The best courses and conferences on electronics

June 16 Webinar: Intro to PGI X64+GPU Fortran & C99 Compilers

noreply@blogger.com (Rodrigo Picos) — Wed, 03 Jun 2009 13:18:00 +0000

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Where Today’s
Technology Gurus Converge

Learn what’s REALLY happening in today’s hottest technology fields with the IEEE Spectrum Tech Insiders Webinar Series

About IEEE Spectrum Online
IEEE Spectrum Online is the flagship publication of the IEEE. It is a trusted source for technology innovators, business leaders, and the intellectually curious. Exclusive news stories, Webinars, blogs, and audio podcasts on emerging technologies can also be found on IEEE Spectrum Online.

Webinars as per your convenience....
Busy on the day of the live event? Simply Register now and access the webinar when it becomes Available on Demand the following day. We will email you the access details for the recorded webinar. The webinars are available on demand for 12 months after the live event.

System Requirements

200 MHz or faster

64 MB RAM minimum/128 MB recommended

16 bit sound card

16 bit color video display card

Windows XP/Windows Vista

Apple Mac OS X 10.4

Microsoft Windows Player 10 or 11

RealPlayer 10.X

Microsoft Internet Explorer 6.0 or later,

Mozilla Firefox 1.5 or later for Windows
Click here for more details and to Test Your System

The Brightest Minds Discussing the Biggest Topics

PGI X64+GPU FORTRAN & C99 COMPILERS

Tuesday, June 16, 2009
2:00 PM ET / 11:00 AM PT/ 18:00 GMT (Duration: 1 hour)

Until now, C and C++ developers targeting GPU accelerators have had to rely on language extensions to their programs. Use of GPUs from Fortran applications has been extremely limited. x64+GPU programmers have been required to program at a detailed level including a need to understand and specify data usage information and manually construct sequences of calls to manage all movement of data between the x64 host and GPU.

Learn how the PGI x64+GPU compilers automatically analyze whole program structure, split portions of the application between the x64 CPU and GPU as specified by user directives; and then generate an optimized mapping of loops to automatically use the parallel cores, hardware threading capabilities and SIMD vector capabilities of modern GPUs.

Also in this webinar learn how these compilers will support user directives that give the programmer fine-grained control over the mapping of loops, allocation of memory, and optimization for the GPU memory hierarchy. The PGI compilers generate unified x64+GPU object files and executables that manage all movement of data to and from the GPU device while leveraging all existing host-side utilities—-linker, librarians, makefiles--and require no changes to the existing standard HPC Linux/x64 programming environment.

Presenter:
Michael Wolfe, Compiler Engineer at The Portland Group
He is PhD in Computer Science from the University of Illinois, and his responsibilities include deep compiler analysis and optimizations. He has published a textbook, "High Performance Compilers for Parallel Computing", and a monograph, "Optimizing Supercompilers for Supercomputers," and many technical papers.

Moderator: Ron Schneiderman
Author, The Mobile Technology Question & Answer Book — A Survival Guide for Business Managers and Technology Lost — Hype and Reality in the Digital Age
Contributing Editor, Electronic Design and Vision magazines
Founding Editor, Wireless Systems Design magazine

WHO SHOULD ATTEND:

Programmers interested in porting their applications to run on x64+GPU accelerators
Engineering Management
Academia

Register now for this Webinar!

Webinar: Mobile Internet Device Architectures

noreply@blogger.com (Rodrigo Picos) — Wed, 30 Jul 2008 07:08:00 +0000

Free webinar: Mobile Internet Device (MID) architectures

Register now! On August 7, 2008, at 11 a.m. Central time, In-Stat and Texas Instruments will team up to present a series of insights into the technologies and market dynamics that will Unleash the Mobile Internet. The series includes the following:

MID market overview (June 26)
MID architectures (August 7)
MID business model (September)
MID ecosystem (November)

The first highly attended webinar on the MID market overview provided MID definition and huge potential for this emerging application. A webinar replay is available.

Join In-Stat's Jim McGregor, principal analyst and research director, for the second webinar in the series, MID architectures. Jim will be moderating an hour-long webinar featuring a live Q&A discussion with TI's Brian Carlson and other industry participants on the critical topic of hardware and software architectures for this new class of mobile solutions. Among the topics of the discussion are the following:

ARM vs. x86
System-on-a-chip vs. multi-chip approach
Hardware systems architecture
Software systems architecture

Don't miss this opportunity to gain a unique understanding of the industry's most promising segments as we address the critical issue of system and solution design. As mobile users increasingly demand "no compromise" wireless Internet solutions, understanding the applications, hardware alternatives, new software requirements, communications technologies, usage models, and evolving business models becomes crucial in this growing and dynamic segment.

Register now

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PRiME 2008 - REGISTER NOW!

noreply@blogger.com (Rodrigo Picos) — Mon, 28 Jul 2008 06:43:00 +0000

REGISTRATION IS NOW OPEN!

PRiME 2008 / Joint International Meeting

214th ECS Meeting
2008 Fall Meeting of The Electrochemical Society of Japan

And with the Technical co-sponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, The Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry

Hilton Hawaiian Village Beach Resort and
the Hawaii Convention Center, Honolulu HI

October 12-17, 2008

For more information and to register, please visit our website: http://www.electrochem.org/

Please note these important deadlines for the Hawaii PRiME 2008 Meeting:

1. Meeting and Short Course Registrations are due to ECS Headquarters no later than September 12, 2008 to qualify for the advance registration discount.

Register for the meeting using our online system that processes your Visa, MasterCard, or American Express credit card payment in real time:
https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs

If you prefer, send or fax a hard copy of your meeting registration form with payment to ECS at 65 South Main St., Pennington, NJ 08534, USA, Fax: 1.609.737.2743, or E-mail: ecs@electrochem.org, no later than September 12, 2008. You can download the meeting registration brochure at:
http://www.electrochem.org/meetings/biannual/214/214.htm

Please Note: All technical registrations include a copy of the meeting abstracts on CD-ROM only. Attendees who wish to have paper copies of abstracts should download them in advance of the meeting from the ECS website:
http://ecsmeet2.peerx-press.org/jsp/mas/reportSymposiumList.jsp

2. Hotel reservations must be made by September 12, 2008 to qualify for the discounted meeting rates! Please follow the link to make a hotel room reservation online:
http://www.hilton.com/en/hi/groups/personalized/HNLHVHH-AAM-20081004/index.jhtml

ATTENTION:

Please review the following instructions before registering for PRiME 2008.

Electrochemical Society Members (ECS): Please proceed to the registration page(s) by selecting the event(s) you wish to register for.

Electrochemical Society of Japan (ECSJ) and Korean Electrochemical Society (KES) Members who are not members of ECS: Your Societies have provided ECS with your names and email addresses, and you have been entered into our systems. Your default username to enter the registration process will be your email address and your default password will be "password".

Japan Society of Applied Physics (JSAP), Royal Australian Chemical Institute (RACI), and Chinese Society of Electrochemistry (CSE) Members who are not members of ECS: Please visit http://www.electrochem.org/prime/prime_registration.asp to add your information to our database. Once you have completed creating your user account, you will be able to enter the system with a default username of your email address and a default password of "password".

Attendees who are not members of ECS, ECSJ, JSAP, KES, CSE, or RACI: Please create a user account by visiting https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=verify to register

If you have any questions, comments, or difficulties please contact ECS Customer Service at customerservice@electrochem.org or 609.737.1902 (x104 or x108). ECS staff are available 08.30 - 16.45 (US Eastern Time) Monday-Friday.

See you at the Hilton Hawaiian Village in October!

www.electrochem.org

Batteries, Fuel Cells, and Energy Conversion · Biomedical Applications and Organic Electrochemistry · Corrosion, Passivation, and Anodic Films · Dielectric and Semiconductor Materials, Devices, and Processing · Electrochemical/Chemical Deposition and Etching · Electrochemical Synthesis and Engineering · Fullerenes, Nanotubes, and Carbon Nanostructures · Nanotechnology, Nanomaterials, and Nanoscience · Physical and Analytical Electrochemistry · Sensors and Displays: Principles, Materials, and Processing

Diamond 2008 Early Registration Deadline

noreply@blogger.com (Rodrigo Picos) — Wed, 23 Jul 2008 11:52:00 +0000

DIAMOND 2008
7-11 September 2008 • Sitges, Spain

EARLY REGISTRATION DEADLINE: 25 JULY 2008

www.diamond-conference.elsevier.com

Register now for Diamond 2008

Join international delegates for a complete review of the latest scientific and technological aspects of vapour grown diamond, natural and synthetic diamond, and related materials such as carbon nanotubes, diamond-like carbon and wide gap nitrides at Diamond 2008 - the 19th European Conference on Diamond, Diamond-Like Materials, Carbon Nanotubes and Nitrides

Coverage includes advances in growth techniques in plasma deposition, heteroepitaxy, doping, defects, hydrogen, biological applications, characterization and the development of new applications. An optional tutorial session on 'Diamond growth' and 'Bio functionalisation of diamond surfaces' will be held on the afternoon of 7 September 2008.

Full details of the comprehensive oral and poster programmes are available at www.diamond-conference.elsevier.com

Register now to save €75
Reduced delegate rates apply until 25 July 2008 only.
Register now at: www.diamond-conference.elsevier.com

Accommodation
Accommodation has been reserved at the Melia Sitges Hotel at specially negotiated rates. For details and to book visit the accommodation pages of the Diamond 2008 website.

INVITED SPEAKERS

The following experts will present at the conference:

Ali BenMoussa, Royal Observatory of Belgium, Belgium
- Recent developments on wide bandgap based UV sensors

Juergen Biener, Lawrence Livermore National Laboratory, USA
- Diamond for fusion applications

James Butler, Naval Research Labs, USA
- CVD diamond growth mechanisms - revisited

John Foord, Oxford University, UK
- Electrochemistry of diamond surfaces

Masataka Hasegawa, AIST, Japan
- Low temperature growth of nano-diamond

Robert Hauge, Rice University, USA
- Growth of nanotube mats

Russell Hemley, Carnegie Institute, USA
- High growth rate diamond

Dean Ho, North Western University, USA
- Drug delivery by nanodiamond

Robert Jones, University of Exeter, UK
- Dislocations, vacancy aggregates and brown colour of diamond

Hiro Kataura, AIST, Japan
- Separation of nanotubes

H. Kodama , Kanagawa Academy of Science and Technology, Japan
- High speed synthesis of amorphous carbon films on polymer substrates

Yasuo Koide, National Institute for Materials Science (NIMS), Japan
- Photo detectors

Anke Krueger, University of Kiel, Germany
- Functionalisation of nanodiamond surfaces

Christoph Nebel, Fraunhofer Institut für Angewandt Festkörperphysik (IAF), Germany
- Bio-sensors from diamond

Eiji Osawa, Shinshu University, Japan
- Recent progress in nanodiamond

Atsuhito Sawabe, Aoyama Gakuin University, Japan
- Progress in hetero-epitaxial growth of diamond

Thomas Seyller, University of Erlangen, Germany
- Production and electronic structure of graphene

François Silva, University Paris 13, France
- High quality, large surface area, homoepitaxial MPECVD diamond growth

Tetsuya Suzuki, Keio University, Japan
- High speed synthesis of amorphous carbon films on polymer substrates

Akihiko Ueda, Sumitomo Electric Industries, LTD
- Field emission devices

Wenjun Zhang, City University of Hong Kong, China
- Growth, nano-structuring and properties of cBN films

Diamond 2008 is organised by Elsevier in association with Diamond & Related Materials.

For further information and to request a copy of the final programme brochure visit: www.diamond-conference.elsevier.com or contact em.white@elsevier.com

230+ ways to use a PIC32 MCU

noreply@blogger.com (Rodrigo Picos) — Wed, 16 Jul 2008 06:32:00 +0000

July 15, 2008

FREE MAGAZINE SUBSCRIPTION (PRINT OR DIGITAL)

LATEST NEWS

290+ ways to use a PIC32 microncontroller
Microchip's Design Challenge Spurs Some Wild Ideas Read more >>

Looking for a jumpstart into Zigbee?
Here is a treasure trove of resources Read more >>

8-Bit I/O Devices Still Alive...
...But Severely Crippled Read more >>

Are Interrupts A Thorn in Your Side?
Here are a few ways to ease the pain Read more >>

Inches to Millimeters
A quicker way to convert measurements Read more >>

Dev Kits for Kids
Cool projects for what could be a long hot summer Read more >>

Altera Snags Tech Award in FPGA Tool Category
Nios II Evaluation Kit gets thumbs up from editors & readers Read more >>

Digi-Key On-line Product Training Modules^® at digikey.com
Digi-Key continues its long-standing commitment to servicing customer needs from prototype to production with its web-based Product Training Modules^® hosted on digikey.com. This engineering tool provides information about the latest products and technologies, product datasheets, and inventory.

PRODUCTS IN THE NEWS

Harness good vibrations with KCF Technologies wireless sensor kit

Get fingerprint authentication with Fujitsu biometric sensing kit

Transition from flash to lower-cost EPROM with Silicon Labs dev kit

Freescale's MCU dev kit includes motion sensing

Cymbet thin-film battery evaluation kit allows investigation of solid state technology

Natl Semi's LM5118 eval board allows investigation of wide input voltage range buck-boost power converter

VIDEOS

Microchip PIC32 Starter Kit
DEV-monkey Senior Reviews Editor Jon Titus' provides a 2-minute tutorial review of all the kit contents included in this powerful starter kit for design engineers wanting to investigate a 32-bit MCU within the Microchip PIC32 family. Read more >>

Freescale Flexus AC MCU family
Bridges the gap between 8 & 32-bit development by offering pin, peripheral and tool compatibility Read more >>

Luminary Micro
Shock N Awe: Four microphones attached to the table's corners, along with multi-lateration enablers Read more >>

Digi-Key, the one-stop-shop for all electronic parts needs
Digi-Key is a leading distributor of electronic components with more than 300,000 parts in stock from more than 380 manufacturers. Digi-Key's commitment to service includes same day shipping for 99.9% of orders, quality customer service, and top-notch technical support.

DEVELOPMENT RESOURCE SHOWCASE

Cypress Semiconductor's PSoC Express Eval Kit
The CY3209-ExpressEVK dev kit includes: software/ hardware and examples to help designers learn aspects of PSoC.

Microchip's PICkit^TM 2 Starter Kit
An easy-to-use starter kit enabling users to start writing code and programming with PIC MCUs.

Freescale Semiconductor's M5474LITE Dev Kit
M5474LITE Linux dev kit provides everything required to develop an embedded Linux design with the MCF547x processor family.

Synapse's Pro Network Eval Kit—EK2500
The all-in-one solution for developing mesh wireless control, monitoring network application and featuring instant-on network.

Texas Instruments' eZ430-RF2500 Dev Tool
A complete USB-based MSP430 wireless dev tool to evaluate the MSP430F2274 microcontroller and CC2500 2.4-GHz wireless transceiver.

CSR PLC's BlueCore5 Multimedia Audio Dev Kit
Based on CSR's BlueCore5-Multimedia, contains everything required for rapid eval/dev of Bluetooth stereo/mono audio applications.

Cypress Semiconductor's EZ-Color Eval Kit
Kit is a preprogrammed HB LED color mix board with seven pre-set colors using the CY8CLED16 EZ-Color HB LED Controller.

Atmel's ATAVRMC100 Motor Control Eval Kit
Dedicated to brushless DC motor control for Hall effect sensor control and sensorless control using Back ElectroMotive Force.

Honeywell's HMR3300 Digital Compass Dev Kit
Dev kit includes: an RS-232 motherboard with a D9 serial port connector, port cable, AC adapter power supply, and demo software.

Future Design's LCD Demo Kit
Kit is a reference design for a low cost microcontroller and LCD solution with demo board and example code for several sample applications.

Got recommendations about what kits DEV-monkey should review, kit comments, or want to reply to the DEV-monkey Blog?

Connect with DEV-monkey's Senior Reviews Editor, Jon Titus!

DEV-monkey POLL

- When designing a battery powered device, how important is it to you to design for power efficiency over device performance?
- In your current design, the most important criterion is?
- How do you generally design the "next generation" of a device?
- Which wireless technology interests you most for an MCU-based design?

Respond to the latest question and check out past DEV-monkey polls.

DEV-monkey Video

Check out the latest exclusive DEV-monkey and contributed video clips and submit your videos demonstrating the gadget or cool functionality you've achieved using a dev kit.

Most Viewed Kits
Rabbit Semiconductor's Bluetooth Application Kit

Atmel's Development Kit for AVR(r)/AVR(r)32 Microcontrollers

FINE PRINT

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Exclusive Webcast from Synopsys and EDN

noreply@blogger.com (Rodrigo Picos) — Tue, 08 Jul 2008 13:40:00 +0000

Please register today for these exclusive Webcasts

Get the Most Out Of Your HSPICE on Single & Multi-Core Computers
Accelerate Circuit Simulation with 2008 HSPICE!

Tuesday, July 15, 2008
11:00 am PT/2:00 pm ET
60 minutes (including Q&A)
Sponsored by Synopsys, hosted by EDN

CLICK HERE TO REGISTER TODAY

Over the past few years, Synopsys has sped up HSPICE, achieving industry leading performance while maintaining HSPICE’s “signoff quality” simulation accuracy.

Ask The HSPICE R&D Team!
Join the Q&A session with our scientists, principle engineers, and senior technical staff members of the HSPICE R&D team!

Dr. Kishore Singhal, Synopsys Scientist
Dr. Scott Wedge, Sr. Staff Engineer
Ted Mido, HSPICE R&D Group Synopsys
Harald Von Sosen – Principle Engineer

To learn more about how these new technologies accelerate your SPICE simulations, please attend this free informative webcast!

Who should attend:

Design engineers who run analog IC, standard cell, or package/board level simulations.
CAD managers interested in learning about the performance improvements in HSPICE

What you will learn:

Overview of the performance improvements available in the March and June 2008 releases of HSPICE
- Single and Multi-Core performance improvements
- Using compiled 40/45nm transistors models to reduce memory usage & simulation times
- Accelerating large high accuracy post-layout analog IC simulations
- Efficiently simulating long multi-gigabit transmission lines & 500 port package models
- Accelerating CCS cell characterization with Liberty NCX and HSPICE

Moderator
Cheryl Ajluni, Industry Expert

Cheryl has over 12 years experience covering the high-tech industry for such publications as Elec¬tronic Design and Embedded Systems Development and served as Editor in Chief of Wireless Systems Design. Prior to her work in the editorial field Cheryl worked as a Solar Array Engineer for Space Systems/Loral. Cheryl holds a Bachelor of Science degree in physics and mathematics from the University of California, Davis

Presenter

Christopher Labrecque, HSPICE Marketing Manager, Synopsys

Christopher joined the AMS marketing team upon the acquisition of Analog Design Automation Inc. (ADA) by Synopsys in February of 2004. Chris co-founded ADA and worked for six years in executive and management positions within marketing and R&D, developing circuit analysis and optimization products. Chris continues to work closely with customers, sales, and R&D to plan and develop the requirements and business cases for AMS circuit design and simulation tools. Chris holds Bachelor degrees in Engineering Physics and in Computer Science, both from the University of Saskatchewan. Prior to Synopsys and ADA, Chris was employed at Nortel Networks in Ottawa, Canada.

CLICK HERE TO REGISTER TODAY

Technical Web Seminar: Low Current Measurements from nA to fA

noreply@blogger.com (Rodrigo Picos) — Thu, 05 Jun 2008 10:15:00 +0000

LIVE WEB SEMINAR

FREE TECHNICAL ONLINE SEMINAR:

How to get the most from your Low Current Measurement Instruments

There's no charge for registration, but space is limited, so sign up today!

Seminar Contents

This seminar is designed to cover the the basics of low current (from nA to fA) electrical measurements, including how to select the right current measurement instrument, practical ways to reduce current noise in measurement setups, and how to quantify subtle sources of noise. These measurement best practices are important for applications in semiconductor material/device characterization, nanoscience test and measurement, optoelectronic device characterization, and many more. Application examples where such sensitive measurements are required will be discussed, together with a discussion of recent innovative test equipment solutions.

After attending this seminar, you will understand:

Measurement techniques required for measuring very small currents
Sources of measurement error that will affect such low current measurements
Measurement solutions that can be used in low current measurement applications.

This informative 45-minute seminar is recommended for students, as well as for professional researchers, engineers, and scientists in areas such as materials science, chemistry, nanoscience, and semiconductor device development who wish to get a better understanding of low current electrical measurements.

It is accompagnied by an interactive Q&A (during live broadcast only) where you can ask the presenter for additional insight on this important topic.

Register below!

About the Presenter:
Jonathan Tucker is the Lead Marketing Engineer of Nanotechnology, Research and Education, and the Sensitive Measurements Product Line Manager at the Keithley Instrument´s headquarter in Cleveland, Ohio, USA. His current focus is business strategy and product development of electrical characterization and measurement tools for nanotechnology applications. He holds a Bachelors of Electrical Engineering degree from Cleveland State University and an MBA from Kent State University.

When is it?

Europe:

Thursday, June 12, 2008
15:00 Central European Summer Time
(UTC/GMT: 13:00)

How Do I Register?

The seminar will be broadcasted over the internet and require your registration prior to the event.

Register today to reserve your place!
There is NO CHARGE for you to participate in this important industry event.

To register for this webcast seminar click here.

You will receive confirmation and log-in information prior to the events.

Please forward this invitation to any colleagues
who might be interested in this free seminar!

Thank you for your time! We look forward to your attendance!

Your Keithley Instruments' Team

Organic Semiconductor Conference 2008 (OSC-08)

noreply@blogger.com (Rodrigo Picos) — Wed, 07 May 2008 13:57:00 +0000

29 September-1 October 2008
Frankfurt Messe,
Frankfurt, Germany

OSC-08 Second Call for Papers

cintelliq ltd, the world’s leading provider of information services and technology consulting to the organic semiconductor industry, has issued a second call for papers for the Organic Semiconductor Conference 2008 (OSC-08) which will take place in Frankfurt, Germany from 29 September – 1 October 2008.

OSC-08 is the sixth conference in the series and is the premier international gathering for the discussion, demonstration and evaluation of organic semiconductor technologies and organic electronics. As well as industry sessions featuring invited speakers, OSC-08 will also host a number of peer-reviewed sessions which will run in parallel to the industry sessions.

OSC-08 is now cordially inviting papers for the consideration of the 2008 peer review committee. The best papers will be accepted for oral or poster presentation at the conference. The new deadline for the submission of a 300-word abstract and a 35-word summary is Sunday 25 May 2008.

For full details, visit the conference website: www.osc-europe.com/papers.shtml

Papers are invited on subjects relating to organic semiconductor technologies including, but not restricted to, the areas listed below.

transistors (OTFT and OFET)
photovoltaic
memory devices
displays
signage
OLEDs
RFID
smart packaging

sensors
backplanes
patterning
materials
encapsulation
roll-to-roll manufacturing
inline manufacturing

Also this year for the first time we are accepting papers on:

carbon nanotubes
graphenes
fullerenes

Conference structure

The main conference and exhibition will be held on 30 September and 1 October. The conference will offer an exciting mix of invited speakers and peer-reviewed papers. This year for the first time there will also be an Exhibitor Forum in which exhibiting companies are free to make product-related presentations.

In common with previous years we will be offering pre-conference workshops on 29 September. This year there will be eight new workshops to choose from.

We are expecting nearly 100 speakers and have space to accommodate over 50 exhibitors in our spacious new venue at the Frankfurt Messe Congress Centre. Last year's event attracted over 400 attendees from 245 organisations and this year's conference is predicted to be significantly larger.

Confirmed invited speakers from industry include

Acreo, Add-Vision, AIST, Aixtron, Bardsley Consulting, BASF, Cambrios, Cambridge Display Technology, cintelliq, DisplayBank, DuPont Research, DuPont Teijin Film, Evonik Degussa, Fluxim, Fraunhofer ISE, Fraunhofer IZM, FUJIFILM Dimatix, GIST, Holst Centre/TNO, IMEC, Imperial College London, ITRI, Kodak, Konarka, Liquavista, MicroEmissive Display, Merck, Mitsubishi Chemical, Nanoident, Nanomarkets, Nantero, Nokia, Novaled, OLED-T, Olla Project, Plastic Logic, Polymer Vision, printed systems, RO Consulting, Siemens, Solarmer Energy, Sumation, Thin Film Electronics, Thorn Lighting, UK Display and Lighting, Unidym, Universal Display Corp, University of Tokyo, Vitex Systems

We would very much appreciate your participation in this major industry event and hope that you will be able to join us in Frankfurt.

Best regards

Craig Cruickshank,
Founder and CEO, cintelliq

Next steps

How to submit your paper to the OSC-08 Peer Review Committee

Find out more about OSC-08

Contact:
Craig Cruickshank
cintelliq ltd
St John's Innovation Centre,
Cambridge CB4 0WS, UK
tel: +44 1223 421525
email: craig.cruickshank@cintelliq.com
web: www.osc-europe.com

Conference hosted by:

Sponsors:

Exclusive Webcast from Analog Devices and EDN

noreply@blogger.com (Rodrigo Picos) — Mon, 05 May 2008 13:37:00 +0000

Please register today for this exclusive Webcast

A Stress-free Method for Selecting High-speed Amplifiers

Date: Wednesday, May 7, 2008
Time: 9:00 am PT/Noon ET
Duration: 60 minutes
Sponsored by Analog Devices, hosted by EDN

CLICK HERE TO REGISTER TODAY

How hard can it be to select the correct op amp for your design? With hundreds of variations of op amps available, each with a unique and sometimes vague set of specifications, the task can be daunting.

In this online seminar, our amplifier expert will outline how to derive an application’s essential design considerations, and present a proven process and tools for selecting and verifying the optimum op amp to meet system requirements.

Presenter

John Ardizzoni, Applications Engineer, High Speed Amplifier Group, Analog Devices, Inc.

John started at Analog Devices in 2002, as an Application Engineer in the High Speed Amplifier group. Prior to joining Analog Devices John worked for IBM, in RFIC applications and M/A-COM as a design engineer. John has over 28 years experience in the electronics industry, and has authored numerous articles and design ideas.

CLICK HERE TO REGISTER TODAY

213th ECS Meeting - Tomorrow is the Last Day to Register

noreply@blogger.com (Rodrigo Picos) — Thu, 17 Apr 2008 14:21:00 +0000

Tomorrow is the Last Day to Register for the
213th ECS Meeting
Phoenix, Arizona | May 18-22, 2008
Hyatt Regency Phoenix Hotel

For more information and to register, please visit our website: http://www.electrochem.org/.

Please note these important deadlines for the Phoenix Meeting:

1. Meeting and Short Course Registration Deadline: April 18, 2008 to qualify for the advance registration discount.

Register online: https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs.

Or fax or mail a hardcopy of your meeting registration forms with payment to ECS, 65 South Main St., Pennington, NJ 08534, USA, Fax: 1.609.737.2743, no later than April 18, 2008. Download the meeting registration brochure at: http://www.electrochem.org/meetings/biannual/213/phoenix_reg_bro.pdf.

Short Courses:
We are offering FOUR Short Courses in Phoenix on Sunday, May 18, from 0900h to 1630h. Current course list includes:

• Advanced Impedance Spectroscopy
• Electrical Characterization and Characteristics of MOS Devices with Ultrathin High-k Gate Dielectrics
• Electrochemical Biosensors Based on Nanomaterials
• MEMS Reliability and Packaging

2. Hotel Reservation Deadline: April 18, 2008, or until sold out, whichever comes first.

For additional information and to reserve your room at the Headquarters Hotel:
http://phoenix.hyatt.com/groupbooking/phxrptels2008

Meeting Scheduler
The Personal Meeting Scheduler, sponsored by the ECS Battery Division, will allow you to browse through meeting programs, view abstracts, committee and other events and create printable schedules for upcoming ECS meetings. It is convenient and easy to use. For additional information and to use this feature, we invite you to create your user account and schedule for the Phoenix Meeting! Please follow this link to the Meeting Scheduler page: http://www.electrochem.org/meetings/scheduler/

First ECS Student Mixer
Arizona Diamondbacks/Detroit Tigers baseball game and reception
Sunday, May 18th at 11:30 AM, Tickets are free to the first 200 student registrants who RSVP to amir.zaman@electrochem.org.

www.electrochem.org

Batteries, Fuel Cells, and Energy Conversion • Biomedical Applications and Organic Electrochemistry • Corrosion, Passivation, and Anodic Films • Dielectric and Semiconductor Materials, Devices, and Processing • Electrochemical/Chemical Deposition and Etching • Electrochemical Synthesis and Engineering • Fullerenes, Nanotubes, and Carbon Nanostructures • Nanotechnology, Nanomaterials, and Nanoscience • Physical and Analytical Electrochemistry • Sensors and Displays: Principles, Materials, and Processing

CDNLive! EMEA 2008 Invitation

noreply@blogger.com (Rodrigo Picos) — Tue, 15 Apr 2008 12:41:00 +0000

CDNLive! EMEA 2008 Invitation





	Every design tells a story. Come and share yours. CDNLive! EMEA - 28-30 April 2008 Hilton Munich Park Hotel Munich, Germany Last chance to register! In less than two weeks, CDNLive! EMEA 2008 opens its doors to Cadence^® power users and industry experts to provide a compelling program of more than 60 user-driven presentations, technical papers, techtorials, and demos. Don't miss this excellent opportunity to educate yourself on the latest trends in the electronics design industry and network with other power users. As a special highlight this year, we are pleased to present an interview with Prof. Dr.-Ing. Mario Theissen, Director BMW Motorsport, live on stage. If you haven't already registered, click here to find out more and register now! Reasons why you shouldn't miss CDNLive! EMEA 2008 Participate in numerous user-driven presentations on Cadence solutions, among which you'll find sessions on low-power design, first experiences with OVM, and how to speed up bigD/bigA designs using the latest Virtuoso® custom IC design technologies In the Technical Tracks, learn best practices for boosting your design productivity and quality. Choose your fields of interest from our various tracks and share experiences with your peers At the Cadence Technology Demo Presentations, see demonstrations of the latest Cadence products, flows, and methodologies. Talk directly with the Cadence people who develop the solutions you rely on to create innovative designs During the Industry Keynote session, watch a live interview with Prof. Dr.-Ing. Mario Theissen about some of the development challenges in Formula One At the Designer Expo, meet with Cadence partners across the electronics industry During the evening event, network with your peers in a relaxing atmosphere and engage in some exciting PC racing games. To get a feel for the conference, visit our website and watch the podcast from last year's event. Register now for CDNLive! EMEA 2008 and secure your participation. We look forward to meeting you in Munich! The CDNLive! EMEA 2008 Team Sponsors and Exhibitors at CDNLive! EMEA 2008 are:	Media Sponsors Global Sponsors

Real-Time Analysis Techniques and Measurements for Radio Communications

noreply@blogger.com (Rodrigo Picos) — Thu, 10 Apr 2008 07:55:00 +0000

Please register today for this exclusive Webcast

Benefits of Real-Time Analysis Techniques and Measurements
for Radio Communications

Date: Tuesday, April 15, 2008
Time: 9:00 am PT/Noon pm ET
Duration: 60 minutes (including Q&A)
Sponsored by Tektronix, in partnership with Test & Measurement World and EDN

CLICK HERE TO REGISTER TODAY

In the days of analog communications, everything was real-time. Broadcast communications and analog radios provided real-time sensory analysis on the quality of the signal being received. Real-time analysis has undergone rapid transformation in the advent of modern digital radio development. As the processing power of the computer world blends into the world of RF, the resulting Digital RF technologies require new real-time tools for development and analysis.

Whether analyzing the propagation of MIMO radio signals, amplifying the latest WiMax or LTE amplifiers, or debugging Software Defined Radios, real-time analysis techniques and measurements enable the rapid development of Radio Communications systems.

Moderator

Cheryl Ajluni, Industry Expert

Cheryl has over 12 years experience covering high-tech for Electronic Design and Embedded Systems Development and served as Editor in Chief of Wireless Systems Design.

Speaker
Marcus daSilva, Manager of Strategy & Advanced Technology, Tektronix

Marcus daSilva has over 27 years of experience in the test and measurement and telecommunications fields. Before Tektronix, Marcus was Vice President of Engineering and Chief Technical Officer at Vivato where he assembled and managed the team that developed the industry’s first Wi-Fi Switch, a device that dramatically extends the range of wireless LANs with the unique combination of phased array antennas, switching and WLAN technology. Previously, Marcus held various engineering, management and marketing positions at Hewlett-Packard and Agilent over a 23-year period. He also had several engineering, marketing and manufacturing assignments where he made notable contributions in frequency synthesis, test methodologies, device modeling, microwave component design and metrology. In addition to his management and engineering work, Marcus was a key technical contributor work with the Federal Communications Commission (FCC) that led to changes in the rules for unlicensed band use. He has also contributed the IEEE 802 Wireless LAN standards and the TIA Cellular standards committees. Marcus was adjunct Professor of Electrical Engineering at Gonzaga University. He has received ten patents and holds B.S. and M.S. degrees in Electrical Engineering from the University of Missouri-Rolla.

CLICK HERE TO REGISTER TODAY

Last Call for Papers - ICMIT2008

noreply@blogger.com (Rodrigo Picos) — Tue, 01 Apr 2008 07:28:00 +0000

Last Call for Papers - ICMIT2008

Our Technology Management Council Chapter in Singapore,
in cooperation with the Council and the IEEE Singapore
Section will be hosting an engineering management conference
September 21 to 24 2008 in Bangkok, Thailand.

Please see the information below and at www.ICMIT2008.org to
participate as an author or attendee for this conference.

Thank you.

- Prof. Charles Rubenstein, PhD, CEng <c.rubenstein@ieee.org>
Vice President Conferences
IEEE Technology Management Council

----- CALL FOR PAPERS (http://www.ICMIT2008.org) -----

The 4th IEEE International Conference on
Management of Innovation & Technology (ICMIT2008)
September 21 to 24 2008 - Bangkok, Thailand
www.icmit2008.org

ABOUT ICMIT
ICMIT2008 is the 4th International Conference on Management of
Innovation and Technology, first initiated by the IEEE Engineering
Management Society Singapore Chapter in 2000. ICMIT2008 intends to bring
together scholars, industrialists, and entrepreneurs interested in
improving their research and development, and business applications in
innovation and technology management across a global network of diverse
platforms. This conference is co-sponsored by IEEE Singapore Section and
IEEE Technology Management Council.

ICMIT 2008 invites papers on but not limited to the following topics:
Technology Management
Innovation Policy and Management
Process Innovation
Managing IT and E-Commerce
Knowledge Management
Project Management
Supply Chain Management
Sustainable Development
Global Production Network
Technology Intelligence and Planning
New Product Development
Entrepreneurship
Human Resource Management
Intellectual Property Right and Patent
R&D Management
Risk Management
Six Sigma and Quality Management
Service Science and Innovation

Authors are requested to submit full papers to the
ICMIT 2008 conference via the conference website.
The full paper should be no longer than 6 pages,
including title of the paper, keywords, name and
affiliation of the authors. All submissions will
be peer-reviewed for technical merit and content.
Accepted papers will be published in the conference
proceedings which will appear in IEEEXplore database
and indexed by Engineering Index (EI).

For more information, please visit http://www.icmit2008.org

(Tentative dates)
Deadline for submission of papers: 1 APRIL, 2008
Notifications of acceptance: 1 JUNE, 2008
Deadline for submission of final manuscript: 1 JULY, 2008

About Bangkok
Affectionately known as "The Land of Smiles", the
Kingdom of Thailand is one of the most fascinating
countries in Asia. This reflects on charm and friendly
attitude of Thai people. Over the last few decades,
Thailand's capital city, Bangkok, has changed into a
modern, exciting and sophisticated city. It offers to
visitors not only the cosmopolitan amenities they would
expect from other big cities, but also a unique
treasure trove of cultural attractions.

Bangkok offers visitors the opportunity to experience
fascinating glimpse of Thailand's gentle culture amidst
a great and dynamic metropolis. For visitors, Bangkok
has a feast of attractions to offer. The city is dotted
with glittering Buddhist temples of great beauty and
fascination, magnificent palaces, classical dance
extravaganzas, numerous shopping centres and traditional
ways of life, especially along the timeless river, the
Chao Phraya River, winding through the city.

SPONSORS
IEEE Engineering Management Society - Singapore Chapter
IEEE Technology Management Council
IEEE Singapore Section

CO-ORGANISER and OTHER SUPPORTING ORGANIZATIONS
Thammasat University
National University of Singapore

CONFERENCE MANAGER
Meeting Matters International
25 Hindoo Rd
Singapore 209116
Tel: (65) 6341 7229
Fax: (65) 6341 7269

Enquiries & Assistance
Email: info@icmit2008.org

http://www.icmit2008.org

CDVE2008 full paper deadline April 1 ...Mallorca, Sept. 2008

noreply@blogger.com (Rodrigo Picos) — Tue, 18 Mar 2008 16:21:00 +0000

CDVE2008 call for papers, call for reviewers, call for sponsors, call
for exhibitors: http://www.cdve.org.

The 5th International Conference on Cooperative Design, Visualization
and Engineering (CDVE2008)
September 21-25, 2008, Mallorca, Spain

The conference proceedings will be published again by Springer Verlag
in its LNCS (Lecture Notes in Computer
Science). The accepted papers will be indexed by ISI Proceedings list
which is part of their Web of Knowledge,
EI, ACM Portal, DBLP, ZBlMath/CompuServe, IO-Port, Scopus, INSPEC, etc.

You are welcome to send this call for papers to the mailing lists you
belong to and any people working in the area that may be interested in
publishing their results in a high level publication. You can add a
link in your own page or your organization' s web page to the
conference website.

Deadlines and important dates:

Full Paper submission April 1, 2008
Notification of acceptance May 15, 2008
Final camera ready paper due June 15, 2008
Registration for accepted paper authors: June 30, 2008
Early registration July 31, 2008
Sept 21-25 2008: CDVE2008 conference in Mallorca, Spain

We expect your response to all these calls. You can contact
cdve2008@uib.es for any information you need or to send your suggestions.

Will be our pleasure to see you all in CDVE2008 in Mallorca, Spain!

Segundo llamado - JAR08

noreply@blogger.com (Rodrigo Picos) — Tue, 18 Mar 2008 14:16:00 +0000

Hola compañeros,
Por si interesa.
Cordiales saludos.
Gerardo

*Segundo llamado a Presentación de Trabajos - JAR08*

/Estimados colegas, estudiantes y amigos: /

Tenemos el agrado de dirigirnos a Uds. para invitarlos a participar de
las*/ /**/V Jornadas Argentinas de Robótica (JAR08)/**/,/* que se
realizará entre los días 12 y 14 de noviembre de 2008 en la Universidad
Nacional del Sur, Bahía Blanca, Argentina.

El propósito de las JAR08 es promover la investigación y el desarrollo
en robótica en la Argentina como así también la integración de la
comunidad científica del país y la región interesada en dicha
especialidad. Desde el año 2000 se han organizado cuatro jornadas que
tuvieron lugar en dos ciudades importantes como son San Juan y Córdoba.
En la última oportunidad, se presentaron 30 trabajos y asistieron más de
120 colegas provenientes en su mayoría de Argentina, Brasil y Chile.

Las jornadas se desarrollan principalmente a través de presentaciones
orales de los trabajos aceptados. En esta oportunidad se prevé la
realización de una sesión especial de Inteligencia Computacional en
Robótica y la organización de sesiones plenarias a cargo de destacados
profesionales en las áreas de interés de la reunión.

*Temas de Interés (no excluyentes):*

- Actuadores

- Cinemática y dinámica

- Control de movimiento y fuerza

- Humanoides

- Inteligencia artificial

- Interacción hombre-robot

- Interfaces

- Localización y construcción de mapas

- Manipuladores robóticos y manipulación

- Modelado, identificación y control

- Planificación de movimientos

- Robótica móvil y de campo

- Sensores: modelado, fusión de datos, percepción

- Simulación

- Sistemas de eventos discretos

- Sistemas de manufactura

- Sistemas de tiempo real

- Sistemas multirobot

- Teleoperación

- Desarrollos y aplicaciones relacionadas

*_ _*

*Fechas importantes:*

Recepción de Trabajos: *15/03/2008* al *15/04/2008.*

Notificación de aceptación: *01/08/2008.*

Recepción de Trabajos Definitivos: *01/09/2008.*

*_ _*

* *

*Envío de Trabajos*

En esta edición de las Jornadas se contemplarán dos categorías de trabajos:

_Trabajos regulares_: describen resultados originales que no han sido
publicados aún y que se enmarcan dentro de las temáticas propuestas por
las Jornadas.

Deberán presentarse en un archivo PDF y no deberán exceder las 6
páginas. El envío será electrónico a través de la página

http://www.easychair.org/conferences/?conf=jar08 provista por el sistema
EasyChair <http://www.easychair.org/conferences/?conf=ab2008comm>.

Los mismos serán sujetos a proceso de revisión y la versión final de los
trabajos aceptados será publicada en el CD de las Jornadas.

_Comunicaciones_: describen iniciativas, proyectos, ideas, aplicaciones,
investigaciones, etc. que por encontrarse en etapas de desarrollo y/o
evaluación no resultan suficientes para formalizarse en un "trabajo
regular" pero que su divulgación y discusión puede despertar el interés
de los asistentes.

Deberá presentarse un resumen de no más de 2 páginas en formato PDF. Los
mismos se enviarán directamente a la dirección de email de las JAR'08
(jar08@uns.edu.ar <mailto:jar08@uns.edu.ar>) para su consideración. Las
comunicaciones se expondrán en forma oral bajo las mismas condiciones
que los trabajos regulares. El resumen será publicado en el CD de las
Jornadas en la modalidad "comunicación sin referato".

* *

Tanto los trabajos regulares como los resúmenes deberán prepararse
siguiendo las instrucciones que se detallan en la página web de las
jornadas http://lcr.uns.edu.ar/jar08. Dicha información pueden también
solicitarse por e-mail o correo postal a la comisión organizadora.

*Idioma*:

El idioma oficial de las Jornadas será el *español*, aunque también se
admitirán trabajos en *inglés*.

*/ /*

Los saluda muy cordialmente,

Comité Organizador

V Jornadas Argentinas de Robótica

Departamento de Ingeniería Eléctrica y de Computadoras

Universidad Nacional del Sur

Avda Alem 1253, B8000CPB Bahía Blanca, Argentina

Email: jar08@uns.edu.ar <mailto:jar08@uns.edu.ar>

Web: http://lcr.uns.edu.ar/jar08

IEEE R8: Professional Training Course - Advanced Industrial Control (IAS & CSS of Spain)

noreply@blogger.com (Rodrigo Picos) — Tue, 18 Mar 2008 09:24:00 +0000

Join us for our first event and featured professional training event
of 2008! As with our SAICA 2007 seminar, we will be hosting IEEE members from
across Region 8, so in addition to learning about advanced industrial control
methodologies, you can expect to network with a truly international group of
course participants from across the EMEA area. The course will be taught in
English and we are proud to also host key note speaker Senior Member Dr. Pilar
Molina Gaudo, professor at the University of Zaragoza. Dr. Molina Gaudo will
be the featured speaker at the dinner to be held on the evening of 26th.

Key Information: 26-27 March, 2008/Madrid/Discounted IEEE Pricing
Included: 2-Day Intensive Training Course, Software Evaluation Pack,
Breakfasts, Lunches and Featured Speaker Dinner on 26 March.
Audience: Engineering and Technical Professionals Involved in Industrial
Control and Optimization, Professors and Graduate Students of Industrial
Engineering.

Key Links

Learn more about the event on the R8 Web Page:
http://www.ewh.ieee.org/reg/8/cms/

Check Out the Chapter Web Site and Sign-Up for the Course:

http://www.ieee-ias-css.es

Learn More About Our Last International Event:
1) The Official SAICA 2007 Debrief
http://www.ieee-ias-css.es/modules.php?name=Content&pa=showpage&pid=35

2) Coverage in The Institute
http://www.theinstitute.ieee.org/portal/site/tionline/menuitem.130a3558587d56e8fb2275875bac26c8/index.jsp?&pName=institute_level1_article&TheCat=2201&article=tionline/legacy/inst2008/feb08/featureSAICAconf.xml&

Dr. Molina Gaudo's profile can be viewed in the "Meet Our Members" profile box
http://www.ieee.org/web/membership/home/index.html

Exclusive Webcast from Ansoft and EDN

noreply@blogger.com (Rodrigo Picos) — Thu, 13 Mar 2008 13:09:00 +0000

You are receiving this email as a subscriber to an EDN enewsletter. For customer support or to stop receiving

future promotional offers from EDN, please scroll to the bottom for instructions.

Please register today for this exclusive Webcast

New Technology for Rapid and Accurate Simulation of Multi-Gigabit Serial Channels

Thursday, March 20, 2008
11:00 am PT/2:00 pm ET
Duration: 60 minutes (including Q&A)
Sponsored by Ansoft Corp., hosted by EDN

CLICK HERE TO REGISTER TODAY

Modern electronic products use multi-Gigabit serial links to move large quantities of digital data across today’s telecommunication, high-definition video, gaming, and data storage systems. Engineers designing links such as 10-Gigabit Ethernet, 8.5 Gb/s Fibre Channel, InfiniBand, and PCI Express 3.0 demand accurate channel simulation and modeling to maintain stringent signal quality, jitter and bit error ratio (BER) performance.

When verifying the low BER’s required by the multi-Gigabit protocols, traditional transient simulation techniques are at odds with the design cycle compression being driven by today’s tight time-to-market windows. There simply isn’t enough time to push the number of bits needed with robust sampling to derive meaningful BER results. Statistical methods are emerging that allow engineers to rapidly predict channel level performance with eye diagram plots and BER curves.

This one-hour Web seminar introduces two new simulation technologies, a fast transient and a statistical tool, that are now included in Ansoft’s circuit simulation engine, Nexxim. The fast transient tool uses long, user defined bit patterns to produce an eye diagram. This analysis allows engineers to create controlled stress tests and to identify specific bit sequences that cause bit errors. The statistical tool produces both eye diagram plots and BER curves for complete high-speed channels in minutes. Because these technologies link to full-wave electromagnetic field solvers and a high capacity circuit simulation engine, accuracy is not sacrificed for the improved simulation speed.

After a brief introduction to the tools and the presentation of comparative performance data, two channel examples will be demonstrated. The first channel will serve to highlight the general capabilities of the simulation technologies. The second will demonstrate the use of the tool in the pre-layout design of a serialized/de-serialized (SerDes) channel with equalization developed for IBM’s next generation BladeServer backplane.

Presenter
Eldon Staggs, Senior Applications Engineer, Ansoft Corporation

Eldon specializes in high-frequency and high-speed circuit and system design. He works with Ansoft’s top tier customers on their serial interconnect designs, RF microwave circuits, and wireless communication systems. He has over 15 years design experience and is an expert in system, RF, analog, and digital engineering for electronic warfare and electronic intelligence systems. He earned his BSEE from the University of New Mexico in Albuquerque, NM, and his MSEE from the University of California at San Diego.

CLICK HERE TO REGISTER TODAY

NOMS 2008: Register Today & Save

noreply@blogger.com (Rodrigo Picos) — Tue, 11 Mar 2008 09:36:00 +0000

NOMS 2008 - 7-11 April 2008 - Salvador - Bahia - Brazil

http://www.ieee-noms.org/2008

Registration: (Register by Monday, 17 March and save!)

http://www2.dcc.ufmg.br/eventos/noms2008/

Program Highlights:

Distinguished Keynote & Plenary Speakers

http://www2.dcc.ufmg.br/eventos/noms2008/

Program At A Glance:

http://www2.dcc.ufmg.br/eventos/noms2008/

* Short Papers / Posters

* Panels

* Software Tools

* Dissertation Digest

* Application Papers

* Tutorials

* Workshops

Accomodation:

NOMS 2008 will take place at the <http://www.pestana.com/hotels/en/hotels/southamerica/BahiaHotels/Bahia/Home/PestanaBahia.htm>

Bahia Hotel, located in a privileged position in a beach of the city of Salvador da Bahia, northeast of Brazil.

Hotel Pestana Bahia is accepting room reservation at special rates for NOMS attendees, and even better rates for students.

Please go to the accommodation page for more information:

http://www2.dcc.ufmg.br/eventos/noms2008/

Please check to see if you need a visa.

http://www2.dcc.ufmg.br/eventos/noms2008/

We look forward to seeing you in Brazil!

Last Call for Papers/Abstracts

noreply@blogger.com (Rodrigo Picos) — Tue, 11 Mar 2008 08:18:00 +0000

Announcement
-------------------------------------------------------
Last Call for Papers/Abstracts and Invited Sessions Proposals for CITSA 2008, (Orlando, Florida, USA. June 29th- July 2nd, 2008) http://www.infocybereng.org/citsa2008

Deadlines:
Papers/Abstracts Submissions and Invited Sessions Proposal: April 2nd, 2008
Authors Notification: May 3rd, 2008
Camera-ready, full papers: May 22nd, 2008
-------------------------------------------------------

All Submitted papers will be reviewed by a double-blind (at least three reviewers), non-blind, and participative peer review. These three kinds of review will support the selection process of those that will be accepted for their presentation at the conference, as well as those to be selected for their publication in JSCI Journal.

Authors of accepted papers who registered in the conference can have access to the evaluations and possible feedback provided by the reviewers who recommended the acceptance of their papers/abstracts, so they can accordingly improve the final version of their papers. Non-registered authors may not have access to the reviews of their respective submissions.

The registration fee of effective invited session organizers will be waived and they will receive at the registration desk, for free, 1) a package of 4 DVDs and one CD containing the 6-hour tutorial "Fundamentals and History of Cybernetics: Development of the Theory of Complex Adaptive Systems" and 2) a second 4-DVDs/1-CD package 6-hours tutorial titled "Cybernetic Management". The market price of each of these packages is US $ 295. Twelve more benefits for invited session organizers are listed at CITSA 2008 web page.

For submissions or Invited Sessions Proposals, please go to the web site: http://www.infocybereng.org/citsa2008/organizer.asp

Authors of the best 10%-20% of the papers presented at the conference will be invited to adapt their papers for their publication in the Journal of Systemics, Cybernetics and Informatics.

Each session to be included in the conference program will have corresponding electronic pre-conference and post-conference sessions for 15 days each. In the electronic pre-conference sessions authors will have access to the papers to be presented at their session and to an associated electronic forum, so they can be better prepared for their conference face-to-face session. Similarly, electronic post-conference sessions will complement and support a follow-up of the respective conference sessions, via an electronic forum and the possibility of evaluating papers presented at the associated session. These evaluations will also support the selection process for the papers to be published in JSCI journal.

Best regards,

CITSA 2008 Secretariat

If you wish to be removed from this mailing list, please send an email to citsa.remove@mail.infocybereng.org with REMOVE MLCITSA in the subject line. Address: Torre Profesional La California, Av. Francisco de Miranda, Caracas, Venezuela.

[isvlsi] ISVLSI in Montpellier, France, April 7-9 2008 - Call for participation

noreply@blogger.com (Rodrigo Picos) — Fri, 07 Mar 2008 07:53:00 +0000

Please accept our apologies if you receive multiple copies of this call

IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI

April 7-9, 2008

Montpellier, France

http://www.lirmm.fr/isvlsi2008/

******************************************************************

Final Programme available!!

http://www.lirmm.fr/isvlsi2008/programme.htm

******************************************************************

Registration

http://www.lirmm.fr/isvlsi2008/registration/registration.php

Early Registration Deadline: March 15th, 2008

******************************************************************

__________________________________________________________________________

This Symposium explores emerging trends, novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems, and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies.

Future design methodologies will also be one of the key topics at the workshop, as well as new CAD tools to support them. For almost two decades, the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI.

It brings together leading scientists and researchers from academia and industry, and has established a reputation in inviting well-known international scientists as invited speakers. The 2008 edition will continue to strive to achieve the high standards that participants have come to expect of this Symposium.

__________________________________________________________________________

General Chair

Lionel Torres

LIRMM, Montpellier, France

University of Montpellier/CNRS

General Co-Chair

Amar Mukherjee

University of Central Florida, USA

Program Chair

Ian OConnor

Ecole Centrale de Lyon

INL, Lyon, France

Program Co-Chair

Asim Smailagic

Carnegie Mellon University, USA

Publicity Chair (Europe)

Reiner Hartenstein

TU Kaiserslautern, Germany

Publicity Chair (USA)

Don Bouldin

University of Tennessee, USA

Local Chair

Pascal Benoit

LIRMM, Montpellier, France

University of Montpellier/CNRS

Diamond 2008: Call for Papers Deadline - 7 March 2008

noreply@blogger.com (Rodrigo Picos) — Thu, 06 Mar 2008 11:42:00 +0000

all for Papers: Diamond 2008

DIAMOND 2008
7-11 September 2008 • Sitges, Spain

CALL FOR PAPERS DEADLINE - FRIDAY 7 MARCH 2008

Submit abstracts now for Diamond 2008

Please remember that the deadline for submission of abstracts at the 19th European Conference on Diamond, Diamond-like Materials, Carbon Nanotubes and Nitrides is Friday 7 March 2008.

Contributions are invited for oral and poster presentation on the following topics:

Growth and processing technologies
Characterisation
Electronic and optoelectronic properties, applications and devices
Mechanical and thermal properties and applications
Electrochemistry and biological activity
Carbon nanotubes
Diamond-like carbon
III-Nitrides

Please submit abstracts online at www.diamond-conference.elsevier.com

INVITED SPEAKERS

The following experts have agreed to speak at the conference:

James Butler, Naval Research Labs, USA
- Growth mechanisms of diamond revisited

John Foord, Oxford University, UK
- Electrochemistry of diamond surfaces

Masataka Hasegawa, AIST, Japan
- Low temperature growth of nano-diamond

Russell Hemley, Carnegie Institute, USA
- High growth rate diamond

Dean Ho, North Western University, USA
- Drug delivery by nanodiamond

Anke Krueger, University of Kiel, Germany
- Functionalisation of nanodiamond surfaces

Christoph Nebel, AIST, Japan
- Bio-sensors from diamond

Eiji Osawa, Shinshu University, Japan
- Recent progress in nanodiamond

Atsuhito Sawabe, Aoyama Gakuin University, Japan
- Progress in hetero-epitaxial growth of diamond

Thomas Seyller, University of Erlangen, Germany
- Production and electronic structure of graphene

François Silva, University Paris 13, France
- High quality homoepitaxial diamond growth

Wenjun Zhang, City University of Hong Kong, China
- Growth, nano-structuring and properties of cBN films

Data Protection Notice:

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IEEE SENSORS 2008 in Italy - Submissions due 31 March

noreply@blogger.com (Rodrigo Picos) — Wed, 05 Mar 2008 07:55:00 +0000

CALL FOR PAPERS - IEEE SENSORS 2008
=================================================================

The IEEE SENSORS 2008 conference is scheduled to be held October 26 to October 29, 2008 in Lecce, Italy.

Abstracts are due 31 March 2008. The call-for-papers can be found at
www.ieee.org/sensors

The Abstract Submission website is open at
www.ieee-sensors2008.org

If you have a question that is not answered on the conference website, feel free to contact Katharine Cline, Conference Manager, at info@ieee-sensors2008.org or +1-619-232-9499.

=================================================================
IEEE SENSORS 2008 is sponsored by the IEEE Sensors Council.
For information, about other Sensors Council activities, especially
the IEEE Sensors Journal, please visit www.ieee.org/sensors
=================================================================

New Technical T&M Web Seminar: C-V Measurements and Materials Research

noreply@blogger.com (Rodrigo Picos) — Wed, 27 Feb 2008 13:01:00 +0000

LIVE WEB SEMINAR

FREE TECHNICAL ONLINE SEMINAR

Semiconductor
Capacitance-Voltage (C-V)
Testing Fundamentals

Seminar Content

This seminar is designed to introduce the topic of C-V measurements as they relate to semiconductor device and materials characterization. C-V testing is commonly used to determine semiconductor parameters such as doping profiles, density of interface states, threshold voltages, oxide charge, and carrier lifetime.

After attending this seminar, you will understand:

What is C-V testing?
What types of devices can C-V testing be used to characterize?
Who can use C-V?
C-V measurement challenges

About the Presenter:
Lee Stauffer is Senior Staff Technologist for Keithley Instruments' Semiconductor Measurements Group, based in Cleveland, Ohio. Prior to joining Keithley, his career included designing satellite communication systems, as well as equipment and product engineering in semiconductor fabs.

This seminar is recommended for engineers new to semiconductor materials and device testing, process and device engineers who would like to refresh their knowledge of this testing methodology, and characterization lab managers.

This informative 45-minute seminar is followed by an interactive Q&A (during live broadcast only) where you can ask the presenter for additional insight on this important topic.

When is it?

Europe:

Thursday, March 6, 2008
15:00 Central European Time
(UTC/GMT: 14:00)

How Do I Register?

Register today to reserve your place!
There is NO CHARGE for you to participate in this important industry event.

The seminar will be broadcasted over the internet and requires your registration prior to the event.

To register for this webcast seminar click here.

Please forward this invitation to any colleagues
who might be interested in this free seminar!

Thank you for your time! We look forward to your attendance!

Your Keithley Instruments' Team

ECS - 213th Meeting - Registration Open

noreply@blogger.com (Rodrigo Picos) — Tue, 26 Feb 2008 07:49:00 +0000

CS - 213th Meeting - Registration Open

REGISTRATION IS NOW OPEN!
213th ECS Meeting
May 18-22, 2008
Phoenix, AZ

For more information and to register, please visit our website: http://www.electrochem.org/.

Please note these important deadlines for the Phoenix Meeting:

1. Meeting and Short Course Registrations are due to ECS Headquarters no later than April 18, 2008 to qualify for the advance registration discount.

Register for the meeting using our online system that processes your Visa, MasterCard, or American Express credit card payment in real time:
https://community.electrochem.org/eweb/DynamicPage.aspx?webcode=CSCEventsSearch&Site=ecs.

If you prefer, send or fax a hard copy of your meeting registration forms with payment to The Electrochemical Society, 65 South Main St., Pennington, NJ 08534, USA, Phone: 1.609.737.1902, Fax: 1.609.737.2743, E-mail: ecs@electrochem.org, no later than April 18, 2008. You can download the meeting registration brochure at:
http://www.electrochem.org/meetings/biannual/213/phoenix_reg_bro.pdf.

Please Note: All technical registrations include a copy of the meeting abstracts on CD-ROM only. Attendees who wish to have paper copies of abstracts should download them in advance of the meeting from the ECS website:
http://ecsmeet5.peerx-press.org/jsp/mas/reportSymposiumList.jsp.

2. Hotel reservations are due no later than April 18, 2008!

Located in the center of downtown – steps from the Phoenix Convention Center, Symphony Hall, and Herberger Theater – the Hyatt Regency Phoenix Hotel places you near spectacular sports, arts, culture, and attractions.

A block of rooms have been reserved for May 5-27, 2008. The special room rate will be available until April 18th or until the group block is sold-out, whichever comes first.
Special Room Rates:

$165 per night, per room for single/double occupancy
$215 per night, per room for triple occupancy
$240 per night, per room for quadruple occupancy

Please follow the link to make a hotel room reservation online: http://phoenix.hyatt.com/groupbooking/phxrptels2008

See you at the Hyatt Regency Phoenix in May!

www.electrochem.org

Design News: Volume 8, Issue 7

noreply@blogger.com (Rodrigo Picos) — Tue, 19 Feb 2008 09:01:00 +0000

Freescale Technical Update

In This Issue

Feature Story

Meet ColdFire®: The best connected 15-year-old in the MCU industry

Knowledge Bank

Wind River Seminar: Making Multicore Work

LTE: Next-gen mobile solutions for bandwidth-intense applications

eeTECHbrief webcast: Connectivity Solutions for Industrial Applications

Newsroom

Rich Beyer to join Freescale as chairman and CEO

Enhancements planned for 3G Mobile eXtreme Convergence reference design

Linux community now has integrated Linux BSP for mobile handset applications

Deep packet inspection available for IP-based telecom networks

Partnership helps expand automotive presence in China

MXC cellular platform supports Microsoft Windows Mobile

Product Alerts

Introducing the industry's most accurate Li-ion battery charger ICs

Events

Add Freescale to your embedded world 2008 agenda

My Technical Subscriptions

Feature Story

Meet ColdFire®: The best connected 15-year-old in the MCU industry

There's a new face on ColdFire, and you'll start seeing it on print and online ads in your favorite publications. We've introduced a new microsite for our 15-year-old MCU, freescale.com/coldfire101, that is everything ColdFire, from architecture to training, in an exciting new look. It's fun and informative, and we're out to tell the world about it.

Visit the microsite now and find out what all the buzz is about.

Return to Top

Knowledge Bank
Educational materials such as presentations, webcasts and white papers

Wind River Seminar: Making Multicore Work

Interested in learning how to maximize your multicore development? Register today for the half-day seminar, Making Multicore Work. We're teaming up with Wind River to present this session across several major European cities. Wind River's multicore architectures and multiprocessing, and the newly announced Freescale MPC8572 PowerQUICC® III communications processor will be featured. Register today.

LTE: Next-gen mobile solutions for bandwidth-intense applications

Flip through the pages of any trade publication and you'll see something written about Long Term Evolution (LTE). Without a question, LTE is hot. And it was on everyone's mind at Mobile World Congress in Barcelona last week.

Engineered to provide high-speed, low-latency data to unlock high-bandwidth applications, LTE is a highly anticipated technology for tomorrow's mobile environment. In Barcelona, we demonstrated LTE feature capabilities, including uplink and downlink at high data rates with streaming HD video.

Most analysts have suggested LTE-enabled consumer devices are at least a year away, yet we're already achieving peak data rates of 96 Mbps downlink and 86 Mbps uplink for mobile devices — and plan to go higher as the standard matures.

Learn more about LTE at www.freescale.com/LTE, and read the press release about our LTE demos from Mobile World Congress.

eeTECHbrief webcast: Connectivity Solutions for Industrial Applications

Are you ready to shorten your 32-bit design time? Freescale's Connectivity Solutions for Industrial Applications eeTECHbrief webcast will help you get started. Gain an understanding of the benefits provided by a single-chip ColdFire® MCU and learn how CodeWarrior® for ColdFire v7.0 simplifies 32-bit designs. You'll also learn about:

Industry challenges

The solution – The MCF5223x and MCF5221x ColdFire families

How these solutions enhance your application

The development environment – CodeWarrior for ColdFire v7.0

Register at eeTECHbrief.com under "MPU/MCUs" events today. At the end of the webcast you'll receive a coupon code for 50 percent off a demo board.

Return to Top

Newsroom
Press releases from Freescale

Rich Beyer to join Freescale as chairman and CEO

Last week Rich Beyer was named chairman and CEO of Freescale. Beyer succeeds Michel Mayer, who will continue to serve as chairman of the board and CEO until the transition is effective in March. Beyer comes to Freescale from Intersil Corporation. Read more.

Also see:	"Q&A with Freescale's New CEO" by Emily Thornton (BusinessWeek)
	"Freescale's new CEO optimistic" by Max Jarman (Arizona Republic)

Enhancements planned for 3G Mobile eXtreme Convergence reference design

Take Freescale's Mobile eXtreme Convergence (MXC) architecture and then combine it with S60 and Symbian OS™ — and you've got a powerful trio. The three companies created the first HSDPA mobile phone reference design using Freescale's MXC. That design has developed into a mature solution, addressing both upper-low-tier and mid-tier 3G market segments. Freescale continues to enhance the first 3G mobile phone reference design using MXC with S60 and Symbian OS. Design enhancements and cost reductions with the newly-introduced fully-integrated RFCMOS 90nm radio reference design is planned as part of another collaboration with S60 and Symbian. Read more.

Linux community now has integrated Linux BSP for mobile handset applications

The rumor is true. Support for the Linux® operating system on our cellular products is available. Freescale's Linux cellular platform is capable of supporting any Linux Application Framework, whether it's an industry standard or an OEM's proprietary solution. Read more.

Deep packet inspection available for IP-based telecom networks

With telecommunications infrastructure networks becoming more IP-based, network security solutions are even more critical. Together, with Qosmos, we're providing high-performance deep packet inspection solutions using Qosmos' Qoala software on Freescale's MPC8572E PowerQUICC® III processor. The same platform capability will be able to scale from today's dual core MPC8572E to Freescale's innovative multicore platform. Read more.

Partnership helps expand automotive presence in China

China is the second largest automotive market in the world, following only the United States. To create new opportunities in this rapidly growing market, we've formed an alliance with Comtech Group, Inc. We'll focus on using our advanced semiconductor technology in Comtech's customized module solutions, concentrating on its original equipment manufacturing (OEM) and original design manufacturing (ODM) customers in the Chinese automotive market. Read more.

MXC cellular platform supports Microsoft Windows Mobile

Now carriers have the opportunity to deliver desktop "familiarity" through handheld devices. Last week at Mobile World Congress, we announced the integration of the Microsoft Windows Mobile operating system with our Mobile eXtreme Convergence (MXC) cellular platforms. MXC's unique single core modem architecture enables smartphone capabilities at feature-phone prices. Read more.

Return to Top

Product Alerts
Updates about our products, technologies and services

Introducing the industry's most accurate Li-ion battery charger ICs

The industry's most accurate power management ICs that help you get the longest life from your lithium-ion (Li-ion) battery-powered applications have arrived.

Introducing the MC34671, MC34673 and MC34674. These single-input autonomous battery charger ICs offer output voltage accuracy of +/-0.4 percent over temperature and charging current accuracy of +/‑5 percent over temperature. And they can be factory customized to create hundreds of configurations. Read more.

Return to Top

Events
Programs in which Freescale is a host or participant

Add Freescale to your embedded world 2008 agenda

24-26 February
Nuremburg, Germany
Hall 9, Stand 335

Add us to your embedded world 2008 plans. Whether you're designing a consumer appliance, an industrial solution, or just about any kind of embedded application, you can learn from Freescale engineers and experts who will be on site to share their expertise. We're showcasing a wide range of industry-leading solutions and we're presenting several important white paper sessions to help you with your next innovative design. Get all the details.

Return to Top

My Technical Subscriptions
Current documentation and tool updates

Analog and Mixed Signal

Network Transceivers

LIN, ISO9141, J1850 Physical Interfaces
Documentation : Data Sheets
MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K
MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K
MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K

System Basis Chip
Documentation : Data Sheets
MC33910, MC33910, System Basis Chip with LIN Transceiver - Low End, pdf, 755K
MC33911, MC33911, System Basis Chip with LIN Transceiver - Medium End, pdf, 817K
MC33912, MC33912, System Basis Chip with LIN Transceiver - High End, pdf, 860K

Return to Top

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Design News: Volume 8, Issue 7

Feature Story

Knowledge Bank Educational materials such as presentations, webcasts and white papers

Newsroom Press releases from Freescale

Product Alerts Updates about our products, technologies and services

Events Programs in which Freescale is a host or participant

My Technical Subscriptions Current documentation and tool updates

Every design tells a story.
Come and share yours.

Knowledge Bank
Educational materials such as presentations, webcasts and white papers

Newsroom
Press releases from Freescale

Product Alerts
Updates about our products, technologies and services

Events
Programs in which Freescale is a host or participant

My Technical Subscriptions
Current documentation and tool updates