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         <title>VIA Technologies, Inc. News</title>
         <link>http://www.via.com.tw/en/</link>
         <description>VIA News</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <managingEditor>Gaynor de Wit &lt;GaynordeWit@via.com.tw&gt;</managingEditor>
         <webMaster>Edward YS Lin &lt;EdwardYSLin@via.com.tw&gt;</webMaster>
         <pubDate>2009/11/11 18:05:07</pubDate>
   <atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" href="http://feeds.feedburner.com/VIANews" type="application/rss+xml" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com" /><item>         <title>VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/X-Rd_Ee89O0/pressrelease.jsp</link>
         <description>VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/X-Rd_Ee89O0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/11/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4267</feedburner:origLink></item>   <item>         <title>VIA Introduces New VIA Nano 3000 Series Processors</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/tCprD9RgH0k/pressrelease.jsp</link>
         <description>VIA Introduces New VIA Nano 3000 Series Processors&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/tCprD9RgH0k" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/11/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4247</feedburner:origLink></item>   <item>         <title>VIA Announces October Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Hv37SDUzNjQ/pressrelease.jsp</link>
         <description>VIA Announces October Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Hv37SDUzNjQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/11/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4207</feedburner:origLink></item>   <item>         <title>VIA Announces September Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/lSszCA5LysA/pressrelease.jsp</link>
         <description>VIA Announces September Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/lSszCA5LysA" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/10/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4187</feedburner:origLink></item>   <item>         <title>VIA Processor Platforms Support Windows 7-Based Windows Embedded Standard 2011</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/GD3YSMVXpQE/pressrelease.jsp</link>
         <description>VIA Processor Platforms Support Windows 7-Based Windows Embedded Standard 2011&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/GD3YSMVXpQE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4167</feedburner:origLink></item>   <item>         <title>VIA Partners Unveil New NetNote Designs that Highlight HD Content, Digital TV and External MP3 Control Decks</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/wL4g9QdR3tw/pressrelease.jsp</link>
         <description>VIA Partners Unveil New NetNote Designs that Highlight HD Content, Digital TV and External MP3 Control Decks&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/wL4g9QdR3tw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/25</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4147</feedburner:origLink></item>   <item>         <title>Ultimate Mini-ITX HD Multimedia Platform Combines DX10.1 and Dual HDMI through both Discrete and Integrated Graphics</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Q7I9iOujssI/pressrelease.jsp</link>
         <description>Ultimate Mini-ITX HD Multimedia Platform Combines DX10.1 and Dual HDMI through both Discrete and Integrated Graphics&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Q7I9iOujssI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4127</feedburner:origLink></item>   <item>         <title>VIA Unveils SurfBoard Platforms and Turnkey Systems for New NetNote Category</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/NXKDrD-GET0/pressrelease.jsp</link>
         <description>VIA Unveils SurfBoard Platforms and Turnkey Systems for New NetNote Category&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/NXKDrD-GET0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/16</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4107</feedburner:origLink></item>   <item>         <title>VIA EPIA-P720 Brings Fanless HD Video Playback to Pico-ITX</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/EpJ3GZ5008A/pressrelease.jsp</link>
         <description>VIA EPIA-P720 Brings Fanless HD Video Playback to Pico-ITX&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/EpJ3GZ5008A" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/15</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4087</feedburner:origLink></item>   <item>         <title>VIA Adopts Sequans Mobile WiMAX Chip Technology for New VIA eNote Turnkey Solution</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Pi8ICogEWa4/pressrelease.jsp</link>
         <description>VIA Adopts Sequans Mobile WiMAX Chip Technology for New VIA eNote Turnkey Solution&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Pi8ICogEWa4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4067</feedburner:origLink></item>   <item>         <title>VIA Announces August Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PQwhRnHGOiY/pressrelease.jsp</link>
         <description>VIA Announces August Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PQwhRnHGOiY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4047</feedburner:origLink></item>   <item>         <title>VIA Launches ACE-CNX Customized Security Service</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/8xaQ_pMBrew/pressrelease.jsp</link>
         <description>VIA Launches ACE-CNX Customized Security Service&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/8xaQ_pMBrew" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/09/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4027</feedburner:origLink></item>   <item>         <title>VIA Launches Stackable Multi-Story Chassis for VIA EPIA Boards</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/buYD28MJf_c/pressrelease.jsp</link>
         <description>VIA Launches Stackable Multi-Story Chassis for VIA EPIA Boards&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/buYD28MJf_c" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/08/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=4007</feedburner:origLink></item>   <item>         <title>VIA Collaborates with DTS to Deliver '7th Row Center' Sound to Mobile Users</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/nUElgni-45A/pressrelease.jsp</link>
         <description>VIA Collaborates with DTS to Deliver '7th Row Center' Sound to Mobile Users&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/nUElgni-45A" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/08/21</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3967</feedburner:origLink></item>   <item>         <title>VIA Powers the RED Box: Cloud-Based Marketing Content Delivery</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/qyGYUiU_MbM/pressrelease.jsp</link>
         <description>VIA Powers the RED Box: Cloud-Based Marketing Content Delivery&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/qyGYUiU_MbM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/08/11</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3947</feedburner:origLink></item>   <item>         <title>VIA Tackles Extreme Environments with Wide Temperature Fanless Nano-ITX Board</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/qj3IkSlb6tE/pressrelease.jsp</link>
         <description>VIA Tackles Extreme Environments with Wide Temperature Fanless Nano-ITX Board&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/qj3IkSlb6tE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/08/06</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3927</feedburner:origLink></item>   <item>         <title>VIA Announces July Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/cHn45mSDBq0/pressrelease.jsp</link>
         <description>VIA Announces July Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/cHn45mSDBq0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/08/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3907</feedburner:origLink></item>   <item>         <title>VIA Hits the Jackpot with AAEON's Dual-Channel Display ETX Board</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/d4j2Kkw84DY/pressrelease.jsp</link>
         <description>VIA Hits the Jackpot with AAEON's Dual-Channel Display ETX Board&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/d4j2Kkw84DY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/07/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3887</feedburner:origLink></item>   <item>         <title>VIA Partners with Eurocomposant, Major Distributor for European Embedded Markets</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/iGrmivs_i4A/pressrelease.jsp</link>
         <description>VIA Partners with Eurocomposant, Major Distributor for European Embedded Markets&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/iGrmivs_i4A" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/07/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3847</feedburner:origLink></item>   <item>         <title>VIA Eden One Watt Processor Brings Power-Efficiency to Fujitsu Thin Clients</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/U9nKf9Emz6k/pressrelease.jsp</link>
         <description>VIA Eden One Watt Processor Brings Power-Efficiency to Fujitsu Thin Clients&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/U9nKf9Emz6k" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/07/17</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3827</feedburner:origLink></item>   <item>         <title>VIA Announces June Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/lUiFSQVlfxI/pressrelease.jsp</link>
         <description>VIA Announces June Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/lUiFSQVlfxI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/07/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3807</feedburner:origLink></item>   <item>         <title>VIA Unveils 'GMB for Life' Theme at VIA GMB Tech Forum Summer</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/mAaJ9UI5cks/pressrelease.jsp</link>
         <description>VIA Unveils 'GMB for Life' Theme at VIA GMB Tech Forum Summer&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/mAaJ9UI5cks" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/25</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3787</feedburner:origLink></item>   <item>         <title>VIA and HP Bring Outstanding Energy-Efficiency to Chinese Enterprise Users</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/P0faMsnMX_s/pressrelease.jsp</link>
         <description>VIA and HP Bring Outstanding Energy-Efficiency to Chinese Enterprise Users&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/P0faMsnMX_s" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/16</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3767</feedburner:origLink></item>   <item>         <title>VIA Partners with Bluex to Offer After-Sales Service for VIA GMB Alliance Devices</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/r2x1SUEKTh0/pressrelease.jsp</link>
         <description>VIA Partners with Bluex to Offer After-Sales Service for VIA GMB Alliance Devices&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/r2x1SUEKTh0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/11</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3747</feedburner:origLink></item>   <item>         <title>VIA and ArcSoft Bring Full HD Audio to Home Theatre PCs</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/GgBx2qiNNS4/pressrelease.jsp</link>
         <description>VIA and ArcSoft Bring Full HD Audio to Home Theatre PCs&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/GgBx2qiNNS4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3727</feedburner:origLink></item>   <item>         <title>VIA Announces May Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vyo8MfJIX_U/pressrelease.jsp</link>
         <description>VIA Announces May Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vyo8MfJIX_U" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3707</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Powers New Tongfong Thin and Light Notebook</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vRlsqUQ5CTQ/pressrelease.jsp</link>
         <description>VIA Nano Processor Powers New Tongfong Thin and Light Notebook&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vRlsqUQ5CTQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/06/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3687</feedburner:origLink></item>   <item>         <title>New VIA Vinyl HD Audio Codecs and CyberLink PowerDVD Offer Full-Rate Blu-ray Audio</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/6lIwhkirpvo/pressrelease.jsp</link>
         <description>New VIA Vinyl HD Audio Codecs and CyberLink PowerDVD Offer Full-Rate Blu-ray Audio&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/6lIwhkirpvo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3627</feedburner:origLink></item>   <item>         <title>Silence is Golden in the Office with Shuttle's First VIA Nano-Based Mini PC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/x840KbNbn8E/pressrelease.jsp</link>
         <description>Silence is Golden in the Office with Shuttle's First VIA Nano-Based Mini PC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/x840KbNbn8E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3647</feedburner:origLink></item>   <item>         <title>VIA-Developed Pico-ITXe Claims Center Stage at Computex 2009</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/jGdItBrzzOM/pressrelease.jsp</link>
         <description>VIA-Developed Pico-ITXe Claims Center Stage at Computex 2009&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/jGdItBrzzOM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3608</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Platform Receives Coveted 'Best of Computex' Award</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/wPQLg_FiD-g/pressrelease.jsp</link>
         <description>VIA Nano Processor Platform Receives Coveted 'Best of Computex' Award&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/wPQLg_FiD-g" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3607</feedburner:origLink></item>   <item>         <title>VIA Offers Customized Security Solution Service to Embedded Customers</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vUV5pKL0tUY/pressrelease.jsp</link>
         <description>VIA Offers Customized Security Solution Service to Embedded Customers&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vUV5pKL0tUY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/21</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3587</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Powers Next-Generation Data Center Servers</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/eQZK8HVFwX8/pressrelease.jsp</link>
         <description>VIA Nano Processor Powers Next-Generation Data Center Servers&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/eQZK8HVFwX8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/20</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3568</feedburner:origLink></item>   <item>         <title>VIA Embedded to Revolutionize Digital Signage Markets with Single Board HD Platform for Multiple Displays</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/7OVB6xVEy7U/pressrelease.jsp</link>
         <description>VIA Embedded to Revolutionize Digital Signage Markets with Single Board HD Platform for Multiple Displays&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/7OVB6xVEy7U" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/11</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3547</feedburner:origLink></item>   <item>         <title>VIA Announces April Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/r9SNGuoOf8M/pressrelease.jsp</link>
         <description>VIA Announces April Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/r9SNGuoOf8M" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3527</feedburner:origLink></item>   <item>         <title>VIA Announces 1Q'09 Financial Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/X4Xji8eKlvQ/pressrelease.jsp</link>
         <description>VIA Announces 1Q'09 Financial Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/X4Xji8eKlvQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/05/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3507</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Brings Higher Performance to Media Servers</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/fapqtMxuByQ/pressrelease.jsp</link>
         <description>VIA Nano Processor Brings Higher Performance to Media Servers&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/fapqtMxuByQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3487</feedburner:origLink></item>   <item>         <title>VIA Announces 4Q'08 Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/nO7sXVchbcU/pressrelease.jsp</link>
         <description>VIA Announces 4Q'08 Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/nO7sXVchbcU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/24</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3467</feedburner:origLink></item>   <item>         <title>VIA and Microsoft Promote Stay-at-Home Servers in Tokyo</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/DBtKZmO3Tms/pressrelease.jsp</link>
         <description>VIA and Microsoft Promote Stay-at-Home Servers in Tokyo&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/DBtKZmO3Tms" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/23</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3447</feedburner:origLink></item>   <item>         <title>VIA Sponsors VIA OpenBook Mini-Notes for WiMAX Covered Campus</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/7lbA2UNrZbU/pressrelease.jsp</link>
         <description>VIA Sponsors VIA OpenBook Mini-Notes for WiMAX Covered Campus&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/7lbA2UNrZbU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/21</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3427</feedburner:origLink></item>   <item>         <title>VIA Embedded Launches System Design Manufacturing Service</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/5RdO6x3Hd_c/pressrelease.jsp</link>
         <description>VIA Embedded Launches System Design Manufacturing Service&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/5RdO6x3Hd_c" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/09</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3407</feedburner:origLink></item>   <item>         <title>VIA Announces March Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/sS6g6dghxnI/pressrelease.jsp</link>
         <description>VIA Announces March Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/sS6g6dghxnI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/04/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3387</feedburner:origLink></item>   <item>         <title>VIA Delivers Stunning Hi-Def Video and DX10.1 to Pico-ITXe</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/_XIvrt-nIXk/pressrelease.jsp</link>
         <description>VIA Delivers Stunning Hi-Def Video and DX10.1 to Pico-ITXe&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/_XIvrt-nIXk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3367</feedburner:origLink></item>   <item>         <title>Thin, Fanless and Strong, VIA Demos First Em-ITX Board with VIA Nano Processor at ESC Silicon Valley</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/LkBtqfTirJg/pressrelease.jsp</link>
         <description>Thin, Fanless and Strong, VIA Demos First Em-ITX Board with VIA Nano Processor at ESC Silicon Valley&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/LkBtqfTirJg" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3347</feedburner:origLink></item>   <item>         <title>New VIA In-Vehicle Platform for Driving Next-Generation Car PCs</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/HktfCGcDfrY/pressrelease.jsp</link>
         <description>New VIA In-Vehicle Platform for Driving Next-Generation Car PCs&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/HktfCGcDfrY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/19</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3327</feedburner:origLink></item>   <item>         <title>VIA Surfboard Rolls Out Peak HD Performance for Mini-Notebooks</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/EdB9yp2w4FA/pressrelease.jsp</link>
         <description>VIA Surfboard Rolls Out Peak HD Performance for Mini-Notebooks&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/EdB9yp2w4FA" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/17</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3307</feedburner:origLink></item>   <item>         <title>New VIA VX855 Media System Processor Brings Power-Efficiency to 1080p HD Video Playback</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vzetxmrTkcs/pressrelease.jsp</link>
         <description>New VIA VX855 Media System Processor Brings Power-Efficiency to 1080p HD Video Playback&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vzetxmrTkcs" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/12</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3287</feedburner:origLink></item>   <item>         <title>VIA and 200 Partners to Define the Future of the Mini-Notebook at VIA GMB Tech Forum Spring</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ON02BtUqRwM/pressrelease.jsp</link>
         <description>VIA and 200 Partners to Define the Future of the Mini-Notebook at VIA GMB Tech Forum Spring&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ON02BtUqRwM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3267</feedburner:origLink></item>   <item>         <title>VIA Unveils Em-ITX, the First Form Factor Standard with Dual I/O Coastlines</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/a1w_5Iof0O4/pressrelease.jsp</link>
         <description>VIA Unveils Em-ITX, the First Form Factor Standard with Dual I/O Coastlines&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/a1w_5Iof0O4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3207</feedburner:origLink></item>   <item>         <title>VIA Announces February Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ABk3UW_5alE/pressrelease.jsp</link>
         <description>VIA Announces February Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ABk3UW_5alE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/03/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3227</feedburner:origLink></item>   <item>         <title>Samsung Adopts VIA Nano Processor for the Samsung NC20 12.1" Mini-Notebook</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/xSev-Ub9hFY/pressrelease.jsp</link>
         <description>Samsung Adopts VIA Nano Processor for the Samsung NC20 12.1" Mini-Notebook&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/xSev-Ub9hFY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/02/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3188</feedburner:origLink></item>   <item>         <title>The VIA AMOS-3000: The Strong, Silent Type of Industrial PC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/FoHHV-cx1x8/pressrelease.jsp</link>
         <description>The VIA AMOS-3000: The Strong, Silent Type of Industrial PC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/FoHHV-cx1x8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/02/25</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3148</feedburner:origLink></item>   <item>         <title>VIA Announces Power-Efficient 8-Bay 2U Rackmount Server</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/WCrPRaSupyk/pressrelease.jsp</link>
         <description>VIA Announces Power-Efficient 8-Bay 2U Rackmount Server&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/WCrPRaSupyk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/02/11</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3127</feedburner:origLink></item>   <item>         <title>VIA Announces January Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/HbcETH0xA9M/pressrelease.jsp</link>
         <description>VIA Announces January Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/HbcETH0xA9M" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/02/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3107</feedburner:origLink></item>   <item>         <title>VIA Serves Up Next Generation Data Storage for the Home</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/P1jzkdG6OxY/pressrelease.jsp</link>
         <description>VIA Serves Up Next Generation Data Storage for the Home&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/P1jzkdG6OxY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/01/09</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3087</feedburner:origLink></item>   <item>         <title>VIA To Demonstrate Innovative Notebooks and Small Form Factor PCs during CES 2009</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Mo0OKucWVfQ/pressrelease.jsp</link>
         <description>VIA To Demonstrate Innovative Notebooks and Small Form Factor PCs during CES 2009&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Mo0OKucWVfQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/01/07</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3067</feedburner:origLink></item>   <item>         <title>VIA Announces December Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vWiS1VhKs8s/pressrelease.jsp</link>
         <description>VIA Announces December Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vWiS1VhKs8s" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2009/01/06</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3047</feedburner:origLink></item>   <item>         <title>VIA Joins Qifang in Supporting Innovative Microfinance Schemes for Students in Western China</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/0pnfK2J5dg8/pressrelease.jsp</link>
         <description>VIA Joins Qifang in Supporting Innovative Microfinance Schemes for Students in Western China&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/0pnfK2J5dg8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/12/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3027</feedburner:origLink></item>   <item>         <title>VIA Trinity Platform Brings Hi-Def to Small Spaces</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/6fUgmwUIn2k/pressrelease.jsp</link>
         <description>VIA Trinity Platform Brings Hi-Def to Small Spaces&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/6fUgmwUIn2k" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/12/18</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3007</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Platform Wins WinHEC Award 2008 for Green Technology</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/EkwPgVp3eV4/pressrelease.jsp</link>
         <description>VIA Nano Processor Platform Wins WinHEC Award 2008 for Green Technology&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/EkwPgVp3eV4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/12/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2967</feedburner:origLink></item>   <item>         <title>Big on Storage, Small on the Desktop: the New VIA ARTiGO A2000 Barebone Storage Server</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/J0LC2pXDsbM/pressrelease.jsp</link>
         <description>Big on Storage, Small on the Desktop: the New VIA ARTiGO A2000 Barebone Storage Server&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/J0LC2pXDsbM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/12/09</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2947</feedburner:origLink></item>   <item>         <title>VIA Announces November Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/-LSiq3UmgDw/pressrelease.jsp</link>
         <description>VIA Announces November Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/-LSiq3UmgDw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/12/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2927</feedburner:origLink></item>   <item>         <title>VIA Announces Aristo Pico 840 Mini-note For Poland</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/V48y0-C2UM4/pressrelease.jsp</link>
         <description>VIA Announces Aristo Pico 840 Mini-note For Poland&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/V48y0-C2UM4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/11/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2907</feedburner:origLink></item>   <item>         <title>VIA Collaborates with OpenChrome on Open Source Video Driver</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/6hGD8qVyc4s/pressrelease.jsp</link>
         <description>VIA Collaborates with OpenChrome on Open Source Video Driver&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/6hGD8qVyc4s" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/11/20</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2887</feedburner:origLink></item>   <item>         <title>VIA Launches VIPRO Touch-Screen Panel PC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/_ZHqIlguz-o/pressrelease.jsp</link>
         <description>VIA Launches VIPRO Touch-Screen Panel PC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/_ZHqIlguz-o" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/11/18</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2867</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Among Leading Embedded Demos at Electronica</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/dx5CWS68ZYw/pressrelease.jsp</link>
         <description>VIA Nano Processor Among Leading Embedded Demos at Electronica&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/dx5CWS68ZYw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/11/05</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2847</feedburner:origLink></item>   <item>         <title>VIA Announces October Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/a3HnCefSjNw/pressrelease.jsp</link>
         <description>VIA Announces October Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/a3HnCefSjNw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/11/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2827</feedburner:origLink></item>   <item>         <title>VIA Unveils First Pico-ITXe Board with Stackable I/O Expansion at ESC Boston</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ZqUXOK1ZLH4/pressrelease.jsp</link>
         <description>VIA Unveils First Pico-ITXe Board with Stackable I/O Expansion at ESC Boston&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ZqUXOK1ZLH4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2807</feedburner:origLink></item>   <item>         <title>VIA Launches 'Global Mobility Bazaar' Program to Drive Mobile Computing Adoption</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Afn7z6qlr2M/pressrelease.jsp</link>
         <description>VIA Launches 'Global Mobility Bazaar' Program to Drive Mobile Computing Adoption&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Afn7z6qlr2M" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/28</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2787</feedburner:origLink></item>   <item>         <title>VIA Demos First VIA Nano Processor Board at ESC Boston 2008</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/XAb87CsL_wY/pressrelease.jsp</link>
         <description>VIA Demos First VIA Nano Processor Board at ESC Boston 2008&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/XAb87CsL_wY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/28</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2767</feedburner:origLink></item>   <item>         <title>VIA Nano Processor: World's Safest, Most Power Efficient Cryptography for Mini-notes and x86-based Computers</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/BAL7SUPbTxk/pressrelease.jsp</link>
         <description>VIA Nano Processor: World's Safest, Most Power Efficient Cryptography for Mini-notes and x86-based Computers&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/BAL7SUPbTxk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/14</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2727</feedburner:origLink></item>   <item>         <title>VIA Showcases Small and Beautiful Industrial Devices at ISA Expo 2008</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/5iQF769FQcA/pressrelease.jsp</link>
         <description>VIA Showcases Small and Beautiful Industrial Devices at ISA Expo 2008&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/5iQF769FQcA" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/13</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2707</feedburner:origLink></item>   <item>         <title>VIA Announces September Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/J0IkStt9m_U/pressrelease.jsp</link>
         <description>VIA Announces September Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/J0IkStt9m_U" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/10/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2687</feedburner:origLink></item>   <item>         <title>VIA ARTiGO Autumn Sweepstake Now On: Win an HP Mini!</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/7usJyO-R8y4/pressrelease.jsp</link>
         <description>VIA ARTiGO Autumn Sweepstake Now On: Win an HP Mini!&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/7usJyO-R8y4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/09/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2667</feedburner:origLink></item>   <item>         <title>VIA Announces Major Mini-Note Design Win for China</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/zJao5hBfj3E/pressrelease.jsp</link>
         <description>VIA Announces Major Mini-Note Design Win for China&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/zJao5hBfj3E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/09/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2627</feedburner:origLink></item>   <item>         <title>VIA Announces August  Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/i2m_l3g0O5Q/pressrelease.jsp</link>
         <description>VIA Announces August  Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/i2m_l3g0O5Q" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/09/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2647</feedburner:origLink></item>   <item>         <title>VIA Pico-ITX at the Heart of Modern Robots</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/EmCcCVcDn2I/pressrelease.jsp</link>
         <description>VIA Pico-ITX at the Heart of Modern Robots&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/EmCcCVcDn2I" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/08/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2607</feedburner:origLink></item>   <item>         <title>VIA Announces First Nano-ITX Board with VIA VX800</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/kRGVDzmh_vc/pressrelease.jsp</link>
         <description>VIA Announces First Nano-ITX Board with VIA VX800&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/kRGVDzmh_vc" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/08/15</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2587</feedburner:origLink></item>   <item>         <title>VIA Announces July Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/6xK_fd18lPk/pressrelease.jsp</link>
         <description>VIA Announces July Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/6xK_fd18lPk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/08/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2567</feedburner:origLink></item>   <item>         <title>VIA Contracts Harald Welte as Open Source Liaison</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ckgIikH2unM/pressrelease.jsp</link>
         <description>VIA Contracts Harald Welte as Open Source Liaison&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ckgIikH2unM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/07/25</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2547</feedburner:origLink></item>   <item>         <title>VIA Announces June Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/YgQaYaC0gi0/pressrelease.jsp</link>
         <description>VIA Announces June Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/YgQaYaC0gi0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/07/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2507</feedburner:origLink></item>   <item>         <title>VIA Pico-ITX Goes Low Profile, Integrates Power Supply</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/MGtm9TU9bLE/pressrelease.jsp</link>
         <description>VIA Pico-ITX Goes Low Profile, Integrates Power Supply&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/MGtm9TU9bLE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2487</feedburner:origLink></item>   <item>         <title>VIA Showcases x86 Embedded Expertise in Korea</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/R6F9zizYib0/pressrelease.jsp</link>
         <description>VIA Showcases x86 Embedded Expertise in Korea&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/R6F9zizYib0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/16</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2467</feedburner:origLink></item>   <item>         <title>VIA Unveils Mini-ITX 2.0: The Mini PC Platform of the Future</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/y6PE7Idvvy8/pressrelease.jsp</link>
         <description>VIA Unveils Mini-ITX 2.0: The Mini PC Platform of the Future&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/y6PE7Idvvy8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/05</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2427</feedburner:origLink></item>   <item>         <title>VIA Nano Processor Platform Earns Prestigious 'Best of Computex' Award</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/DlRN0kp6Jq8/pressrelease.jsp</link>
         <description>VIA Nano Processor Platform Earns Prestigious 'Best of Computex' Award&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/DlRN0kp6Jq8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2408</feedburner:origLink></item>   <item>         <title>VIA Showcases Digital Home Electronics Platforms at Computex</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/tIQTGsTja1Y/pressrelease.jsp</link>
         <description>VIA Showcases Digital Home Electronics Platforms at Computex&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/tIQTGsTja1Y" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2407</feedburner:origLink></item>   <item>         <title>VIA OpenBook Mini-Note Reference Design wins Gold at Computex! </title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/4YGrNt8R6YI/pressrelease.jsp</link>
         <description>VIA OpenBook Mini-Note Reference Design wins Gold at Computex!&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/4YGrNt8R6YI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2389</feedburner:origLink></item>   <item>         <title>VIA Announces May Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/QY1jeRxDcUo/pressrelease.jsp</link>
         <description>VIA Announces May Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/QY1jeRxDcUo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/06/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2387</feedburner:origLink></item>   <item>         <title>VIA Launches VIA Nano Processor Family</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/xTwbRUid1MQ/pressrelease.jsp</link>
         <description>VIA Launches VIA Nano Processor Family&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/xTwbRUid1MQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2369</feedburner:origLink></item>   <item>         <title>VIA Unveils VIA OpenBook Mini-Note Reference Design</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/W9_oD1Zt-Yo/pressrelease.jsp</link>
         <description>VIA Unveils VIA OpenBook Mini-Note Reference Design&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/W9_oD1Zt-Yo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2347</feedburner:origLink></item>   <item>         <title>New VIA EPIA M700 Mini-ITX Enables Brilliant Dual Digital Displays</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/fuqwuN8ORUY/pressrelease.jsp</link>
         <description>New VIA EPIA M700 Mini-ITX Enables Brilliant Dual Digital Displays&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/fuqwuN8ORUY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2327</feedburner:origLink></item>   <item>         <title>VIA Unveils the World's Lowest Power x86 Processor on the World's Smallest Board</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/tDPF-TvLjuw/pressrelease.jsp</link>
         <description>VIA Unveils the World's Lowest Power x86 Processor on the World's Smallest Board&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/tDPF-TvLjuw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/14</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2307</feedburner:origLink></item>   <item>         <title>VIA Showcases Small and Beautiful x86 Embedded Systems in Tokyo</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/D6dRdqpPUxo/pressrelease.jsp</link>
         <description>VIA Showcases Small and Beautiful x86 Embedded Systems in Tokyo&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/D6dRdqpPUxo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/13</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2287</feedburner:origLink></item>   <item>         <title>VIA Announces April Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/mEzFxzxMcRs/pressrelease.jsp</link>
         <description>VIA Announces April Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/mEzFxzxMcRs" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/05/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2267</feedburner:origLink></item>   <item>         <title>VIA Announces 4Q'07 and 1Q'08 Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/LMIt-h8Ulb4/pressrelease.jsp</link>
         <description>VIA Announces 4Q'07 and 1Q'08 Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/LMIt-h8Ulb4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2247</feedburner:origLink></item>   <item>         <title>VIA Launches Open Source Driver Development Portal</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/C-in0-Swh4E/pressrelease.jsp</link>
         <description>VIA Launches Open Source Driver Development Portal&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/C-in0-Swh4E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2227</feedburner:origLink></item>   <item>         <title>VIA Joins Effort to form New Multi-Service Business Gateway Alliance at Interop</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/xa8NIk6fSoM/pressrelease.jsp</link>
         <description>VIA Joins Effort to form New Multi-Service Business Gateway Alliance at Interop&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/xa8NIk6fSoM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2207</feedburner:origLink></item>   <item>         <title>VIA ARTiGO Pico-ITX Kit Highlighted at ESC Silicon Valley Keynote, BYOES Track and Microsoft SPARK Your Imagination Program</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/sjOQPcntkZk/pressrelease.jsp</link>
         <description>VIA ARTiGO Pico-ITX Kit Highlighted at ESC Silicon Valley Keynote, BYOES Track and Microsoft SPARK Your Imagination Program&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/sjOQPcntkZk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/16</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2167</feedburner:origLink></item>   <item>         <title>VIA Attends ExpoElectronica 2008 in Moscow</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/iyIysGp6NSU/pressrelease.jsp</link>
         <description>VIA Attends ExpoElectronica 2008 in Moscow&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/iyIysGp6NSU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/15</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2147</feedburner:origLink></item>   <item>         <title>VIA Moves into COM Express™ Embedded Module Market</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/68wvGBDavr0/pressrelease.jsp</link>
         <description>VIA Moves into COM Express™ Embedded Module Market&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/68wvGBDavr0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/14</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2127</feedburner:origLink></item>   <item>         <title>VIA Announces Strategic Open Source Driver Development Initiative</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ZuKOuzACfXk/pressrelease.jsp</link>
         <description>VIA Announces Strategic Open Source Driver Development Initiative&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ZuKOuzACfXk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/08</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2088</feedburner:origLink></item>   <item>         <title>VIA C7-M ULV Processor Powers New HP 2133 Mini-Note PC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/TPRba4w5v_E/pressrelease.jsp</link>
         <description>VIA C7-M ULV Processor Powers New HP 2133 Mini-Note PC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/TPRba4w5v_E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/08</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2087</feedburner:origLink></item>   <item>         <title>Small Form Factor SIG Adopts VIA's Pico-ITX Specification</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PVVNatlRSBs/pressrelease.jsp</link>
         <description>Small Form Factor SIG Adopts VIA's Pico-ITX Specification&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PVVNatlRSBs" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2067</feedburner:origLink></item>   <item>         <title>VIA and Everex to Demonstrate New CloudBook™ Max with Built-In WiMAX™ Capability for Sprint XOHM™ Network at CTIA</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/-kGfC6QgT2g/pressrelease.jsp</link>
         <description>VIA and Everex to Demonstrate New CloudBook™ Max with Built-In WiMAX™ Capability for Sprint XOHM™ Network at CTIA&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/-kGfC6QgT2g" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2048</feedburner:origLink></item>   <item>         <title>VIA Announces March Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/XDoLb2Fz0J4/pressrelease.jsp</link>
         <description>VIA Announces March Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/XDoLb2Fz0J4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2049</feedburner:origLink></item>   <item>         <title>New VIA VX800 Series Chipsets to Extend VIA Leadership in Ultra Mobile Market</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Af9Et6C2GK8/pressrelease.jsp</link>
         <description>New VIA VX800 Series Chipsets to Extend VIA Leadership in Ultra Mobile Market&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Af9Et6C2GK8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/04/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2047</feedburner:origLink></item>   <item>         <title>New VIA Thin Server Board for Eco-Friendly Small Business Storage</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/nzHpRi6CZf0/pressrelease.jsp</link>
         <description>New VIA Thin Server Board for Eco-Friendly Small Business Storage&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/nzHpRi6CZf0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/03/31</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=2027</feedburner:origLink></item>   <item>         <title>VIA and Bitway Announce Power Efficient PC for Brazilian Market</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/2LzuF16pnD0/pressrelease.jsp</link>
         <description>VIA and Bitway Announce Power Efficient PC for Brazilian Market&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/2LzuF16pnD0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/03/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1987</feedburner:origLink></item>   <item>         <title>VIA Announces February Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PiiKLHdsoDE/pressrelease.jsp</link>
         <description>VIA Announces February Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PiiKLHdsoDE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/03/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1967</feedburner:origLink></item>   <item>         <title>VIA Pico-ITX Adopted for Ultra Compact DIN Rail Industrial Control PC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/uhJZ3m2ZNo8/pressrelease.jsp</link>
         <description>VIA Pico-ITX Adopted for Ultra Compact DIN Rail Industrial Control PC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/uhJZ3m2ZNo8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/02/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1947</feedburner:origLink></item>   <item>         <title>VIA Takes Next-Gen Digital Signage Technologies to Las Vegas</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/r1sAwVSgTiE/pressrelease.jsp</link>
         <description>VIA Takes Next-Gen Digital Signage Technologies to Las Vegas&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/r1sAwVSgTiE" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/02/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1927</feedburner:origLink></item>   <item>         <title>VIA Demos Smaller, Cooler x86 Platforms at Embedded World 2008</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/bh1tDo3x8vM/pressrelease.jsp</link>
         <description>VIA Demos Smaller, Cooler x86 Platforms at Embedded World 2008&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/bh1tDo3x8vM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/02/25</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1907</feedburner:origLink></item>   <item>         <title>VIA Announces January Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/tOwfpcosJ8c/pressrelease.jsp</link>
         <description>VIA Announces January Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/tOwfpcosJ8c" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/02/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1887</feedburner:origLink></item>   <item>         <title>VIA EPIA EK Powers Next Generation Tranax Transactional Kiosk</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/n9Yt9NI4VF0/pressrelease.jsp</link>
         <description>VIA EPIA EK Powers Next Generation Tranax Transactional Kiosk&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/n9Yt9NI4VF0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/31</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1867</feedburner:origLink></item>   <item>         <title>VIA Unveils Next-Generation Isaiah x86 Processor Architecture</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ZR3zja9Yclg/pressrelease.jsp</link>
         <description>VIA Unveils Next-Generation Isaiah x86 Processor Architecture&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ZR3zja9Yclg" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/24</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1827</feedburner:origLink></item>   <item>         <title>VIA Launches Specialized Network Appliance Board for UTM, VPN, and Firewall Applications</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PQtmYZmCq8U/pressrelease.jsp</link>
         <description>VIA Launches Specialized Network Appliance Board for UTM, VPN, and Firewall Applications&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PQtmYZmCq8U" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/17</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1807</feedburner:origLink></item>   <item>         <title>VIA Announces December Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/oW1mFCaZR2Y/pressrelease.jsp</link>
         <description>VIA Announces December Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/oW1mFCaZR2Y" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1767</feedburner:origLink></item>   <item>         <title>MAXDATA Launches New Belinea s.book 1 Mini-Note Powered by the VIA C7-M ULV Ultra Mobile Processor</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Mec1WVaK_co/pressrelease.jsp</link>
         <description>MAXDATA Launches New Belinea s.book 1 Mini-Note Powered by the VIA C7-M ULV Ultra Mobile Processor&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Mec1WVaK_co" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/11</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1787</feedburner:origLink></item>   <item>         <title>"Small is Beautiful" for VIA Innovations during CES 2008</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/pXm633w13Ho/pressrelease.jsp</link>
         <description>"Small is Beautiful" for VIA Innovations during CES 2008&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/pXm633w13Ho" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2008/01/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1747</feedburner:origLink></item>   <item>         <title>Phitronics Starts Production of VIA pc2500 Mainboards in Brazil</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/XL65ygx35cw/pressrelease.jsp</link>
         <description>Phitronics Starts Production of VIA pc2500 Mainboards in Brazil&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/XL65ygx35cw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/12/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1729</feedburner:origLink></item>   <item>         <title>VIA Launches ARTiGO Builder Kit for the Pico-ITX</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/7l8oaBBsaWw/pressrelease.jsp</link>
         <description>VIA Launches ARTiGO Builder Kit for the Pico-ITX&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/7l8oaBBsaWw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/12/07</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1727</feedburner:origLink></item>   <item>         <title>VIA Demos Eco-Friendly Education at Green California Schools Summit</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/mwL-E_mYXlM/pressrelease.jsp</link>
         <description>VIA Demos Eco-Friendly Education at Green California Schools Summit&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/mwL-E_mYXlM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/12/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1707</feedburner:origLink></item>   <item>         <title>VIA Announces November Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/CCtEhfiJGBU/pressrelease.jsp</link>
         <description>VIA Announces November Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/CCtEhfiJGBU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/12/04</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1687</feedburner:origLink></item>   <item>         <title>VIA Announces UK Availability of VIA pc-1 Mainboards</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Yaju2ZwUTsc/pressrelease.jsp</link>
         <description>VIA Announces UK Availability of VIA pc-1 Mainboards&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Yaju2ZwUTsc" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/11/29</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1667</feedburner:origLink></item>   <item>         <title>VIA Announces October Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/4LToetFfsik/pressrelease.jsp</link>
         <description>VIA Announces October Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/4LToetFfsik" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/11/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1647</feedburner:origLink></item>   <item>         <title>VIA Announces 3Q'07 Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/9e0QGJvUOHY/pressrelease.jsp</link>
         <description>VIA Announces 3Q'07 Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/9e0QGJvUOHY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/10/31</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1627</feedburner:origLink></item>   <item>         <title>VIA Announces Ultra Thin VESA Mounted PC for Instant Display Systems</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/F0vQ7q0dgGA/pressrelease.jsp</link>
         <description>VIA Announces Ultra Thin VESA Mounted PC for Instant Display Systems&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/F0vQ7q0dgGA" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/10/08</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1607</feedburner:origLink></item>   <item>         <title>VIA Announces September Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/iWww10XJ_TA/pressrelease.jsp</link>
         <description>VIA Announces September Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/iWww10XJ_TA" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/10/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1587</feedburner:origLink></item>   <item>         <title>VIA and QSound Labs, Inc. Bring Superior Sound Systems to Windows Vista</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/GcgJvVS4tUw/pressrelease.jsp</link>
         <description>VIA and QSound Labs, Inc. Bring Superior Sound Systems to Windows Vista&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/GcgJvVS4tUw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/09/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1567</feedburner:origLink></item>   <item>         <title>VIA To Showcase Small, Powerful, Integrated x86 Processors and Mainboards at Embedded Systems Conference Boston</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ri40MxgRKZo/pressrelease.jsp</link>
         <description>VIA To Showcase Small, Powerful, Integrated x86 Processors and Mainboards at Embedded Systems Conference Boston&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ri40MxgRKZo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/09/18</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1554</feedburner:origLink></item>   <item>         <title>VIA Launches Vista-Ready EPIA SN, Fastest Ever EPIA Mainboard</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/OIgO2ECOp0I/pressrelease.jsp</link>
         <description>VIA Launches Vista-Ready EPIA SN, Fastest Ever EPIA Mainboard&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/OIgO2ECOp0I" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/09/17</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1547</feedburner:origLink></item>   <item>         <title>OQO First to Ship 1.6GHz VIA C7-M ULV Processor in Latest Addition to Award-Winning model 02 Product Line</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/VpJLuQI1hjM/pressrelease.jsp</link>
         <description>OQO First to Ship 1.6GHz VIA C7-M ULV Processor in Latest Addition to Award-Winning model 02 Product Line&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/VpJLuQI1hjM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/09/10</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1527</feedburner:origLink></item>   <item>         <title>VIA Announces August Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/adNwcASAON8/pressrelease.jsp</link>
         <description>VIA Announces August Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/adNwcASAON8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/09/03</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1508</feedburner:origLink></item>   <item>         <title>VIA Announces 2Q'07/1H'07 Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/cEAo85lS40E/pressrelease.jsp</link>
         <description>VIA Announces 2Q'07/1H'07 Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/cEAo85lS40E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/31</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1507</feedburner:origLink></item>   <item>         <title>ASI Corporation Adopts the VIA C7-D Processor for Energy Efficient PCs for Mexican Market</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/eGdlT93a8Xc/pressrelease.jsp</link>
         <description>ASI Corporation Adopts the VIA C7-D Processor for Energy Efficient PCs for Mexican Market&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/eGdlT93a8Xc" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1487</feedburner:origLink></item>   <item>         <title>VIA Announces 1-Watt Processor, the World's Most Power Efficient x86 CPU</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/lHbwBJryh7M/pressrelease.jsp</link>
         <description>VIA Announces 1-Watt Processor, the World's Most Power Efficient x86 CPU&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/lHbwBJryh7M" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/23</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1467</feedburner:origLink></item>   <item>         <title>VIA Introduces New pc3500 Mainboard</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/td0jjULK0rQ/pressrelease.jsp</link>
         <description>VIA Introduces New pc3500 Mainboard&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/td0jjULK0rQ" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/21</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1447</feedburner:origLink></item>   <item>         <title>Systemax Adopts the VIA C7-D Processor for Highly Energy Efficient PCs for the US Market</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/5PEePkvFmgY/pressrelease.jsp</link>
         <description>Systemax Adopts the VIA C7-D Processor for Highly Energy Efficient PCs for the US Market&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/5PEePkvFmgY" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1428</feedburner:origLink></item>   <item>         <title>VIA Announces July Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/4MS3qqJeTNk/pressrelease.jsp</link>
         <description>VIA Announces July Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/4MS3qqJeTNk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/08/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1427</feedburner:origLink></item>   <item>         <title>VIA PowerSaver Certified Energy-Efficient by China's CSC</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/n5uJ2MHNX7U/pressrelease.jsp</link>
         <description>VIA PowerSaver Certified Energy-Efficient by China's CSC&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/n5uJ2MHNX7U" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/07/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1407</feedburner:origLink></item>   <item>         <title>New VIA Nano-ITX Mainboard for Healthcare, Retail and Industrial Applications</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ilG37KqVEKo/pressrelease.jsp</link>
         <description>New VIA Nano-ITX Mainboard for Healthcare, Retail and Industrial Applications&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ilG37KqVEKo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/07/24</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1390</feedburner:origLink></item>   <item>         <title>VIA and Mecer Join Forces on New Education PC for South Africa</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/u0A-wiQ1gWo/pressrelease.jsp</link>
         <description>VIA and Mecer Join Forces on New Education PC for South Africa&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/u0A-wiQ1gWo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/07/09</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1367</feedburner:origLink></item>   <item>         <title>VIA Announces June Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/qCnhSICtNqo/pressrelease.jsp</link>
         <description>VIA Announces June Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/qCnhSICtNqo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/07/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1347</feedburner:origLink></item>   <item>         <title>VIA Introduces Dual-LAN, Dual-LVDS Mini-ITX Mainboard</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Nz1PGheSJmc/pressrelease.jsp</link>
         <description>VIA Introduces Dual-LAN, Dual-LVDS Mini-ITX Mainboard&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Nz1PGheSJmc" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/06/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1327</feedburner:origLink></item>   <item>         <title>VTF2007: VIA Mobile-ITX Mainboard Will Expedite PC2.0 Transition</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/ntL0Oqfo2yw/pressrelease.jsp</link>
         <description>VTF2007: VIA Mobile-ITX Mainboard Will Expedite PC2.0 Transition&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/ntL0Oqfo2yw" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/06/06</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1310</feedburner:origLink></item>   <item>         <title>VIA Ultra Mobile Platform Wins "Best of COMPUTEX" Award for its Power Efficient Design</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/8htH8-EosCM/pressrelease.jsp</link>
         <description>VIA Ultra Mobile Platform Wins "Best of COMPUTEX" Award for its Power Efficient Design&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/8htH8-EosCM" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/06/06</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1309</feedburner:origLink></item>   <item>         <title>VIA to Define Mobility 2.0 with Revolutionary New VIA NanoBook UMD Reference Design</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/AmVuwQGwt-I/pressrelease.jsp</link>
         <description>VIA to Define Mobility 2.0 with Revolutionary New VIA NanoBook UMD Reference Design&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/AmVuwQGwt-I" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/06/05</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1307</feedburner:origLink></item>   <item>         <title>VIA Announces May Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Z-btm0SkK1w/pressrelease.jsp</link>
         <description>VIA Announces May Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Z-btm0SkK1w" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/06/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1287</feedburner:origLink></item>   <item>         <title>Driving the Emergence of Mobility 2.0 at VIA Technology Forum 2007</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/krOTa19kKZI/pressrelease.jsp</link>
         <description>Driving the Emergence of Mobility 2.0 at VIA Technology Forum 2007&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/krOTa19kKZI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/05/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1267</feedburner:origLink></item>   <item>         <title>VIA Brings Pico-ITX Mainboard to Market with the VIA EPIA PX</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/4ot9_ZIdg_I/pressrelease.jsp</link>
         <description>VIA Brings Pico-ITX Mainboard to Market with the VIA EPIA PX&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/4ot9_ZIdg_I" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/05/22</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1247</feedburner:origLink></item>   <item>         <title>VIA Enters into Strategic Alliance with Chunghwa Telecom and GIGABYTE to Deliver 3.5G Services for Ultra Mobile Devices</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/3hLvWDuOuxU/pressrelease.jsp</link>
         <description>VIA Enters into Strategic Alliance with Chunghwa Telecom and GIGABYTE to Deliver 3.5G Services for Ultra Mobile Devices&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/3hLvWDuOuxU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/05/15</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1227</feedburner:origLink></item>   <item>         <title>VIA Announces April Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PdXW5iw4iME/pressrelease.jsp</link>
         <description>VIA Announces April Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PdXW5iw4iME" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/05/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1224</feedburner:origLink></item>   <item>         <title>VIA Announces 4Q'06 and 1Q'07 Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/n5nQcZGIxv4/pressrelease.jsp</link>
         <description>VIA Announces 4Q'06 and 1Q'07 Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/n5nQcZGIxv4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1223</feedburner:origLink></item>   <item>         <title>Everex and VIA Take Energy-Efficient Widescreen Notebooks into Mainstream US Retailers</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/LM8YbRb9wqI/pressrelease.jsp</link>
         <description>Everex and VIA Take Energy-Efficient Widescreen Notebooks into Mainstream US Retailers&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/LM8YbRb9wqI" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1207</feedburner:origLink></item>   <item>         <title>VTF2007 to Highlight the Trend towards Ultra Mobility</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/9NW9db2GwO8/pressrelease.jsp</link>
         <description>VTF2007 to Highlight the Trend towards Ultra Mobility&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/9NW9db2GwO8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1208</feedburner:origLink></item>   <item>         <title>VIA Defines Pico-ITX Form Factor, the World's Smallest x86 Mainboard</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/_sfHRRmoWJ8/pressrelease.jsp</link>
         <description>VIA Defines Pico-ITX Form Factor, the World's Smallest x86 Mainboard&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/_sfHRRmoWJ8" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/19</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1206</feedburner:origLink></item>   <item>         <title>HP and VIA Launch New Commercial PC for China</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/JtfLjb4423A/pressrelease.jsp</link>
         <description>HP and VIA Launch New Commercial PC for China&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/JtfLjb4423A" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/13</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1205</feedburner:origLink></item>   <item>         <title>VIA Announces March Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/5_aXoD9h3no/pressrelease.jsp</link>
         <description>VIA Announces March Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/5_aXoD9h3no" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/04/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1204</feedburner:origLink></item>   <item>         <title>VIA C7 Processor Powers New VXL Itona Thin Client Range</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/33viwyxRQd0/pressrelease.jsp</link>
         <description>VIA C7 Processor Powers New VXL Itona Thin Client Range&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/33viwyxRQd0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/03/14</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1203</feedburner:origLink></item>   <item>         <title>VIA Launches Most Powerful, Most Efficient and Most Media-Rich Nano-ITX Mainboard</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/49_n_2dWbBs/pressrelease.jsp</link>
         <description>VIA Launches Most Powerful, Most Efficient and Most Media-Rich Nano-ITX Mainboard&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/49_n_2dWbBs" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/03/13</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1202</feedburner:origLink></item>   <item>         <title>VIA Shows How Clean Computing Can Halve Power Use at the Green California Exposition</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Dec2q7TpJ5E/pressrelease.jsp</link>
         <description>VIA Shows How Clean Computing Can Halve Power Use at the Green California Exposition&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Dec2q7TpJ5E" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/03/12</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1199</feedburner:origLink></item>   <item>         <title>VIA Announces February Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/b-VdsNp4Hwo/pressrelease.jsp</link>
         <description>VIA Announces February Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/b-VdsNp4Hwo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/03/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1198</feedburner:origLink></item>   <item>         <title>VIA Expands Cooperation with Geekcorps to Empower Remote Mali Communities</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/OzmFSJ-pBco/pressrelease.jsp</link>
         <description>VIA Expands Cooperation with Geekcorps to Empower Remote Mali Communities&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/OzmFSJ-pBco" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/27</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1196</feedburner:origLink></item>   <item>         <title>VIA Launches Vista-Ready VIA CN896 for Power-Efficient Desktop and Embedded Systems</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Kega_Dwaf-g/pressrelease.jsp</link>
         <description>VIA Launches Vista-Ready VIA CN896 for Power-Efficient Desktop and Embedded Systems&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Kega_Dwaf-g" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1195</feedburner:origLink></item>   <item>         <title>VIA EPIA EN-Powered Ainkaboot Octimod Cluster Makes HPC Scalable and Affordable</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/lkSxmP51Ivo/pressrelease.jsp</link>
         <description>VIA EPIA EN-Powered Ainkaboot Octimod Cluster Makes HPC Scalable and Affordable&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/lkSxmP51Ivo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/19</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1194</feedburner:origLink></item>   <item>         <title>VIA Expand Presence in India with Establishment of SAARC Regional Hub in Bangalore</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/gF-bM92bKWU/pressrelease.jsp</link>
         <description>VIA Expand Presence in India with Establishment of SAARC Regional Hub in Bangalore&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/gF-bM92bKWU" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/07</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1192</feedburner:origLink></item>   <item>         <title>VIA Announces PadLock RSA Module for Microsoft Windows</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/H0qtsi-DSdk/pressrelease.jsp</link>
         <description>VIA Announces PadLock RSA Module for Microsoft Windows&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/H0qtsi-DSdk" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/07</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1191</feedburner:origLink></item>   <item>         <title>VIA Celebrates 5th Birthday of EPIA Mini-ITX Mainboards!</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/W0_iGzI4ww0/pressrelease.jsp</link>
         <description>VIA Celebrates 5th Birthday of EPIA Mini-ITX Mainboards!&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/W0_iGzI4ww0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/05</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1190</feedburner:origLink></item>   <item>         <title>S3 Graphics Windows Vista-Certified Drivers Now Available for Chrome Series GPUs</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/vpEA0KIQ5fo/pressrelease.jsp</link>
         <description>S3 Graphics Windows Vista-Certified Drivers Now Available for Chrome Series GPUs&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/vpEA0KIQ5fo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1189</feedburner:origLink></item>   <item>         <title>VIA Announces January Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/PM1eckUWufg/pressrelease.jsp</link>
         <description>VIA Announces January Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/PM1eckUWufg" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/02/01</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1188</feedburner:origLink></item>   <item>         <title>VIA Announces Broadest Chipset Support for MicrosoftR Windows Vista™</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/dgmLrX94LXo/pressrelease.jsp</link>
         <description>VIA Announces Broadest Chipset Support for MicrosoftR Windows Vista™&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/dgmLrX94LXo" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/01/30</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1166</feedburner:origLink></item>   <item>         <title>Fujitsu Siemens Computers Adopts VIA PT890 for SCALEO Home PCs</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/E2ylHbgGFNc/pressrelease.jsp</link>
         <description>Fujitsu Siemens Computers Adopts VIA PT890 for SCALEO Home PCs&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/E2ylHbgGFNc" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/01/26</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1165</feedburner:origLink></item>   <item>         <title>VIA Announces PCI Express Chipset for Vista-Ready Mobility</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/mwYTfgbptr4/pressrelease.jsp</link>
         <description>VIA Announces PCI Express Chipset for Vista-Ready Mobility&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/mwYTfgbptr4" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/01/24</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1164</feedburner:origLink></item>   <item>         <title>S3 Graphics Partners with InterVideo on HD-DVD™ and Blu-Ray Disc™ Content Playback during CES 2007</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/Zzw5XhKoHFs/pressrelease.jsp</link>
         <description>S3 Graphics Partners with InterVideo on HD-DVD™ and Blu-Ray Disc™ Content Playback during CES 2007&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/Zzw5XhKoHFs" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/01/08</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1163</feedburner:origLink></item>   <item>         <title>VIA Announces 2006 December Sales Results</title>
         <link>http://feedproxy.google.com/~r/VIANews/~3/0pLM6rE5yE0/pressrelease.jsp</link>
         <description>VIA Announces 2006 December Sales Results&lt;img src="http://feeds.feedburner.com/~r/VIANews/~4/0pLM6rE5yE0" height="1" width="1"/&gt;</description>
         <language>en-us</language>
         <copyright>VIA Technologies, Inc.</copyright>
         <author>VIA Technologies Inc. &lt;mkt@via.com.tw&gt;</author>
         <category />
         <pubDate>2007/01/02</pubDate>
   <feedburner:origLink>http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=1162</feedburner:origLink></item>   </channel>
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