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    <title>Test and Measurement World - Resource Center</title>
    <link>http://tmworld.resourcecenteronline.com/resource_center/</link>
    <description>Feed for items in the Test and Measurement World - Resource Center</description>
    <copyright>Copyright 2008 Reed Business Information.  Subject to its &lt;a href="http://www.tmworld.com/info/CA6417980.html"&gt;Terms of Use&lt;/a&gt;</copyright>
    <dc:rights>Copyright 2008 Reed Business Information.  Subject to its &lt;a href="http://www.tmworld.com/info/CA6417980.html"&gt;Terms of Use&lt;/a&gt;</dc:rights>
    <atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" href="http://feeds.feedburner.com/TMW-ResourceCenter" type="application/rss+xml" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com" /><item>
      <title>The DataFlex-1000 High-Speed, High-Capacity Data Recorder with Optional, Built-In Signal Conditioning</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2132-The_DataFlex1000_HighSpeed_HighCapacity_Data_Recorder_with_Optional_BuiltIn_Signal_Conditioning</link>
      <content:encoded>The DataFlex-1000 with optional, fully-integrated, software-driven signal conditioning features a space-saving design and full system control, set-up and status via an integrated touch-screen display, making it an ideal choice for laboratory environments.</content:encoded>
      <pubDate>Mon, 09 Nov 2009 17:21:27 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2132-The_DataFlex1000_HighSpeed_HighCapacity_Data_Recorder_with_Optional_BuiltIn_Signal_Conditioning</guid>
      <dc:date>2009-11-09T17:21:27Z</dc:date>
    </item>
    <item>
      <title>The DataFlex-1000A Flight-Capable High-Speed, High-Capacity Data Recorder</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2131-The_DataFlex1000A_FlightCapable_HighSpeed_HighCapacity_Data_Recorder</link>
      <content:encoded>The new DataFlex-1000A with optional fully-integrated, software-driven signal conditioning features a sleek, portable, rack-mountable design with full system control, set-up and display provided by any PC or laptop, making it ideal for high-vibration environments. </content:encoded>
      <pubDate>Mon, 09 Nov 2009 17:19:01 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2131-The_DataFlex1000A_FlightCapable_HighSpeed_HighCapacity_Data_Recorder</guid>
      <dc:date>2009-11-09T17:19:01Z</dc:date>
    </item>
    <item>
      <title>Faster Time to Root Cause with Diagnosis-Driven Yield Analysis</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2120-Faster_Time_to_Root_Cause_with_DiagnosisDriven_Yield_Analysis_</link>
      <content:encoded>Learn the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent™ Diagnosis and Tessent YieldInsight™ software products. ICs developed at advanced technology nodes of 65 nm and below exhibit an increased sensitivity to small manufacturing variations. New design-specific and feature-sensitive failure mechanisms are on the rise. Without improved yield analysis methods, time-to-volume is delayed, mature yield is suboptimal, and product quality may suffer, thereby threatening a manufacturer’s profitability.</content:encoded>
      <pubDate>Wed, 04 Nov 2009 16:45:56 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2120-Faster_Time_to_Root_Cause_with_DiagnosisDriven_Yield_Analysis_</guid>
      <dc:date>2009-11-04T16:45:56Z</dc:date>
    </item>
    <item>
      <title>Techniques to Reduce Measurement Errors in Challenging Environments</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2101-Techniques_to_Reduce_Measurement_Errors_in_Challenging_Environments</link>
      <content:encoded>Data acquisition applications require making sensitive measurements in environments with high noise levels and electrical interference. This paper explores the latest advances in integrated signal conditioning technologies, along with recommended measurement techniques, to maximize overall system-level performance and minimize sources of error.</content:encoded>
      <pubDate>Fri, 30 Oct 2009 14:58:54 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2101-Techniques_to_Reduce_Measurement_Errors_in_Challenging_Environments</guid>
      <dc:date>2009-10-30T14:58:54Z</dc:date>
    </item>
    <item>
      <title>A Guide to Calibrating Your Spectrum Analyzer</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2068-A_Guide_to_Calibrating_Your_Spectrum_Analyzer</link>
      <content:encoded>Spectrum analyzers are often perceived as being complex and time-consuming to calibrate. This application note explains why regular calibration is important and summarizes the key steps for calibrating a spectrum analyzer.</content:encoded>
      <pubDate>Mon, 19 Oct 2009 18:34:06 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2068-A_Guide_to_Calibrating_Your_Spectrum_Analyzer</guid>
      <dc:date>2009-10-19T18:34:06Z</dc:date>
    </item>
    <item>
      <title>Verification of Electrical Safety Testers: A Better Approach</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2067-Verification_of_Electrical_Safety_Testers%3A_A_Better_Approach</link>
      <content:encoded>It can be challenging for metrologists to properly verify the performance of electrical testers, especially those with high voltages, high currents and extreme resistance measurement capability. This paper describes some of the requirements to verify the performance of common testers. It also describes an improved method of verifying many of these devices.</content:encoded>
      <pubDate>Mon, 19 Oct 2009 18:28:20 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2067-Verification_of_Electrical_Safety_Testers%3A_A_Better_Approach</guid>
      <dc:date>2009-10-19T18:28:20Z</dc:date>
    </item>
    <item>
      <title>Acquisition, Handling and Analysis of Measurement Data in Real Time - with HBM's Genesis HighSpeed</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2044-Acquisition_Handling_and_Analysis_of_Measurement_Data_in_Real_Time__with_HBM_s_Genesis_HighSpeed</link>
      <content:encoded>Requirements for data acquisition (DAQ) systems are now far more demanding. Not only are sample rates increasing; the number of channels and the amount of acquired data are also growing. At the same time, the times-per-test are decreasing. This paper describes how to handle and analyze the increasing amount of test data - with the high-end DAQ system Genesis HighSpeed.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 19:02:32 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2044-Acquisition_Handling_and_Analysis_of_Measurement_Data_in_Real_Time__with_HBM_s_Genesis_HighSpeed</guid>
      <dc:date>2009-10-14T19:02:32Z</dc:date>
    </item>
    <item>
      <title>What is NI VeriStand?</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2003-What_is_NI_VeriStand%3F</link>
      <content:encoded>NI VeriStand is a software environment for configuring real-time testing applications, including hardware-in-the-loop (HIL) tests. Out of the box, NI VeriStand helps you configure a multicore-ready real-time engine to execute tasks that include Analog, digital, communication bus, and field-programmable gate array (FPGA)-based I/O interfaces, triggerable, multifile data logging, real-time stimulus generation , calculated channels, and event alarming and alarm response routines. NI VeriStand is designed to be customized and extended using a variety of software environments, including NI LabVIEW, NI TestStand, Microsoft Visual Studio .NET, C/C++, and Python.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2003-What_is_NI_VeriStand%3F</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>What can I use the PXIe-6544/45 (Digital Waveform Generators/Analyzers) for?</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2002-What_can_I_use_the_PXIe6544_45_%28Digital_Waveform_Generators_Analyzers%29_for%3F</link>
      <content:encoded>Mobile phones, high-definition televisions, computers, GPS units, and even simple semiconductor devices all require faster and larger amounts of digital data. To address these applications, National Instruments recently released the NI PXIe-6544/45 100/200 MHz high-speed digital input/output devices, which are ideal for faster clock and data-streaming rates. This white paper, explores some of the applications that are possible with the NI PXIe-6544/45; which includes chip testing and multimedia testing and communication.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2002-What_can_I_use_the_PXIe6544_45_%28Digital_Waveform_Generators_Analyzers%29_for%3F</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Understanding Software-Defined Automated Test Systems</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/2001-Understanding_SoftwareDefined_Automated_Test_Systems</link>
      <content:encoded>Engineers have used software-defined instrumentation to solve demanding automated test and measurement applications for more than 20 years. Its recent widespread adoption is due to the increasing test challenges that are causing engineers to search for a more flexible and modular test solution. View the short webcast to understand the core principles of software-defined instrumentation, what you can do with software-defined instruments, how to implement a modular, software-defined test system architecture.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/2001-Understanding_SoftwareDefined_Automated_Test_Systems</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Embedded JTAG Solutions for ATB Design</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1891-Embedded_JTAG_Solutions_for_ATB_Design</link>
      <content:encoded>Escape Communications asked Flynn Systems to help them tackle the challenge of embedding boundary scan tests into their ATB design through the use of readily available, off-the-shelf firmware in order to minimize customization and engineering development costs.  Download this case study and receive a Free 30-Day Boundary Scan/JTAG Software Evaluation.</content:encoded>
      <pubDate>Wed, 07 Oct 2009 20:48:14 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1891-Embedded_JTAG_Solutions_for_ATB_Design</guid>
      <dc:date>2009-10-07T20:48:14Z</dc:date>
    </item>
    <item>
      <title>How to Test MIMO Devices Via Channel Sounding?</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1888-How_to_Test_MIMO_Devices_Via_Channel_Sounding%3F_</link>
      <content:encoded>Never before has understanding the wireless channel been such an important part of designing wireless systems. Learn the basics of the wireless communication channel, MIMO channel sounding, and channel emulation. Hear about a flexible, cost-effective test system that can be used for performing channel sounding and emulation, and functional testing of MIMO wireless devices. Register today!</content:encoded>
      <pubDate>Mon, 14 Sep 2009 14:33:44 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1888-How_to_Test_MIMO_Devices_Via_Channel_Sounding%3F_</guid>
      <dc:date>2009-09-14T14:33:44Z</dc:date>
    </item>
    <item>
      <title>How to Create Advanced ATE Systems with LXI: Building on the Industry’s Best Practices </title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1886-How_to_Create_Advanced_ATE_Systems_with_LXI%3A_Building_on_the_Industry%E2%80%99s_Best_Practices%C2%A0</link>
      <content:encoded>What are the advantages of putting test systems online?  What is the difference between LAN (Local Area Network) and LXI (LAN eXtensions for Instrumentation) instruments? How does LXI work with my existing equipment?  This webcast will give you an overview of these topics, and more. Moderated by Rick Nelson, featuring LXI Consortium panelists. Register now!</content:encoded>
      <pubDate>Fri, 11 Sep 2009 17:41:58 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1886-How_to_Create_Advanced_ATE_Systems_with_LXI%3A_Building_on_the_Industry%E2%80%99s_Best_Practices%C2%A0</guid>
      <dc:date>2009-09-11T17:41:58Z</dc:date>
    </item>
    <item>
      <title>New Switch-A-Pitch Adapters from Aries Electronics</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1860-New_SwitchAPitch_Adapters_from_Aries_Electronics</link>
      <content:encoded>Aries Electronics has added a unique adapter series to its extensive line of Correct-a-Chip adapters that save end users both time and money. The new BGA Switch-A-Pitch Adapters enable the use of smaller pitch devices with larger pitch boards.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1860-New_SwitchAPitch_Adapters_from_Aries_Electronics</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Aries' Custom Fine Pitch Gold Bump Adapters</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1859-Aries__Custom_Fine_Pitch_Gold_Bump_Adapters_</link>
      <content:encoded>Aries Electronics’ new series of adapters enable the use of virtually any SMT IC device on a pitch of 0.4 mm or higher to PC boards on 0.5 mm pitch.  These adapt an IC device to some of the more popular TSSOP and QFP packages on 0.5 mm pitch.  The unique Fine Pitch Bump Adapters save designers significant time and money by eliminating the need for costly engineering rework.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1859-Aries__Custom_Fine_Pitch_Gold_Bump_Adapters_</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Aries Electronics’ CSP/BallNest Hybrid Socket</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1858-Aries_Electronics%E2%80%99_CSP_BallNest_Hybrid_Socket</link>
      <content:encoded>Aries Electronics announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket can be used on devices with a 0.30 mm pitch or larger. A lid nests each ball termination into the socket for reliable connection.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1858-Aries_Electronics%E2%80%99_CSP_BallNest_Hybrid_Socket</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Adjustable Pressure Pad on Aries' New CSP Test Socket</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1857-Adjustable_Pressure_Pad_on_Aries__New_CSP_Test_Socket</link>
      <content:encoded>Aries Electronics now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pads.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1857-Adjustable_Pressure_Pad_on_Aries__New_CSP_Test_Socket</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Aries' Switch-A-Pitch Adapter 0.40mm to 1.27mm</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1856-Aries__SwitchAPitch_Adapter_040mm_to_127mm</link>
      <content:encoded>Aries Electronics expanded its line of BGA Switch-A-Pitch Adapters that simplify high density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards. The series now includes models with tops where the BGA landing pads are on a 0.40 mm pitch and adapter bottoms are populated with BGA balls on a 1.27 mm pitch.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1856-Aries__SwitchAPitch_Adapter_040mm_to_127mm</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>How to Calibrate an RTD or Platinum Resistance Thermometer (PRT)</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1840-How_to_Calibrate_an_RTD_or_Platinum_Resistance_Thermometer_%28PRT%29</link>
      <content:encoded>Two types of calibrations apply to PRTs—characterization and tolerance testing. The type of calibration to perform is determined by the way in which the unit under test (UUT) is to be used and the accuracy required by the user. Characterization is the type of calibration in which the UUT resistance is determined at several temperature points and the data are fitted to a mathematical expression. This application note describes calibration by characterization and tolerance testing of RTDs or PRTs.</content:encoded>
      <pubDate>Mon, 19 Oct 2009 18:28:20 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1840-How_to_Calibrate_an_RTD_or_Platinum_Resistance_Thermometer_%28PRT%29</guid>
      <dc:date>2009-10-19T18:28:20Z</dc:date>
    </item>
    <item>
      <title>Low Pin Count Test with Embedded Compression</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1800-Low_Pin_Count_Test_with_Embedded_Compression</link>
      <content:encoded>This webcast discusses methodologies that enable designers to reduce the number of pins and top level routing required for the application of high quality test. Topics include: &#xD;
(1) High test compression with as few as 1 or 2 test channels, &#xD;
(2) Minimize congestion in top level routing using 1 or 2 test channels to access internal blocks, &#xD;
(3) Sample of real world LPCT implementations, and &#xD;
(4) Ways boundary scans achieve LPCT.</content:encoded>
      <pubDate>Wed, 04 Nov 2009 16:45:56 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1800-Low_Pin_Count_Test_with_Embedded_Compression</guid>
      <dc:date>2009-11-04T16:45:56Z</dc:date>
    </item>
    <item>
      <title>HSPA+:  Features and Testing Whitepaper</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1795-HSPA%2B%3A__Features_and_Testing_Whitepaper</link>
      <content:encoded>With 85% of all cellular calls in the world set up using 3GPP access technology, 3GPP is the most successful set of telecommunication standards in the world. HSPA+ uses MIMO technology and higher order modulation to deliver twice the data speed and three times the voice capacity of HSPA. Anritsu offers a complete line of flexible, ready-to-run products designed for HSPA+ testing to support your deployment plans.</content:encoded>
      <pubDate>Wed, 26 Aug 2009 17:43:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1795-HSPA%2B%3A__Features_and_Testing_Whitepaper</guid>
      <dc:date>2009-08-26T17:43:19Z</dc:date>
    </item>
    <item>
      <title>Non-intrusive Board Test Strategies for the Intel® Xeon® Processor 5500 Series</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1794-Nonintrusive_Board_Test_Strategies_for_the_Intel%C2%AE_Xeon%C2%AE_Processor_5500_Series</link>
      <content:encoded>Intel®’s new Xeon® Processor 5500 Series (codenamed Nehalem) is enjoying widespread adoption, but Nehalem circuit board designs challenge intrusive probe- or nails-based test strategies like ICT or MDA, which are constrained by diminished test access. This paper defines three non-intrusive board test (NBT) technologies and describes how they can provide comprehensive test coverage for Nehalem designs.</content:encoded>
      <pubDate>Wed, 07 Oct 2009 20:42:50 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1794-Nonintrusive_Board_Test_Strategies_for_the_Intel%C2%AE_Xeon%C2%AE_Processor_5500_Series</guid>
      <dc:date>2009-10-07T20:42:50Z</dc:date>
    </item>
    <item>
      <title>The Optimized Quality Workflow: Where Quality No Longer Starts or Ends with QA</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1772-The_Optimized_Quality_Workflow%3A_Where_Quality_No_Longer_Starts_or_Ends_with_QA</link>
      <content:encoded>Inefficient quality workflows with poorly utilized resources, deficient processes, and outdated technology can’t keep pace with today’s market demands for complex devices and services. This paper provides guidance on how to implement an optimized end-to-end quality workflow that enables up to five times more testing without increasing headcount.</content:encoded>
      <pubDate>Thu, 20 Aug 2009 13:16:03 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1772-The_Optimized_Quality_Workflow%3A_Where_Quality_No_Longer_Starts_or_Ends_with_QA</guid>
      <dc:date>2009-08-20T13:16:03Z</dc:date>
    </item>
    <item>
      <title>The Business Value of Test Asset Sharing in the Communications Industry</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1771-The_Business_Value_of_Test_Asset_Sharing_in_the_Communications_Industry</link>
      <content:encoded>This paper explores the fundamental processes and competitive advantages of sharing test assets between service providers and equipment vendors.  By sharing test cases, test reports, and other valuable assets, organizations can save time, increase test coverage, and better utilize resources to have a positive impact on the bottom line.</content:encoded>
      <pubDate>Thu, 20 Aug 2009 13:16:03 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1771-The_Business_Value_of_Test_Asset_Sharing_in_the_Communications_Industry</guid>
      <dc:date>2009-08-20T13:16:03Z</dc:date>
    </item>
    <item>
      <title>Using EDX Spectroscopy for Non-destructive Detection of Lead in Consumer Products</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1763-Using_EDX_Spectroscopy_for_Nondestructive_Detection_of_Lead_in_Consumer_Products</link>
      <content:encoded>Many techniques can be used to identify and quantify lead. However, some of the most common methods result in destruction of the product, thereby raising costs. Currently, X-ray fluorescence spectroscopy is the only detection technique that offers high-precision, non-destructive analysis to detect lead in a range of materials. This application analyzes the advantages and applications of this technique.</content:encoded>
      <pubDate>Fri, 14 Aug 2009 16:10:13 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1763-Using_EDX_Spectroscopy_for_Nondestructive_Detection_of_Lead_in_Consumer_Products</guid>
      <dc:date>2009-08-14T16:10:13Z</dc:date>
    </item>
    <item>
      <title>Improve Power Supply Performance and Safety Using Remote Sensing and Remote Disable</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1657-Improve_Power_Supply_Performance_and_Safety_Using_Remote_Sensing_and_Remote_Disable</link>
      <content:encoded>Power supplies will perform safely and as specified at the output terminals.  In many applications, the tests on the DUT are not performed right at the power supply output terminals.  Power supply features such as remote sense and remote disable allow the power supply regulate its output and even shut down based upon what is happening at the load.  Learn tips on how to use these features in your tests.</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1657-Improve_Power_Supply_Performance_and_Safety_Using_Remote_Sensing_and_Remote_Disable</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>Create Complex Sequences with a DC Power Supply</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1656-Create_Complex_Sequences_with_a_DC_Power_Supply</link>
      <content:encoded>DC power supplies are a fundamental component of almost every test system.  Today’s complex automatic test equipment (ATE) systems must quickly perform a variety of tests, either to increase test system throughput or to tweak and optimize design performance.   Learn the benefits of using list mode to create complex sequences and for improved testing and reduced test time.</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1656-Create_Complex_Sequences_with_a_DC_Power_Supply</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>Achieve Cleaner Power Signals by Minimizing Common Sources of Noise</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1655-Achieve_Cleaner_Power_Signals_by_Minimizing_Common_Sources_of_Noise</link>
      <content:encoded>Nose in low-level measurements can come from a number of different sources, including motors, office machines, power demands, and the switching supplies found in office equipment.  It is possible to filter this noise at the load, but it is often easier to reduce or eliminate the noise before it reaches the DUT.  Learn tips on what features to look for in the power supply, and how to minimize the noise in your test setup.</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1655-Achieve_Cleaner_Power_Signals_by_Minimizing_Common_Sources_of_Noise</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>Examining the 10 Most Common PXI Test, Measurement, and Control Applications - Part I</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1472-Examining_the_10_Most_Common_PXI_Test_Measurement_and_Control_Applications__Part_I</link>
      <content:encoded>PXI is a rugged PC-based platform that offers high-performance measurement and control capabilities in a low-cost deployment package. With the modular form factor, you can mix and match PXI modules from NI and other PXI vendors to incorporate the exact measurement and control I/O you need in each system. Integrated timing and triggering features in the PXI backplane provide precise intermodule synchronization. Lastly, National Instruments industry-leading PXI software connectivity with NI LabVIEW graphical programming, NI LabWindows™/CVI (ANSI C) software, and Microsoft Visual Studio give you complete control of your PXI system to build fully customized graphical user interfaces, measurement and control analysis, and documentation and reporting.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1472-Examining_the_10_Most_Common_PXI_Test_Measurement_and_Control_Applications__Part_I</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Examining the 10 Most Common PXI Test, Measurement, and Control Applications - Part II</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1470-Examining_the_10_Most_Common_PXI_Test_Measurement_and_Control_Applications__Part_II</link>
      <content:encoded>PXI is a rugged PC-based platform that offers high-performance measurement and control capabilities in a low-cost deployment package. With the modular form factor, you can mix and match PXI modules from NI and other PXI vendors to incorporate the exact measurement and control I/O you need in each system. Integrated timing and triggering features in the PXI backplane provide precise intermodule synchronization. Lastly, National Instruments industry-leading PXI software connectivity with NI LabVIEW graphical programming, NI LabWindows™/CVI (ANSI C) software, and Microsoft Visual Studio give you complete control of your PXI system to build fully customized graphical user interfaces, measurement and control analysis, and documentation and reporting.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1470-Examining_the_10_Most_Common_PXI_Test_Measurement_and_Control_Applications__Part_II</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>NI TestStand Advanced Architecture Series</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1469-NI_TestStand_Advanced_Architecture_Series</link>
      <content:encoded>The NI TestStand Advanced Architecture Series consists of documents covering topics of interest to advanced NI TestStand developers. The series' authors are NI TestStand architects and developers who provide insightful content that goes beyond basic documentation by offering best practices for large and complex projects.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1469-NI_TestStand_Advanced_Architecture_Series</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Learn more about how the Multimedia Test System (MMTS) can solve your audio/video testing needs.</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1468-Learn_more_about_how_the_Multimedia_Test_System_%28MMTS%29_can_solve_your_audio_video_testing_needs</link>
      <content:encoded>The need to test multiple technologies on one device has increased dramatically as consumers demand more sophistication from their multimedia products. VI Technology’s award-winning Multimedia Test System (MMTS) is designed to deliver the fastest path to audio and video measurements for multimedia devices, such as DVD players, set top boxes, smart phones, mobile devices, video game consoles, and computers. Learn more about the MMTS and how it can solve your audio/video testing needs.</content:encoded>
      <pubDate>Wed, 17 Jun 2009 16:07:05 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1468-Learn_more_about_how_the_Multimedia_Test_System_%28MMTS%29_can_solve_your_audio_video_testing_needs</guid>
      <dc:date>2009-06-17T16:07:05Z</dc:date>
    </item>
    <item>
      <title>Parts Collaboration Within the Sunstone ECOsystem: PCB123&amp;#153, LiveBOM&amp;#153, Digi-Key® &amp; NXP®</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1441-Parts_Collaboration_Within_the_Sunstone_ECOsystem%3A_PCB123%23153_LiveBOM%23153_DigiKey%C2%AE__NXP%C2%AE</link>
      <content:encoded>Sunstone Circuits’ technological collaboration with Digi-Key Corporation and NXP Semiconductor provides Sunstone PCB123 CAD users access to ready-made, certified parts symbols from NXP. Not only is sufficient information provided to ensure accurate physical design, but the collaboration also ensures efficient design with component availability and pricing information. Within the Sunstone ECOsystemSM, these new functional elements provide the end user with a turn-key level of convenience and accuracy, even when working on prototypes and early engineering projects.</content:encoded>
      <pubDate>Mon, 08 Jun 2009 16:48:21 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1441-Parts_Collaboration_Within_the_Sunstone_ECOsystem%3A_PCB123%23153_LiveBOM%23153_DigiKey%C2%AE__NXP%C2%AE</guid>
      <dc:date>2009-06-08T16:48:21Z</dc:date>
    </item>
    <item>
      <title>Future technologies and testing for Fixed Mobile Convergence, SAE and LTE in cellular mobile communications</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1431-Future_technologies_and_testing_for_Fixed_Mobile_Convergence_SAE_and_LTE_in_cellular_mobile_communications</link>
      <content:encoded>The Mobile Communications industry is currently developing standards and solutions for the next steps in the evolution of mobile networks. This whitepaper looks at the fundamental radio and network technologies being introduced in these steps, and how this is aligned into the future Fixed Mobile Convergence (FMC) of the Next Generation Networks.</content:encoded>
      <pubDate>Wed, 02 Sep 2009 19:37:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1431-Future_technologies_and_testing_for_Fixed_Mobile_Convergence_SAE_and_LTE_in_cellular_mobile_communications</guid>
      <dc:date>2009-09-02T19:37:11Z</dc:date>
    </item>
    <item>
      <title>Aries' Switch A Pitch Adapters Explanation</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1427-Aries__Switch_A_Pitch_Adapters_Explanation</link>
      <content:encoded>New developments in the design of BGA devices are now occurring on a regular basis. Reduction of device size is always a consideration, so a frequent “improvement” is the reduction of a device’s pin-to-pin pitch – often while incorporating new capabilities in the device.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1427-Aries__Switch_A_Pitch_Adapters_Explanation</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Evolution of A Special Test Socket Design</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1424-Evolution_of_A_Special_Test_Socket_Design</link>
      <content:encoded>A conversation between Aries Electronics and a customer explaining the evolutions of a test socket.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1424-Evolution_of_A_Special_Test_Socket_Design</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>CSP Test Socket “Probe and Spring” Explanation</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1419-CSP_Test_Socket_%E2%80%9CProbe_and_Spring%E2%80%9D_Explanation</link>
      <content:encoded>Aries has designed a complete, new, cost effective concept for test sockets. The design is very cost effective for two reasons.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1419-CSP_Test_Socket_%E2%80%9CProbe_and_Spring%E2%80%9D_Explanation</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Aries Electronics Correct-A-Chip</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1417-Aries_Electronics_CorrectAChip</link>
      <content:encoded>In the late 1980’s, Aries introduced the concept of “Correct-A-Chip Adapters”. The initial designs resulted from applications where a through-hole DIP device became obsolete. Aries innovated the use of PCBs integrated into DIP to DIP adapters where the female pins on the top of the adapter were connected to a re-routing PCB in the middle.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1417-Aries_Electronics_CorrectAChip</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>The Connector Conundrum</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1416-The_Connector_Conundrum_</link>
      <content:encoded>The Conundrum: The way to get the piece cost down on a test socket designed to work with a specific device package is to make a set of molds specific to the application. Unfortunately, a set of molds is expensive. If you’re going to make thousands of sockets, you can justify this cost. But for many situations, only a few sockets are needed.</content:encoded>
      <pubDate>Thu, 01 Oct 2009 16:21:28 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1416-The_Connector_Conundrum_</guid>
      <dc:date>2009-10-01T16:21:28Z</dc:date>
    </item>
    <item>
      <title>Mass InterConnect Preserves Test Instrumentation</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1362-Mass_InterConnect_Preserves_Test_Instrumentation</link>
      <content:encoded>Mass InterConnect systems provide a reliable connection between instruments and units under test (UUTs). When testing printed circuit boards (PCBs), quality is paramount. Whether the system is PXI, VXI, LXI or rack and stack, mass interconnects can consolidate I/O and reduce testing time. A range of connectors and interfaces ensure that any testing system can be protected by a mass interconnect solution.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:36:47 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1362-Mass_InterConnect_Preserves_Test_Instrumentation</guid>
      <dc:date>2009-05-08T13:36:47Z</dc:date>
    </item>
    <item>
      <title>VPC Online Configurators</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1361-VPC_Online_Configurators</link>
      <content:encoded>VPC online configurators offer a streamlined method for designing patchcords and cable assemblies using signal, power, coaxial, thermocouple, pneumatic, and other contacts &amp; modules. These easy to follow steps will guide you through the design process.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1361-VPC_Online_Configurators</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>Mass InterConnect Solutions Catalog</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1341-Mass_InterConnect_Solutions_Catalog_</link>
      <content:encoded>VPC offers a range of mass interconnect solutions for a variety of testing needs. Ranging from 2 to 75 module configurations, with a variety of I/O options, any testing interconnect need can be met by VPC's solutions.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1341-Mass_InterConnect_Solutions_Catalog_</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>Mass InterConnect Military Applications</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1340-Mass_InterConnect_Military_Applications</link>
      <content:encoded>VPC offers a range of interconnect products. Learn how VPC's military customers have integrated mass interconnect solutions.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1340-Mass_InterConnect_Military_Applications</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>VPC iCon Product Catalog</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1339-VPC_iCon_Product_Catalog</link>
      <content:encoded>VPC's  iCon allows a wide range of I/O, including signal, power and coaxial in one small package. A half-turn rugged engaging mechanism is engineered for 10,000 cycles and is designed to mate up to 320 signal contacts.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1339-VPC_iCon_Product_Catalog</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>Mass InterConnect Automotive Applications</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1337-Mass_InterConnect_Automotive_Applications</link>
      <content:encoded>VPC offers a range of interconnect products. Learn how VPC's automotive customers have integrated mass interconnect solutions into test platforms. Applications include thermal testing of air bag electrical control units (ECUs) and electrical testing of ECUs for engine, lock-key and naviation systems.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1337-Mass_InterConnect_Automotive_Applications</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>Mass InterConnect Commercial Applications</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1335-Mass_InterConnect_Commercial_Applications_</link>
      <content:encoded>VPC offers a range of interconnect products. Learn how VPC's commercial customers have integrated mass interconnect solutions into test platforms. Applications include VI Technology's IC Characterization System, Fulitech's cell phone PCB tester, and Peritec's Mixed Signal IC tester for component PCBs.</content:encoded>
      <pubDate>Fri, 08 May 2009 13:25:26 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1335-Mass_InterConnect_Commercial_Applications_</guid>
      <dc:date>2009-05-08T13:25:26Z</dc:date>
    </item>
    <item>
      <title>Using JTAG Emulation for Board-Level Functional Test</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1282-Using_JTAG_Emulation_for_BoardLevel_Functional_Test</link>
      <content:encoded>This paper provides insight in how to utilize a device's JTAG port to perform interconnect and functional based tests for high speed peripherals such as DDR3 SDRAMs. It also discusses the benefits and cost savings when using this test strategy.</content:encoded>
      <pubDate>Wed, 19 Aug 2009 15:38:07 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1282-Using_JTAG_Emulation_for_BoardLevel_Functional_Test</guid>
      <dc:date>2009-08-19T15:38:07Z</dc:date>
    </item>
    <item>
      <title>Limited Access Testing on the Agilent i3070”</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1196-Limited_Access_Testing_on_the_Agilent_i3070%E2%80%9D</link>
      <content:encoded>Modern electronic products are at risk of losing electrical test access to in-circuit test (ICT) due to product miniaturization and sophistication. Many of the limited access testing tools used in high-end products are now being applied to consumer products. However, new technologies have been developed to complement existing ones, including Agilent’s Medalist i3070 ICTSuper 7 suite. This paper provides an introduction to the toolset.</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1196-Limited_Access_Testing_on_the_Agilent_i3070%E2%80%9D</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>Leading the Way in Automated Test</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1089-Leading_the_Way_in_Automated_Test</link>
      <content:encoded>For more than 30 years, National Instruments has helped companies worldwide build more cost-effective automated test systems. While continuing to serve as today’s leading authority in instrument control, NI is now driving innovation in test system design with virtual instrumentation. Reduce your costs by investing in a platform that combines open PC technologies and modular instrumentation with industry-leading test system software.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1089-Leading_the_Way_in_Automated_Test</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Reducing Switching Costs in Automated Test System with FETs and SSRs</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/1087-Reducing_Switching_Costs_in_Automated_Test_System_with_FETs_and_SSRs</link>
      <content:encoded>Found in products from automotive engines to thermocouples, electromechanical relays are readily available, low-cost devices that you can use to route signals originating from almost anywhere. It is no wonder that these devices have become ubiquitous in the automated test market. Despite their industry adoption, electromechanical relays are relatively slow (hundreds of channels per second) and have limited lifetime, which makes them unsuitable for use in applications such as semiconductor validation test.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/1087-Reducing_Switching_Costs_in_Automated_Test_System_with_FETs_and_SSRs</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Fibre Channel over Ethernet (FCoE) Test Challenges</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/896-Fibre_Channel_over_Ethernet_%28FCoE%29_Test_Challenges</link>
      <content:encoded>Fibre Channel over Ethernet (FCoE) technology maps the impeccable advantages of Fibre Channel on performance, security, and effectiveness in terms of storage transportation onto Ethernet network. Learn about the challenges of FCoE from a test and measurement perspective, differences of methodologies on LAN and SAN oriented testing, and challenges of integrating into one universal solution. Register now.</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/896-Fibre_Channel_over_Ethernet_%28FCoE%29_Test_Challenges</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Simplify Your DMM: Top Five Tools and Tips</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/887-Simplify_Your_DMM%3A_Top_Five_Tools_and_Tips</link>
      <content:encoded>Although digital multimeters (DMMs) are common instruments found in most automated test systems, not all DMMs are designed with programming and automation in mind. NI DMMs, which are designed specifically for automated test, offer a variety of tools to make programmatic measurements and switching easier to implement and more reliable. This paper examines the top five tools provided by NI DMMs and tips for getting the most out of them.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/887-Simplify_Your_DMM%3A_Top_Five_Tools_and_Tips</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Digi Jump-Starts Your Embedded Development</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/882-Digi_JumpStarts_Your_Embedded_Development</link>
      <content:encoded>Digi JumpStart Kits&amp;trade; are complete development solutions that leverage the reliability and flexibility of the royalty-free ThreadX-based NET+OS&amp;reg; platform, or the readily available library of software and community support of Linux. Kits for the ultra-compact Digi Connect ME&amp;reg; 9210 include module, development board, documentation and more.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/882-Digi_JumpStarts_Your_Embedded_Development</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Compact, Powerful, Secure Core Module Dev Kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/881-Compact_Powerful_Secure_Core_Module_Dev_Kit</link>
      <content:encoded>Digi&amp;#39;s ConnectCore 9P 9215 module delivers a powerful, secure, compact network-enabled 150 MHz processor solution with an ARM9 core, a rich set of peripherals and unique interface flexibility. Digi JumpStart Kits&amp;trade; for NET+OS&amp;reg;, Linux or Microsoft&amp;reg; .NET Micro Framework minimize design risks, so you can begin product development right out of the box.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/881-Compact_Powerful_Secure_Core_Module_Dev_Kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Wireless Network-Enabled Core Module Dev Kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/880-Wireless_NetworkEnabled_Core_Module_Dev_Kit</link>
      <content:encoded>The ConnectCore&amp;trade; Wi-9P 9215 wireless core module utilizes Digi&amp;#39;s NET+ARM processor and Digi&amp;#39;s own secure 802.11a/b/g WLAN technology with full WPA2/802.11i support, making it the industry&amp;#39;s only network-enabled core module with true long-term product availability. The Digi JumpStart Kit&amp;trade; makes embedded development easy and cost-effective.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/880-Wireless_NetworkEnabled_Core_Module_Dev_Kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Digi Drop-in Networking Professional Dev Kit, $199</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/879-Digi_Dropin_Networking_Professional_Dev_Kit_%24199</link>
      <content:encoded>This proof-of-concept wireless connectivity development kit from Digi provides the hardware and software needed to easily configure and &amp;quot;drop-in&amp;quot; a low-power mesh (including ZigBee) or multipoint sensor/device network. The kit includes XBee/XBee-PRO embedded modules, interface boards, a wireless gateway, wall router and Python programming engine.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/879-Digi_Dropin_Networking_Professional_Dev_Kit_%24199</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>868 MHz RF Module Kit for European M2M</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/878-868_MHz_RF_Module_Kit_for_European_M2M</link>
      <content:encoded>Digi&amp;#39;s XBee-PRO&amp;reg; 868 embeddable RF modules provide up to 40 km RF LOS transmission and are ideal for urban deployments. Customers using these modules can easily migrate to other XBee solutions, including pin-compatible 900 MHz and 2.4 GHz ZigBee and proprietary options. Development kits are available for a limited time for just $99.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/878-868_MHz_RF_Module_Kit_for_European_M2M</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Globally Deployable RF Module Development Kits</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/877-Globally_Deployable_RF_Module_Development_Kits</link>
      <content:encoded>Digi&amp;#39;s XBee&amp;reg; DigiMesh&amp;trade; 2.4 modules are globally deployable embedded RF modules available in low-power XBee and extended-range XBee-PRO&amp;reg; form factors. They combine a fast 2.4 GHz transceiver with the innovative DigiMesh peer-to-peer mesh networking protocol. Kits include 2 XBee and 2 XBee-PRO modules.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/877-Globally_Deployable_RF_Module_Development_Kits</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Webcast Available Now: Designing IP Enabled Devices to Drive Adoption of VoIP in the SMB Market</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/876-Webcast_Available_Now%3A_Designing_IP_Enabled_Devices_to_Drive_Adoption_of_VoIP_in_the_SMB_Market</link>
      <content:encoded>Continued headway of VoIP into the SMB marketplace depends on how effectively VoIP benefits can be translated via new devices and applications. Texas Instruments discusses challenges and solutions associated with designing products for this market, such as single-platform solutions, &amp;quot;office-in-a-box&amp;quot; devices, and more. This webcast is available today. Register now!</content:encoded>
      <pubDate>Wed, 04 Nov 2009 17:11:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/876-Webcast_Available_Now%3A_Designing_IP_Enabled_Devices_to_Drive_Adoption_of_VoIP_in_the_SMB_Market</guid>
      <dc:date>2009-11-04T17:11:51Z</dc:date>
    </item>
    <item>
      <title>Videocast: Reliable Wireless Sense and Control Made Easy</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/875-Videocast%3A_Reliable_Wireless_Sense_and_Control_Made_Easy</link>
      <content:encoded>Reliable and simple wireless solutions are no longer mutually exclusive. Learn about embedded wireless design challenges and tools needed to overcome them. CyFi&amp;trade; is a low-power RF solution that enables you to deploy a reliable, simple, power-efficient sense and control application quickly and easily. Register now!</content:encoded>
      <pubDate>Wed, 29 Jul 2009 20:31:13 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/875-Videocast%3A_Reliable_Wireless_Sense_and_Control_Made_Easy</guid>
      <dc:date>2009-07-29T20:31:13Z</dc:date>
    </item>
    <item>
      <title>Video Webcast: Capacitive Touch-Sensing Design Best Practices</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/874-Video_Webcast%3A_Capacitive_TouchSensing_Design_Best_Practices</link>
      <content:encoded>Touch-sensing is changing the way humans interact with products such as cell phones, PCs, consumer electronics, white goods, and automotive systems. Learn design best practices that are critical to adding elegant capacitive touch-sensing interfaces - touch-sensing buttons, sliders, touchpads - in this live video webcast with Q&amp;amp;A. Register now!</content:encoded>
      <pubDate>Wed, 29 Jul 2009 20:31:13 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/874-Video_Webcast%3A_Capacitive_TouchSensing_Design_Best_Practices</guid>
      <dc:date>2009-07-29T20:31:13Z</dc:date>
    </item>
    <item>
      <title>Product Lifecycle Insights: Tackling EU-REACH Environmental Compliance Head-on with Information</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/873-Product_Lifecycle_Insights%3A_Tackling_EUREACH_Environmental_Compliance_Headon_with_Information</link>
      <content:encoded>New Webcast: Industry leaders discuss escalating pressures facing global manufacturing and the growing information gaps impacting business performance related to regulatory and legislative compliance, component obsolescence, and quality and reliability. Register today!</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/873-Product_Lifecycle_Insights%3A_Tackling_EUREACH_Environmental_Compliance_Headon_with_Information</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Product Lifecycle Insights: Turbulent Green Supply Chains - Past, Present, and Future</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/872-Product_Lifecycle_Insights%3A_Turbulent_Green_Supply_Chains__Past_Present_and_Future</link>
      <content:encoded>Green doesn&amp;#39;t only impact those with eco-friendly or socially-responsible product ambitions, or that must comply with regulations like RoHS, WEEE, REACH and EuP. Learn about the impact of environmental performance on product lifecycles from a panel of experts led by the authors of &amp;quot;Benchmarking Green&amp;quot;, Rory King and Andrew K. Reese. Register now!</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/872-Product_Lifecycle_Insights%3A_Turbulent_Green_Supply_Chains__Past_Present_and_Future</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>How to Avoid the Traps and Pitfalls of SOC Design</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/871-How_to_Avoid_the_Traps_and_Pitfalls_of_SOC_Design</link>
      <content:encoded>New Webinar: Designing SOCs is a high-risk enterprise with many risks involved, and a high penalty for failure, since development costs are measured in millions of dollars. Join Tensilica&amp;#39;s Technology Evangelist Steve Leibson for an unusually frank discussion of ways you can avoid the traps and pitfalls and lead your team to a successful SOC design. Register now!</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/871-How_to_Avoid_the_Traps_and_Pitfalls_of_SOC_Design</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Everything You Wanted to Know About SOC Memory* .... * But Forgot to Ask</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/870-Everything_You_Wanted_to_Know_About_SOC_Memory*__*_But_Forgot_to_Ask</link>
      <content:encoded>If you&amp;#39;re a system architect or on an SOC design team, memory is critically important. On today&amp;#39;s multicore SOC designs, more on-chip silicon is devoted to memory than anything else, yet memory is often an afterthought. Learn the alternatives for on-chip and off-chip memory usage that designers must know to develop successful multicore SOCs. Register now!</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/870-Everything_You_Wanted_to_Know_About_SOC_Memory*__*_But_Forgot_to_Ask</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Wireless/wired industrial control development kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/869-Wireless_wired_industrial_control_development_kit</link>
      <content:encoded>Rabbit&amp;#39;s BL4S200 single-board computers deliver the features and wireless connectivity to support networking for industrial control applications. In addition to the Ethernet versions, the BL4S200 offers a choice of Wi-Fi and ZigBee enabled wireless networking options that have been certified by the FCC and other international agencies.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/869-Wireless_wired_industrial_control_development_kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>MiniCoreT Ultra-compact networking module kit - $49</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/868-MiniCoreT_Ultracompact_networking_module_kit__%2449</link>
      <content:encoded>Rabbit&amp;reg; has combined its legendary ease-of-use and drive toward product cost reductions in creating the most compact, lowest-cost, embedded solution available today. The MiniCore&amp;trade; family is Rabbit&amp;#39;s smallest and lowest cost embedded solution, and offers designers an easy path to adding reliable network connectivity to any system they design.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/868-MiniCoreT_Ultracompact_networking_module_kit__%2449</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Memory and mass storage for kit for embedded designs</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/867-Memory_and_mass_storage_for_kit_for_embedded_designs</link>
      <content:encoded>The RabbitCore&amp;reg; RCM4300 Module from Rabbit&amp;reg; offers the features and performance to support complex embedded designs such as data encryption, secure data transmission, and web server applications. The RCM4300 core module provides the capability to use up to 1 GB mass storage with the industry-standard miniSD&amp;trade; memory cards which you can swap with another miniSD card without powering down the module.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/867-Memory_and_mass_storage_for_kit_for_embedded_designs</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Module kit with on-board 802.15.4 mesh networking</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/866-Module_kit_with_onboard_802154_mesh_networking</link>
      <content:encoded>The RabbitCore&amp;reg; RCM4510W next-generation core module adds ZigBee enabled/802.15.4 mesh networking connectivity to the existing Rabbit&amp;reg; 4000 microprocessor features allowing you to create a low-cost, low-power, wireless network as part of your control solution for your embedded application.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/866-Module_kit_with_onboard_802154_mesh_networking</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>SMB (Server Message Block) Storage Application Kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/865-SMB_%28Server_Message_Block%29_Storage_Application_Kit</link>
      <content:encoded>Use the SMB protocol for high-capacity storage space over a network connection. The SMB server shares file and printer resources over a computer network, allowing for flexibility and scalability. The included RabbitCore&amp;reg; module can act as an SMB client and remotely access the server shares.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/865-SMB_%28Server_Message_Block%29_Storage_Application_Kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Embedded ZigBee enabled-to-Ethernet gateway kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/864-Embedded_ZigBee_enabledtoEthernet_gateway_kit</link>
      <content:encoded>The BL4S100 is a low-cost Rabbit&amp;reg; 4000-based single-board computer that delivers ZigBee and Ethernet capability. ZigBee offers mesh networking functionality to make networking easy to deploy and maintain. With both Ethernet and ZigBee integrated, the BL4S100 delivers a low-cost platform to design a ZigBee enabled Ethernet network or gateway.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/864-Embedded_ZigBee_enabledtoEthernet_gateway_kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Advanced 802.11b/g embedded module development kit</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/863-Advanced_80211b_g_embedded_module_development_kit</link>
      <content:encoded>The RabbitCore&amp;reg; RCM5400W module from Rabbit&amp;reg; provides Wi-Fi/802.11b/g functionality which enables you to create low-cost, embedded wireless control and communication solution for embedded control applications.</content:encoded>
      <pubDate>Mon, 28 Sep 2009 14:15:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/863-Advanced_80211b_g_embedded_module_development_kit</guid>
      <dc:date>2009-09-28T14:15:19Z</dc:date>
    </item>
    <item>
      <title>Webcast on The Impact of Clock Recovery on Your Serial Data Measurements</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/862-Webcast_on_The_Impact_of_Clock_Recovery_on_Your_Serial_Data_Measurements</link>
      <content:encoded>Clock Recovery is an important component in serial data measurements, whether evaluating the performance of transmitters, receivers or systems. If you spend considerable time trying to achieve jitter measurements which correlate, you will see how the contribution of clock recovery performance can improve your measurement integrity. Register today.</content:encoded>
      <pubDate>Thu, 28 May 2009 14:39:37 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/862-Webcast_on_The_Impact_of_Clock_Recovery_on_Your_Serial_Data_Measurements</guid>
      <dc:date>2009-05-28T14:39:37Z</dc:date>
    </item>
    <item>
      <title>Demystifying Receiver Jitter Tolerance Testing</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/861-Demystifying_Receiver_Jitter_Tolerance_Testing</link>
      <content:encoded>Although all serial data standards specify a required receiver jitter tolerance, compliance testing of the link physical layer has generally ignored the receiver. This seminar fills knowledge gaps by explaining receiver testing and the complicated &amp;quot;recipe&amp;quot; of jitter sources, showing how jitter sources relate to interference mechanisms in the real communication channel, how to properly calibrate the jitter sources to assure accurate testing, and more. Register today!</content:encoded>
      <pubDate>Thu, 28 May 2009 14:39:37 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/861-Demystifying_Receiver_Jitter_Tolerance_Testing</guid>
      <dc:date>2009-05-28T14:39:37Z</dc:date>
    </item>
    <item>
      <title>Why Different Instruments Give You Different Jitter Answers</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/860-Why_Different_Instruments_Give_You_Different_Jitter_Answers</link>
      <content:encoded>Webcast: The fact that lab instruments, whether of different types, or models within the same type, give frustratingly different measured results for the same target device is not news to most engineers. Here we explore some underlying reasons why this occurs. Register today!</content:encoded>
      <pubDate>Thu, 28 May 2009 14:39:37 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/860-Why_Different_Instruments_Give_You_Different_Jitter_Answers</guid>
      <dc:date>2009-05-28T14:39:37Z</dc:date>
    </item>
    <item>
      <title>EM Tools for Designing Circuits, Packages, and Connectors</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/859-EM_Tools_for_Designing_Circuits_Packages_and_Connectors</link>
      <content:encoded>Exclusive Webcast: RF Designers today need an EDA toolset that helps with the challenges of high frequency and highly integrated design work. This webcast will show you how Agilent&amp;#39;s EEsof EDA portfolio assures design success from circuit level up to the highest levels of integration. Register today!</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/859-EM_Tools_for_Designing_Circuits_Packages_and_Connectors</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>Power Supply Measurement and Analysis</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/858-Power_Supply_Measurement_and_Analysis</link>
      <content:encoded>Free webcast: Today&amp;#39;s power supplies are driving to a level of efficiency never seen before. This webcast will explore the required measurements to validate and characterize each section of a common switch-mode power supply. Example topics include switching loss, safe operating area, slew rate, magnetic properties and power loss, power quality and harmonics. Register now!</content:encoded>
      <pubDate>Thu, 24 Sep 2009 16:19:04 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/858-Power_Supply_Measurement_and_Analysis</guid>
      <dc:date>2009-09-24T16:19:04Z</dc:date>
    </item>
    <item>
      <title>Device Test Considerations for CDMA2000/EV-DO to LTE Technology Migration</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/856-Device_Test_Considerations_for_CDMA2000_EVDO_to_LTE_Technology_Migration</link>
      <content:encoded>Live Webcast: As CDMA operators transition to LTE for their next generation wireless networks, this timely seminar provides an understanding of requirements for device testing including 3GPP2 to LTE mobility and System Selection scenarios. Sponsored by Anritsu, Hosted by EDN and T&amp;amp;MW. Register Today!</content:encoded>
      <pubDate>Wed, 26 Aug 2009 17:43:19 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/856-Device_Test_Considerations_for_CDMA2000_EVDO_to_LTE_Technology_Migration</guid>
      <dc:date>2009-08-26T17:43:19Z</dc:date>
    </item>
    <item>
      <title>Back-to-Basics: Channel modeling and &amp;#39;what if&amp;#39; analysis for signal integrity applications</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/854-BacktoBasics%3A_Channel_modeling_and_what_if_analysis_for_signal_integrity_applications</link>
      <content:encoded>Watch a rapid technique &amp;quot;what if&amp;quot; analysis for signal integrity applications. In this webcast with live Q&amp;amp;A, learn a faster, more thorough approach to explore the design space than iterating the hardware to success. An ADS circuit model using a Tyco XAUI backplane is used in simulations to show what configuration changes lead to the required performance. Register now!</content:encoded>
      <pubDate>Tue, 11 Aug 2009 18:40:51 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/854-BacktoBasics%3A_Channel_modeling_and_what_if_analysis_for_signal_integrity_applications</guid>
      <dc:date>2009-08-11T18:40:51Z</dc:date>
    </item>
    <item>
      <title>7 Ways A New Test Engineering Platform Will Help You Cut Costs In 2009</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/853-7_Ways_A_New_Test_Engineering_Platform_Will_Help_You_Cut_Costs_In_2009</link>
      <content:encoded>With the recent economic shift, OEMs are challenged to reduce the cost of manufacturing and test, yet deliver the same or better product quality. In this live webinar, you&amp;#39;ll learn 7 ways that a centralized test platform will help you establish a more efficient test process, so you can trim costs and stay competitive. Register today!</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/853-7_Ways_A_New_Test_Engineering_Platform_Will_Help_You_Cut_Costs_In_2009</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>The Basics of ZigBee Transmitter Testing</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/852-The_Basics_of_ZigBee_Transmitter_Testing</link>
      <content:encoded>ZigBee is a wireless standard for personal area network (PAN) sensor monitoring and control. Learn how National Instruments Alliance Partner SeaSolve has developed a test suite including transmit (Tx), receive (Rx) and compliance testing for ZigBee. In this application note, we will describe test methodologies and techniques for each type of testing.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/852-The_Basics_of_ZigBee_Transmitter_Testing</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Fast, Flexible 6.6 GHz RF Instrumentation for PXI</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/851-Fast_Flexible_66_GHz_RF_Instrumentation_for_PXI</link>
      <content:encoded>Download the information kit to learn how to perform automated measurements up to 10X faster than traditional instruments. NI RF instrumentation harnesses the latest computing technologies, such as multicore processors and the PCI Express data bus. Download the information kit to learn more.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/851-Fast_Flexible_66_GHz_RF_Instrumentation_for_PXI</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Why Choose a Modular Test Platform</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/850-Why_Choose_a_Modular_Test_Platform</link>
      <content:encoded>This webcast discusses how to optimize automated test systems. Presented by National Instruments</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/850-Why_Choose_a_Modular_Test_Platform</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Business Benefits of the NI Test Platform</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/848-Business_Benefits_of_the_NI_Test_Platform</link>
      <content:encoded>Learn how industry leaders, including Philips, Hella, Lockheed Martin, Motorola, Guidant, and Key Energy Services are using NI software and hardware to research, design, test, automate, and improve a wide array of products and services</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/848-Business_Benefits_of_the_NI_Test_Platform</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Best Practices for NI TestStand Process Model Development and Customization</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/847-Best_Practices_for_NI_TestStand_Process_Model_Development_and_Customization</link>
      <content:encoded>Process model development and customization is probably one of the most powerful features in NI TestStand because you can generalize concepts in multiple test sequences and promote heavy code reuse to reduce development and maintenance time. This document outlines best practices for customizing the process model. This document is most useful to those who have a good knowledge of basic process model development. Not understanding fully how to effectively customize process models can negatively affect system development, potentially during the later stages of the development cycle. Refer to the NI TestStand Reference Manual for more information about the different aspects of process models. If a project includes complex requirements, consider using outside expertise when the risk of the learning curve is not acceptable.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/847-Best_Practices_for_NI_TestStand_Process_Model_Development_and_Customization</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Implementing Parallel Test Architectures</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/846-Implementing_Parallel_Test_Architectures</link>
      <content:encoded>This webcast discusses parallel test architectures and their tendencies to become increasingly important parts of automated test systems today.</content:encoded>
      <pubDate>Wed, 14 Oct 2009 16:11:18 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/846-Implementing_Parallel_Test_Architectures</guid>
      <dc:date>2009-10-14T16:11:18Z</dc:date>
    </item>
    <item>
      <title>Boundary-Scan for PCB Interconnect Testing</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/845-BoundaryScan_for_PCB_Interconnect_Testing</link>
      <content:encoded>&lt;strong&gt;Boundary-Scan for PCB Interconnect Testing and In-System Device Programming&lt;/strong&gt;&amp;nbsp;&lt;br /&gt;&#xD;
&lt;br /&gt;&#xD;
A brief overview of boundary-scan architecture and its relation to the JTAG standard. New technology trends that make using boundary-scan essential for dramatically reducing development and production test costs. The various uses of boundary-scan and the tools available today for supporting boundary-scan technology.</content:encoded>
      <pubDate>Wed, 19 Aug 2009 15:38:07 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/845-BoundaryScan_for_PCB_Interconnect_Testing</guid>
      <dc:date>2009-08-19T15:38:07Z</dc:date>
    </item>
    <item>
      <title>Simulating The Effects of a Transfer Switch</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/844-Simulating_The_Effects_of_a_Transfer_Switch</link>
      <content:encoded>The purpose of this application note is to demonstrate how to simulate the phase shift that may be encountered on an AC line when power is applied from a second, &amp;ldquo;synchronized&amp;rdquo; source of AC Power. While the power lines are generally locked in frequency, phase shifting can often occur. Shown below are methods used to create a phase shift using Pacific&amp;#39;s UPC-Series Programmable Controller. The goal is to create a sub-cycle offset that can be programmed to occur at any phase angle on the fundamental waveform, and last for a specified number of degrees.</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/844-Simulating_The_Effects_of_a_Transfer_Switch</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Simulating AC Power Line Harmonics</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/841-Simulating_AC_Power_Line_Harmonics</link>
      <content:encoded>This application note will familiarize the reader with how various harmonics injected on individual phases (Line to Neutral) may not produce the expected results when observed Line to Line.</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/841-Simulating_AC_Power_Line_Harmonics</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>Pacific Power Source: The Power of Expertise</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/840-Pacific_Power_Source%3A_The_Power_of_Expertise</link>
      <content:encoded>At Pacific Power Source, Inc., customer satisfaction is delivered in twos--in terms of exceptional products and unmatched technological expertise.</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/840-Pacific_Power_Source%3A_The_Power_of_Expertise</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
    </item>
    <item>
      <title>UPC Manager Software</title>
      <link>http://tmworld.resourcecenteronline.com/resource_center/asset/839-UPC_Manager_Software</link>
      <content:encoded>UPC Manager Software gives you the tools necessary to quickly and easily operate your Pacific AC Power Source. With our complete, graphical interface, control all areas of your AC Power Source testing with simple presets, user prompts, Test Plans and custom reports.</content:encoded>
      <pubDate>Tue, 19 May 2009 15:58:11 GMT</pubDate>
      <guid>http://tmworld.resourcecenteronline.com/resource_center/asset/839-UPC_Manager_Software</guid>
      <dc:date>2009-05-19T15:58:11Z</dc:date>
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