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        <title>Market News -  Arrow Electronics | Asia Pacific Component</title>
        <description>Arrow Market news is designed to provide you up-to-date marketing information about electronics, semiconductor, and component industry</description>
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            <title>Market News -  Arrow Electronics | Asia Pacific Component</title>
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            <description>Arrow Asia Pac</description>
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            <title>Fairchild Semiconductor Wins Prestigious Power Product Innovation Award in
Chin</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/MCUpDfr0xos/</link>
            <description>FL7701 LED Driver Recognized by ‘EEPW’ for Solving Small-Space, Luminary Life Span, and Energy Saving Challenges of Low-Power LED Applications

Fairchild Semiconductor (NYSE: FCS), a leading global supplier of high performance power and mobile products, has received a prestigious award for innovation from Electronic Engineering and Product World (EEPW), one of China’s key electronic design publications, in the magazine’s annual Power Products Awards.</description>
            <pubDate>Wed, 30 May 2012 15:03:02 +0800</pubDate>
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            <title>Polymicro Technologies Earns Medical ISO 13485:2003
Certification,
Further
Enhancing Molex Presence in the Medical Industr</title>
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            <description>Molex subsidiary successfully demonstrated its ability to meet strict regulatory requirements for medical devices

Molex Incorporated announced today that its specialty fiber subsidiary, Polymicro Technologies, achieved ISO 13485:2003 certification for its Phoenix, AZ location. The facility includes optical fiber drawing, precision laser machining, high-power laser assemblies and an environmentally controlled Class 7 low bio-burden room. The ISO 13485:2003 certification will allow Molex to take projects from prototype through volume production in order to better serve the medical community.</description>
            <pubDate>Mon, 28 May 2012 03:49:55 +0800</pubDate>
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            <title>Osram expands with new LED assembly plant in Chin</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/vaF9yx7OYgM/</link>
            <description>LED plant strengthens the company's position in the lighting industry’s largest market

OSRAM AG has signed a contract with the Wuxi New District Administrative Commit-tee to build a new assembly plant in the Chinese province of Jiangsu. LED chips will be packaged in housings at the new backend facility starting in late 2013; with the Regensburg and Penang (frontend) plants exclusively continuing to make the actual LED chips. "The new assembly plant will improve our access to the world's largest single market in the lighting industry," said Aldo Kamper, CEO of the Osram Opto Semiconductors business unit. "As one of the world’s most renowned LED lighting corporations, Osram's new plant in Wuxi will definitely enhance the development of the LED industry in both Wuxi Municipality and Jiangsu Province," said Lixin Huang, Member of the Standing Committee of Jiangsu Provincial CPC Committee and Secretary of Wuxi Municipal CPC Committee in China.</description>
            <pubDate>Fri, 25 May 2012 16:52:28 +0800</pubDate>
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            <title>NXP Powers NFC in the Samsung GALAXY S II</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/qwIV_wPoPg8/</link>
            <description>NXP Semiconductors N.V. announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the best-selling Samsung GALAXY S II.</description>
            <pubDate>Wed, 16 May 2012 01:52:58 +0800</pubDate>
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        <item>
            <title>Erik Meijer Promoted to President, Bourns Electronic</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/L_7RnZXv_m4/</link>
            <description>Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that Erik Meijer has been promoted to the newly created position of President, Bourns Electronics. In his new role, Meijer will be responsible for overseeing the company's various business segments. Meijer will report to Bourns, Inc. President and Chief Operating Officer, John Halenda, who has announced that he will retire in March 2013.</description>
            <pubDate>Wed, 09 May 2012 07:37:29 +0800</pubDate>
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        <item>
            <title>Vishay Intertechnology's SiZ710DT 20 V N-Channel PowerPAIR® Power MOSFET
Honored With 2012 China ACE Awar</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/VY8KoXeYmDg/</link>
            <description>Vishay Intertechnology, Inc. (NYSE:VSH) today announced that the company’s SiZ710DT 20 V n-channel PowerPAIR® power MOSFET has received a 2012 China Annual Creativity in Electronics (ACE) Award in the category of Power Devices/Voltage Converter.</description>
            <pubDate>Tue, 08 May 2012 05:57:57 +0800</pubDate>
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        <item>
            <title>Power Integrations Found to Infringe Fairchild Semiconductor Patent Rights;
Fairchild Files Additional Patent Lawsui</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/UzhZY1F6xn4/</link>
            <description>Fairchild Semiconductor (NYSE:FCS), a leading global supplier of high performance power and mobile products, today filed a new U.S. patent infringement lawsuit against Power Integrations, Inc. just days after a U.S. jury found Power Integrations infringed Fairchild U.S. patent claims covering primary side regulation technology.</description>
            <pubDate>Tue, 08 May 2012 01:33:09 +0800</pubDate>
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        <item>
            <title>Molex Partners with Altera and Gennum to Demonstrate 100 Gbps
Enabling
Technology at OFC/NFOE</title>
            <link>http://feedproxy.google.com/~r/aap_maki_en/~3/4zNw9_Cv5OI/</link>
            <description>Test of 28 Gbps system provides the roadmap to next-generation interconnect technology

LISLE, Ill. – Molex Incorporated will partner with Altera Corporation and Gennum Corporation to demonstrate interoperability of a 28 Gbps Very Short Reach (VSR) interconnect solution at OFC/NFOEC, March 6 – 8. The companies are using this opportunity to illustrate their commitment to helping system engineers and manufacturers develop higher density and lower power optical networks. The demonstration will take place during the Optical Internetworking Forum (OIF) Interoperability 2012 – Enabling High-Speed Dynamic Services multi-vendor showcase in booth 713.</description>
            <pubDate>Wed, 02 May 2012 14:23:23 +0800</pubDate>
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