor metrology beyond 22nm: FinFET metrology (three-part&amp;nbsp;series)</description>
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         <title>Wanted: 3-D IC standards within six months</title>
         <link>http://www.rfdesignline.com/electronics-news/4235600/Wanted--3-D-IC-standards-within-six-months</link>
         <description>Wanted: 3-D IC standards within six months</description>
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         <title>SEMATECHs EMAs Prepare 3D Tools for HMV Readiness             (3DIncites)</title>
         <link>http://www.semi.org/en/node/39771?id=sguna1211</link>
         <description>SEMATECHs EMAs Prepare 3D Tools for HMV Readiness             (3DIncites)</description>
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         <title>Fast Forward: Finding New Common Ground in Process Technology R&amp;D  (SEMI)</title>
         <link>http://www.semi.org/en/node/39771?id=sguna1211</link>
         <description>Fast Forward: Finding New Common Ground in Process Technology R&amp;D  (SEMI)</description>
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         <title>3D chips: The next electronics revolution  (COMPUTERWORLD)</title>
         <link>http://www.computerworld.com/s/article/9221220/3D_chips_The_next_electronics_revolution</link>
         <description>3D chips: The next electronics revolution  (COMPUTERWORLD)</description>
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         <title>Predictive Techniques Take Stage at ISMI Symposium  (Semiconductor Manufacturing and Design)</title>
         <link>http://semimd.com/blog/2011/10/05/predictive-techniques-take-stage-at-ismi-symposium/</link>
         <description>Predictive Techniques Take Stage at ISMI Symposium  (Semiconductor Manufacturing and Design)</description>
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      <item>
         <title>Why it's time for a "refresh"  (Electro IQ)</title>
         <link>http://www.electroiq.com/articles/sst/2011/10/sematechs-bryan-rice-why-its-time-for-a-refresh.html</link>
         <description>Why it's time for a "refresh"  (Electro IQ)</description>
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      <item>
         <title>Making EUV work, with a subsystem ear (Electro IQ)</title>
         <link>http://www.electroiq.com/articles/sst/2011/09/making-euv-work-with-a-subsystem-ear-interview-with-sematechs-stefan-wurm.html</link>
         <description>Making EUV work, with a subsystem ear (Electro IQ)</description>
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         <title>Extreme Exposure: EUV Seems to be Coming Around  (Electronic Engineering Journal)</title>
         <link>http://www.eejournal.com/archives/articles/20110912-euv/</link>
         <description>Extreme Exposure: EUV Seems to be Coming Around  (Electronic Engineering Journal)</description>
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         <title>EUV Mask Defects: What Can We Do About Them?  (Semiconductor Manufacturing and Design</title>
         <link>http://semimd.com/blog/2011/08/22/euv-mask-defects-what-can-we-do-about-them/</link>
         <description>EUV Mask Defects: What Can We Do About Them?  (Semiconductor Manufacturing and Design</description>
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         <title>Standardizing in an Increasingly 3D World  (Future Fab International)</title>
         <link>http://www.sematech.org/corporate/news/docs/FF38_U_WP_McGill_WFPI.pdf</link>
         <description>Standardizing in an Increasingly 3D World  (Future Fab International)</description>
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         <title>Companies Join SEMATECHs EMI Partnership  (Semiconductor Manufacturing and Design)</title>
         <link>http://www.electroiq.com/articles/sst/2011/july/450mm-update-participation-rising-patterning-defined-low-risk-determined0.html</link>
         <description>Companies Join SEMATECHs EMI Partnership  (Semiconductor Manufacturing and Design)</description>
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         <title>450mm update: Participation rising, patterning defined, low risk determined  (Solid State Technology)</title>
         <link>http://www.electroiq.com/articles/sst/2011/july/450mm-update-participation-rising-patterning-defined-low-risk-determined0.html</link>
         <description>450mm update: Participation rising, patterning defined, low risk determined  (Solid State Technology)</description>
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         <title>EUV lithography infrastructure update from SEMATECH  (Solid State Technology)</title>
         <link>http://www.electroiq.com/articles/sst/2011/july/euv-lithography-infrastructure-update-from-sematech.html</link>
         <description>EUV lithography infrastructure update from SEMATECH  (Solid State Technology)</description>
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      <item>
         <title>Top semiconductor metrology challenges from SEMATECH POV  (Solid State Technology)</title>
         <link>http://www.electroiq.com/articles/sst/2011/july/top-semiconductor-metrology-challenges-from-sematech-pov.html</link>
         <description>Top semiconductor metrology challenges from SEMATECH POV  (Solid State Technology)</description>
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      <item>
         <title>Partnering to Enable Volume Manufacturing for 3D IC Stacks with TSVs  (Chip Scale Review)</title>
         <link>http://issuu.com/chipscalereview/docs/csr_may-june-2011_digital?viewMode=magazine&amp;mode=embed</link>
         <description>Partnering to Enable Volume Manufacturing for 3D IC Stacks with TSVs  (Chip Scale Review)</description>
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      <item>
         <title>SEMATECH: A Model for Advancing Solar Technology ( ENERGY.GOV )</title>
         <link>http://blog.energy.gov/blog/2011/05/24/sematech-model-advancing-solar-technology-0</link>
         <description>SEMATECH: A Model for Advancing Solar Technology ( ENERGY.GOV )</description>
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      <item>
         <title>Surface preparation for 2011 and beyond ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/2240392194/articles/solid-state-technology/volume-54/issue-4/features/wafer-cleaning-surface-prep/surface-prep-for-2011-and-beyond.html</link>
         <description>Surface preparation for 2011 and beyond ( Solid State Technology )</description>
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      <item>
         <title>SEMATECH partners with RRAM startup ( EETimes )</title>
         <link>http://www.eetimes.com/electronics-news/4215030/Sematech-partners-with-RRAM-startup-</link>
         <description>SEMATECH partners with RRAM startup ( EETimes )</description>
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      <item>
         <title>If wide I/O DRAM and other 3D technologies can go HVM, standards are needed ( Advanced Packaging )</title>
         <link>http://www.electroiq.com/index/display/packaging-article-display/2239275208/articles/advanced-packaging/packaging0/integration/tsv/2011/3/if-wide-i_o-dram-and-other-3d-technologies-can-go-hvm-standards-.html</link>
         <description>If wide I/O DRAM and other 3D technologies can go HVM, standards are needed ( Advanced Packaging )</description>
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      <item>
         <title>Scaling transistors: from new materials to new device architectures ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/6870192490/articles/solid-state-technology/volume-54/issue-3/features/gate-stack-engineering/scaling-transistors-from-new-materials-to-new-device.html</link>
         <description>Scaling transistors: from new materials to new device architectures ( Solid State Technology )</description>
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      <item>
         <title>The future of lithography ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/7921500372/articles/solid-state-technology/semiconductors/lithography/2011/2/the-future-of-lithography.html</link>
         <description>The future of lithography ( Solid State Technology )</description>
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      <item>
         <title>450mm, TSV, EUV transitions: What role does government play? ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/1375323336/articles/solid-state-technology/semiconductors/industry-news/technology-news/2011/1/450mm-tsv-euv-transitions-sematech-armbrust.html</link>
         <description>450mm, TSV, EUV transitions: What role does government play? ( Solid State Technology )</description>
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         <title>III-V MOSFET on 200mm Si fabbed using industry-standard tools: SEMATECH at IEDM ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/3686697559/articles/solid-state-technology/semiconductors/device-architecture/transistors/2010/12/iii-v-mosfet-on-200mm-si-fabbed-using-industry-standard-tools-se.html</link>
         <description>III-V MOSFET on 200mm Si fabbed using industry-standard tools: SEMATECH at IEDM ( Solid State Technology )</description>
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      <item>
         <title>Bringing fabless players into manufacturing research ( EDA Tech Forum )</title>
         <link>http://www.edatechforum.com/eda-topics/design-to-silicon/bringing-fabless-players-into-manufacturing-research/</link>
         <description>Bringing fabless players into manufacturing research ( EDA Tech Forum )</description>
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      <item>
         <title>Exotic Transistors With Silicon Credentials ( IEEE Spectrum )</title>
         <link>http://spectrum.ieee.org/semiconductors/materials/exotic-transistors-with-silicon-credentials</link>
         <description>Exotic Transistors With Silicon Credentials ( IEEE Spectrum )</description>
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      <item>
         <title>Lithography materials infrastructure benefits from a collaborative research approach ( Solid State Tecnnology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/1833929780/articles/solid-state-technology/semiconductors/lithography/2010/october/lithography-materials.html</link>
         <description>Lithography materials infrastructure benefits from a collaborative research approach ( Solid State Tecnnology )</description>
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         <title>450mm report: Standards, AMHS, platforms getting ready ( Solid State Tecnnology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/7144446644/articles/solid-state-technology/semiconductors/industry-news/technology-news/2010/july/450mm-report__standards.html</link>
         <description>450mm report: Standards, AMHS, platforms getting ready ( Solid State Tecnnology )</description>
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         <title>Workshop addresses simulating, measuring 3D IC stress using TSVs ( Advanced Packaging )</title>
         <link>http://www.electroiq.com/index/display/packaging-article-display/8896686530/articles/advanced-packaging/packaging0/integration/tsv/2010/july/workshop-addresses.html</link>
         <description>Workshop addresses simulating, measuring 3D IC stress using TSVs ( Advanced Packaging )</description>
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         <title>EUV lithography cannot come soon enough ( EDN )</title>
         <link>http://www.edn.com/article/509434-EUV_lithography_cannot_come_soon_enough.php</link>
         <description>EUV lithography cannot come soon enough ( EDN )</description>
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         <title>Survey reveals EUV to be used for making chips in 2014 ( EETimes )</title>
         <link>http://www.eetimes.com/electronics-news/4199587/Survey-reveals-EUV-to-be-used-for-making-chips-in-2014</link>
         <description>Survey reveals EUV to be used for making chips in 2014 ( EETimes )</description>
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         <title>Stress Management for 3D ICs using TSVs ( 3D InCites )</title>
         <link>http://www.semineedle.com/posting/31156?snc=20641</link>
         <description>Stress Management for 3D ICs using TSVs ( 3D InCites )</description>
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         <title>III-V MOSFETs: beyond silicon technology ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/semiconductors-article-display/3605046880/articles/solid-state-technology/semiconductors/device-architecture/transistors/2010/march/III-V-MOSFETs-_beyond-silicon-technology.html</link>
         <description>III-V MOSFETs: beyond silicon technology ( Solid State Technology )</description>
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         <title>Status of EUV lithography for the 22nm half-pitch ( Solid State Technology )</title>
         <link>http://www.electroiq.com/index/display/article-display/5967687565/articles/solid-state-technology/semiconductors/lithography/2010/february/status-of_euv_lithography.html</link>
         <description>Status of EUV lithography for the 22nm half-pitch ( Solid State Technology )</description>
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         <title>Dow Electronic Materials Joins SEMATECHs Resist and Materials Development Center at UAlbany NanoCollege ( Nano TechWire )</title>
         <link>http://nanotechwire.com/news.asp?nid=9394</link>
         <description>Dow Electronic Materials Joins SEMATECHs Resist and Materials Development Center at UAlbany NanoCollege ( Nano TechWire )</description>
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