3D Integration

"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu

Tue, 15 May 2012 17:05:00 GMT

TSMC’s Doug Yu challenged the current nomenclature and pronounced that interposer technology should be called “3.5D” instead of 2.5D, since it is and will be capable of much more than the simple 3D packaging stack.

Lithography challenges for leading edge 3D packaging applications

Mon, 07 May 2012 18:00:00 GMT

The lithography challenges associated with TSV fabrication for various devices structures are investigated. Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, Ultratech, Inc., San Jose, CA. John Slabbekoorn, Andy Miller, imec, Leuven, Belgium

David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012

Thu, 03 May 2012 18:28:00 GMT

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.

The Micron Memory Cube consortium

Tue, 01 May 2012 05:00:00 GMT

Micron has joined with Samsung to create the "Hybrid Memory Cube (HMC) Consortium" with fellow founding members Altera, Open Silicon, and Xilinx. IBM will be manufacturing the the logic layer.

What have we done for you lately?

Tue, 01 May 2012 05:00:00 GMT

This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovate, to give a few examples.

Interposer consortium ready to expand at Georgia Tech PRC

Thu, 26 Apr 2012 19:16:00 GMT

After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June.

GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die

Thu, 26 Apr 2012 18:36:00 GMT

At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.

SEMATECH highlights from VLSI-TSA

Thu, 26 Apr 2012 17:30:00 GMT

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).

STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board

Mon, 23 Apr 2012 13:18:00 GMT

Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately.

ASMC will focus on productivity and technology challenges

Wed, 18 Apr 2012 20:13:00 GMT

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Conference Report: MRS Spring 2012, Day 3

Thu, 12 Apr 2012 13:34:00 GMT

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

Thu, 12 Apr 2012 01:52:00 GMT

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.

Georgia Tech targets thin 3D packaging with new consortium

Wed, 11 Apr 2012 17:37:00 GMT

Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.

Conference report: MRS Spring 2012, Day 2

Wed, 11 Apr 2012 13:32:00 GMT

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

ALD enables 3D capacitors for CEA-Leti and IPDiA

Tue, 10 Apr 2012 15:10:00 GMT

CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.

Endicott Interconnect names David Van Rossum new CFO

Tue, 10 Apr 2012 14:31:00 GMT

Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.

MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

Thu, 05 Apr 2012 15:26:00 GMT

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.

Georgia Tech increases interposer development work

Wed, 04 Apr 2012 21:17:00 GMT

Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging.

Interposer ecosystem examined

Sun, 01 Apr 2012 05:00:00 GMT

Dr. Phil Garrou, Contributing Editor

Advanced packaging in the new decade

Sun, 01 Apr 2012 05:00:00 GMT

E. Jan Vardaman, Techsearch International