The latest news and information on semiconductor fab facilities, including manufacturing automation, e-manufacturing/e-diagnostics, chemicals/chemical management, gases/gas management, ultrapure water, vacuum systems, and waste treatment. en-us http://www.semiconductor.net/community/Fab+Facilities/47305.html?nid=3662 2008 Reed Business Information. Subject to its Terms of Use. Thu, 24 Jul 2008 04:03:02 MST http://www.semiconductor.net/article/CA6580504.html?nid=3662 The large chip companies supporting the 450 mm wafer transition have put supplemental funding behind the 450 mm program at ISMI, said director Scott Kramer at SEMICON West. However, the large equipment vendors joined with SEMI officials to question the return on investment of the larger substrates. Tue, 22 Jul 2008 09:28:00 MST http://www.semiconductor.net/article/CA6579394.html?nid=3662 The Chemicals and Gases Manufacturers Group (CGMG) held its general meeting at SEMICON West, and several presenters considered leaders in their respective fields were invited to give their views on markets and technology. Thu, 17 Jul 2008 11:15:00 MST http://www.semiconductor.net/article/CA6579009.html?nid=3662 There’s plenty of life left in, and profits to be made from, legacy fabs — facilities using older and refurbished equipment to produce non-leading-edge semiconductors, MEMS devices and photovoltaics (PV). Tue, 15 Jul 2008 19:17:00 MST http://www.semiconductor.net/article/CA6578722.html?nid=3662 Asyst Technologies announced the Agile Automation solution at SEMICON West, aimed at easing wafer delivery bottlenecks for high-throughput tools in memory and logic megafabs. A key part of the Agile Automation system is the company’s direct-loading transport (DLT) lifting load port. Asyst claims the automation system reduces the time required to deliver a wafer to the tool. Tue, 15 Jul 2008 08:00:00 MST http://www.semiconductor.net/article/CA6577625.html?nid=3662 Dan Hamling, founder and CEO of Chip Nexus (San Diego), will present on Thursday, July 17, at 11:00 a.m., as part of the SEMICON West Test, Assembly and Packaging TechXPOT. He emphasizes that improved profitability and ROI will be the result of appropriate use of test capacity management. Fri, 11 Jul 2008 00:00:00 MST http://www.semiconductor.net/article/CA6577640.html?nid=3662 As a percentage of total spending on semiconductor capital equipment, spending on test equipment has trended below 20% of total equipment spending since the 2000 peak year of semiconductor industry equipment spending. Fri, 11 Jul 2008 00:00:00 MST http://www.semiconductor.net/article/CA6577336.html?nid=3662 ISMI will present data gathered from 450 mm test wafers to several SEMI task forces at next week’s SEMICON West conference in San Francisco. ISMI Director Scott Kramer said, “This is our fundamental strategy: We are gathering data, doing testing, to influence the standards.” ISMI managers will also present progress on the 300 mm Next Generation Factory initiative. Thu, 10 Jul 2008 09:49:00 MST http://www.semiconductor.net/article/CA6576285.html?nid=3662 Applied Materials Inc. broke ground for a major manufacturing and operations facility in Singapore. The center will support customers in the Asian chip industry, as well as the rapidly growing solar markets in India and China. It is expected to open in late 2009. Tue, 08 Jul 2008 08:56:00 MST http://www.semiconductor.net/article/CA6572745.html?nid=3662 Fab managers need proof of hazardous gas emissions, preferably in the form of fast response time, good selectivity, stability and visible proof of detection. Tue, 01 Jul 2008 00:00:00 MST http://www.semiconductor.net/article/CA6572747.html?nid=3662 Though the goals of 50% shorter manufacturing cycle time and 30% lower processed wafer cost were not shown to be achievable simultaneously, modeling and simulation demonstrated possible cycle time and cost savings based on shorter first wafer delay, higher equipment availability and conversions to single wafer processing. Tue, 01 Jul 2008 00:00:00 MST http://www.semiconductor.net/article/CA6577466.html?nid=3662 In legacy fabs, dynamic, remote monitoring of gauges can lead to significant improvements in productivity and cost savings. Tue, 01 Jul 2008 00:00:00 MST http://www.semiconductor.net/article/CA6574276.html?nid=3662 Semiconductor Manufacturing International Corp. (SMIC) kicked off construction of the 200 mm fab it is building in the southern city of Shenzhen, with support from the Shenzhen city government. The line is expected to begin pilot production late next year, followed by construction of a 300 mm line. Mon, 30 Jun 2008 08:33:00 MST http://www.semiconductor.net/article/CA6573570.html?nid=3662 For the second time this year, Fremont, Calif.-based semiconductor fab automation company Asyst Technologies Inc is the subject of an unsolicited takeover proposal and has received notice from hedge fund Riley Investment Partners Master Fund L.P. that claims to own 2.6% of Asyst’s outstanding shares, and intends to nominate six directors for election at Asyst’s 2008 annual meeting in an attempt to gain control of Asyst’s board of directors. Thu, 26 Jun 2008 00:00:00 MST http://www.semiconductor.net/article/CA6573390.html?nid=3662 Most of the position cuts at IBM’s Burlington, Vt, fab are in manufacturing, with the total including employees directly involved in manufacturing, such as technicians and engineers, and some managers. Wed, 25 Jun 2008 00:00:00 MST http://www.semiconductor.net/article/CA6572936.html?nid=3662 DuPont Electronic Technologies said rising energy and transportation costs have forced it to raise its electronics materials prices by 20%, effective immediately. The company supplies materials for chips, displays and flexible circuits. Tue, 24 Jun 2008 10:41:00 MST http://www.semiconductor.net/article/CA6569173.html?nid=3662 Visionox (Beijing, China) said its volume OLED production line will begin operation in October in Kunshan, Jiangsu. The company said it has started installing production equipment at the plant, which is expected to have an annual capacity of more than 10 million small-size OLED devices. Visionox’s OLED technology derives from R&D at Tsinghua University, where several professors began basic OLED research in 1996. Wed, 11 Jun 2008 08:10:00 MST http://www.semiconductor.net/article/CA6568683.html?nid=3662 SMIC plans to have its 45 nm process in volume production by the second half of 2009, starting with a low-power process aimed at mobile devices, cameras and personal navigation systems. SMIC is seeking customers among local Chinese companies, as well as with “top-tier fabless and IDM companies that have expressed interest in working with SMIC on 45 nm,” said Chiou Feng Chen, vice president of marketing. Tue, 10 Jun 2008 08:15:00 MST http://www.semiconductor.net/article/CA6567635.html?nid=3662 After a $52 million sequential reduction in manufacturing service expenses with foundries and subcontractors in Spansion’s fiscal Q1, the flash maker announces 500 job cuts as it looks to further cut costs. Thu, 05 Jun 2008 00:00:00 MST http://www.semiconductor.net/article/CA6564172.html?nid=3662 OmniVision Technologies Inc. said it has developed a backside illumination (BSI) image sensor that will improve the quality and pixel density of CMOS sensors used in cell phone camera modules, among other applications. The BSI approach allows more light to strike the photosensitive area. OmniVision worked with foundry partner TSMC to develop the process flow. Tue, 27 May 2008 09:13:00 MST http://www.semiconductor.net/article/CA6564279.html?nid=3662 To meet what the company said is growing market demand and to strengthen its cost competitiveness by maximizing production capacity, Seoul, Korea-based consumer electronics and memory giant Samsung Electronics confirmed today that its management committee Monday approved a $908 million (946.8 billion South Korea won) investment to expand and upgrade its existing memory lines. Tue, 27 May 2008 00:00:00 MST