Endicott Interconnect

Cambridge Who's Who Names Annamaria Mastronardi Professional of the Year in Human Resources

noreply@blogger.com (Endicott Interconnect) — Wed, 15 Feb 2012 18:45:00 +0000

ENDICOTT, NY, -- Annamaria Mastronardi, Director of Human Resources for Endicott Interconnect Technologies, has been named a Cambridge Who's Who Professional of the Year in Human Resources. While inclusion in the Cambridge Who's Who Registry is an honor, only a small selection of members in each discipline are chosen for this distinction. These special honorees are distinguished based on their professional accomplishments, academic achievements, leadership abilities, years of service, and the credentials they have provided in association with their Cambridge Who's Who membership.

As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.

Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.

Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.

About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.

Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel

noreply@blogger.com (Endicott Interconnect) — Tue, 07 Feb 2012 14:13:00 +0000

ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.

"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”

Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".

About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.

About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.

Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.

What's New About the EI Website?

noreply@blogger.com (Endicott Interconnect) — Mon, 30 Jan 2012 15:16:00 +0000

EI has been in business for almost 10 years, has expanded into many new markets and has created products for hundreds of new customers. Unfortunately, our old website did not have the functionality or capability to adequately reflect these changes in our growing business. We decided to make significant improvements to our web presence in late 2011 when we partnered with Vibrant Creative to completely redesign and revamp our website. Below are the top 5 major areas of the website that we felt would create a more fluid and informative experience for our customers, suppliers and employees. The proceeding information will also act as a tool to help guide you, the visitor, through the new website to ensure that your time spent on the EI site is engaging as well as enjoyable.

New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.

Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.

Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.

Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.

Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.

Endicott Interconnect Technologies, Inc. Announces the Launch of Their New Website

noreply@blogger.com (Endicott Interconnect) — Thu, 26 Jan 2012 15:32:00 +0000

Over the past several months Endicott Interconnect has been working hand-in-hand with web developers, Vibrant Creative, to upgrade and revitalize their web presence.

The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.

To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.

Endicott Interconnect Technologies, Inc. Honors Employees at Eighth Annual Patent Award and Trade Secret Dinner

noreply@blogger.com (Endicott Interconnect) — Wed, 18 Jan 2012 14:07:00 +0000

ENDICOTT, NY—Endicott Interconnect Technologies, Inc. (EI) honored 23 employees for patent applications filed, U.S. patents issued and trade secrets received in 2010 at an awards dinner and ceremony held Friday, January 13^th 2012 at De Gennaro’s in Endicott, N.Y.

Awards were presented to: Dave Alcoe, Ash Bhatt, Kim Blackwell, Barry Bonitz, Benson Chan, Rabindra Das, Frank Egitto, Mike Hills, John Lauffer, How Lin, Roy Magnuson, Jay McNamara, Frank Marconi, Voya Markovich, Luis Matienzo, Tom Miller, Kostas Papathomas, Mark Poliks, Steve Rosser, Duane Stanke, Bob Testa, Bill Wilson, and Michael Wozniak.

“I am very proud of these individuals whose bold invention, creativity and technological innovation has contributed to the success of EI, ensuring our technical vitality and competitiveness in the open market. The hard work of those being honored tonight is a testament to the truly great things being developed by Endicott Interconnect,” commented James McNamara, President and CEO at EI.

Currently, Endicott Interconnect holds 129 U.S. patents and 32 Trade Secrets.

New High-Tech Center Creates One-of-a-Kind Electronic Systems Hub

noreply@blogger.com (News) — Mon, 07 Nov 2011 17:00:00 +0000

In order to build upon Greater Binghamton's reputation as the premier hub of microelectronic technologies in New York State and utilize the vast existing local and statewide knowledge base, the Research Foundation of State University of New York, with support from Binghamton University and Endicott Interconnect Technologies. Inc., has launched a new collaboration that is expected to greatly accelerate the commercialization of new and improved electronics systems.

The corporation, known as the Binghamton Center for Emerging Technologies (BCET), will work in partnership with commercial, academic, and government agency members, through its New York Systems Integration and Packaging Consortium (NYSIP) to focus on small scale systems integration and packaging projects that could result in a broad range of new commercial and military products.

“Greater Binghamton has a long tradition of expertise in the electronics packaging field,” said Jay McNamara, president and CEO of Endicott Interconnect Technologies. “BCET not only adds to the region’s strengths in the industry but with our one-of-a-kind focus on small systems packaging, it will really put us on the map. Nothing like this exists anywhere else in the United States.”

Tapping into faculty expertise associated with Binghamton University’s Small Scale Systems Integration and Packaging Center (S3IP), the center is expected to serve as a core research facility for advanced technology.

“This initiative underscores the vital role that university-based research plays in driving our economy and will provide additional avenues to build meaningful collaborations with our researchers, “said Bahgat Sammakia, interim vice president of research at Binghamton University.

Launched as a way to meet the Department of Defense’s increasing need for fast turnaround in technology development, BCET will act as a conduit for high-tech federal contracts.

“Public and private partnerships like BCET are essential to translating university research into jobs,” said Congressman Maurice Hinchey (D-NY). “I am pleased that Binghamton University will be strengthening its partnerships with regional businesses like Endicott Interconnect to create and retain jobs related to the development of new commercial and military products. As a member of the House Defense Appropriations Committee, I am happy to have helped put these BCET partners in a position to fulfill technical needs of the Department of Defense and other federal agencies at an accelerated pace.”

Through the collaboration and joint expertise of its members, BCET will be able to develop innovative ideas and solutions much faster and more effectively. In addition, BCET will make it much easier to leverage local resources when it comes to attracting funding and contracts to the region.

“These tough economic times call for creative and collaborative thinking,” said Paul Wolfgramm, Sr., executive director of BCET. “And I believe BCET does exactly that. By joining together the region’s expertise and top-notch resources, the center will not only enhance research and technology transfer opportunities but will also strengthen business-to-business relationships making our region very attractive to outside investment. The result could mean more jobs for our region and make us a great place to start or relocate high-tech businesses.”

BCET membership is open to any organization within the technology area of microelectronics systems integration and packaging. Founding members, the Research Foundation of State University of New York and Endicott Interconnect Technologies, Inc., have already expanded BCET’s membership with the addition of BAE Systems, Inc. and Custom Electronics. Other industries in the region are currently being approached to join the group, which will add to BCET’s capabilities and resources. BCET will be funded strictly through membership dues but could charge fees depending on the nature of the contracts and agreements it is able to secure.

For more information on the organization’s policies and procedures, and application for membership, visit www.bcetny.com

Endicott Interconnect Technologies Announces 2011 Scholarship Award Recipients

noreply@blogger.com (News) — Tue, 25 Oct 2011 16:09:00 +0000

Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2011 Scholarship Award Program at a breakfast ceremony held for the awardees and their parents on Wednesday, August 10th. Scholarships were awarded to: Erwing Augustin, son of Marie and Jean Augustin; Ryan Chan, son of On Chung and Benson Chan; Brian Hebbard, son of Denise and Terry Hebbard; Aaron Li, son of Dong and Handong Li; and Deanna Thompson, daughter of Pam and Tony Thompson.

College scholarships are awarded to five dependents of EI employees wishing to further their education. Winners of the $1,500 award were chosen from a very competitive field based upon their academic excellence, extracurricular activities, community service and personal essays. Submissions were evaluated by a panel of judges made up of EI employees.

“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.

“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”

James J. McNamara Jr., President and CEO at EI, presented the awards to the winning students and their parents at the breakfast. “EI proudly sponsors this annual scholarship program in support of our employees and their families. These students demonstrate outstanding character and commitment to their community, as well as academic excellence and EI is delighted to be able to provide them with the means to help further their education. We would like to congratulate you on your accomplishments and wish you the best of luck in the coming academic year,” he commented.

Warren Dannelly Appointed to Vice President of Worldwide Sales

noreply@blogger.com (News) — Wed, 20 Jul 2011 16:10:00 +0000

Warren Dannelly has been recently appointed to Vice President of Worldwide Sales. In his new position, Warren will be responsible for all of EI’s 12 direct sales force in the US and Europe, as well as the 6 US rep companies totaling 34 sales people and 7 European rep companies totaling 37 sales people. In addition, he has the field sales and operational responsibility for the EI / AVNET / IBM Secure Micro Solutions (SMS) business partnership, which today includes 33 regional offices for AVNET and 321 people.

Prior to EI, Warren was the Director of Sales for Texas Instruments Defense Systems which
was acquired by Raytheon Corporation and then Tyco Electronics Printed Circuit Group, as the Director of Sales for Aerospace and Defense.

Warren began his career as a Quality Engineer at Texas Instruments in 1979 and advanced to Quality Manager in 1983 before becoming promoted to the Director of Quality at NTI in 1996. Warren also worked for the Digital Equipment Corporation as Director of Quality and became Director of Business Development in 1991.

Warren served in the United States Air Force from 1973 to 1979. He graduated with a BS in Industrial Technology from Southern Illinois University, Carbondale, Illinois where he graduated with honors.

Endicott Interconnect Receives More Than $100 Million in Defense Contracts

noreply@blogger.com (News) — Fri, 24 Jun 2011 16:00:00 +0000

Endicott Interconnect Technologies announced it was awarded $101 million in Defense Department contracts in 2010 and this year to date.

EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010.

This year, EI was awarded two hardware sustainment contracts, valued at $2.1 million and $9.5 million. The latter is a 10-year contract, the company said.

Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronic packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.

"This is a significant step forward in the next generation of high-performance computing and utilizes some of the most advanced electronic packaging solutions available in industry today," said Eric Hills, vice president -- business development/program office at EI. "EI had managed the program from the system's design and development phase through prototype and pre-production and is very excited to begin full production."

EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets.

James J. McNamara Jr. Inducted into the Manufacturers Association of Central New York's Wall of Fame

noreply@blogger.com (News) — Wed, 11 May 2011 16:00:00 +0000

James J. McNamara Jr. (Jay), President and CEO of Endicott Interconnect Technologies, Inc. will be honored for his lifetime achievements in manufacturing, by being inducted into the Manufacturers Association of Central New York (MACNY) Wall of Fame on May 12, 2011 at the Syracuse Oncenter.

Jay began his career as a Time Study Engineer at Burlington Industries in 1966. In 1972 he took a position with Amp Incorporated where Jay fine tuned his leadership abilities, enabling him to hold multiple executive positions with Amp and later Tyco Electronics. In 1995, Jay was appointed Vice President of Tyco Electronics assuming responsibility of 12 companies with Tyco located throughout 45 countries. Under Jay’s leadership and management, the wire and
cable business grew organically and via acquisition to $1.6 billion in annual sales.

In November 2002, Jay accepted the President/CEO position of newly formed Endicott Interconnect Technologies, Inc. Jay saw opportunity for growth
and expansion of the former IBM Microelectronics manufacturing site, through diversifying product offerings, advancing technology and expanding the customer base from a handful to over 130. EI has grown into an internationally renowned supplier of advanced electronic packaging solutions serving customers in the medical, defense/aerospace and high end computing markets.

The Manufacturers Association of Central New York (MACNY) advocates for the growth and development of New York’s manufacturing sector, a critical component of a vibrant New York economy. In total, the Manufacturers Association represents approximately 350 business and 55,000 workers across nineteen counties in Upstate New York.

Founded in 1913, MACNY is the largest associations of manufacturers in New York State and one of the oldest manufacturers associations in the nation. More information on MACNY can be found at www.macny.org.

Endicott Interconnect Technologies, Inc. names Michael J. Hills Chief Operating Officer

noreply@blogger.com (News) — Wed, 20 Apr 2011 16:00:00 +0000

Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Michael J. Hills to the position of Chief Operating Officer (COO) reporting to James J. McNamara Jr., President and CEO. In his new position, Mike will be responsible for all manufacturing, engineering, supply chain, quality and facilities operations at the Endicott, NY location.

“As COO, Mike will focus his efforts on establishing new processes and controls to reduce operating expenses, maximizing manufacturing efficiencies and drive improvement to on-time delivery”, stated Mr. McNamara. “With his extensive background in both sales and operations, Mike is uniquely suited to translate the needs of the marketplace to operational excellence for continued growth and profitability of EI.”

Mike previously served as the Senior Vice President of Sales, Marketing and Product Management for EI. He has held a variety of senior executive positions since joining EI in December 2002 as Vice President of Business Development. Prior to EI, Mike worked for the IBM Corporation. He served in several key management positions including Superintendent of IBM Endicott Manufacturing Operations, and Manager of Engineering and Manufacturing Operations at the IBM Dublin, Ireland Server Group plant.

Mike holds a Bachelor of Science degree in Mechanical Engineering from Penn State University and a Masters in Business Administration from Cornell University S.C. Johnson Graduate School of Management.

Endicott Interconnect Technologies, Inc. Achieves AS9100 Aerospace Certification with 100% Score

noreply@blogger.com (News) — Tue, 16 Dec 2008 16:45:00 +0000

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded certification to the AS9100 Quality Management Standard for aerospace suppliers. This certification signifies that its Endicott, N.Y. facility complies with all requirements of the AS9100 quality management system which covers quality assurance in design, development, production, installation and servicing, as well as purchasing, validation and shipping. The standard includes all ISO 9001:2000 requirements and is expanded to address needs specific to the international aerospace industry.

“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”

Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.

AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.

Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract

noreply@blogger.com (News) — Thu, 04 Dec 2008 16:46:00 +0000

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.

This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.

Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.

The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.

Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values

noreply@blogger.com (News) — Fri, 24 Oct 2008 15:53:00 +0000

ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.

Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.

Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”

About the Award 
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.

 About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.

Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values

noreply@blogger.com (News) — Fri, 24 Oct 2008 15:48:00 +0000

ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.

Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.

Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.

 About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.

Endicott Interconnect Technologies, Inc. Receives Department of Defense Trusted Foundry Accreditation

noreply@blogger.com (News) — Thu, 16 Oct 2008 15:54:00 +0000

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a trusted source to the Department of Defense and all other U.S. government users. Specifically, EI has been awarded Category 1A trusted accreditation for integrated circuits for packaging/ assembly services at its Endicott, N.Y. facility.    Trusted supplier status is awarded to those U.S. companies designing, generating, manufacturing and distributing components that are highly critical to our national security.

“Trusted supplier status is a key element of our strategy moving forward. It guarantees our customer’s access to a trusted supplier for mission critical applications, offers us the ability to fabricate classified designs along with providing access to leading edge technology and support through our industry partnership,” stated Jay McNamara, President and CEO at EI.

The change in industry demographics that has shifted microelectronic packaging expertise and manufacturing off-shore, has led to a reduction in worldwide research and development in advanced packaging and to a lack of new product and process capability within the U.S. As a result, the U.S. Department of Defense and the intelligence community is in need of American companies, positioned ahead of potential adversaries to provide leading technologies and manufacturing capabilities in support of the development of high technology products, or access to emerging technologies.

Jennifer de Souza Promoted to Vice President, Supply Chain Management at Endicott Interconnect Technologies, Inc.

noreply@blogger.com (News) — Thu, 02 Oct 2008 15:55:00 +0000

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) today announced a senior management appointment as part of the strategy to drive operational effectiveness. Jennifer de Souza has been promoted to the position of Vice President, Supply Chain Management reporting to Jay McNamara, President and CEO, effective immediately.

Under Ms. de Souza’s leadership, EI is developing and executing direct and indirect materials procurement strategies utilizing lean principles including JIT and Consignment as well as streamlining EI’s Supply Chain through full implementation of the SAP toolset.

Jennifer’s extensive background in leadership roles with world-class companies coupled with her broad knowledge of Supply Chain Management and Procurement will help us attain our goal of continuously improving the delivery of EI solutions to our customers,” commented James J. McNamara, President and CEO at EI.

Ms. de Souza joined EI in April 2007 as Director of Supply Chain Management and has 10 years experience in global materials management and strategic sourcing, most recently as Global Materials Manager at Welch Allyn. Ms. de Souza is a graduate of the Watson School at Binghamton University, holds a Juris Doctor from Syracuse Law School and is RIT certified in lean six sigma green belt methodologies.

Ms. de Souza resides in the Binghamton area with her husband Ian and their two daughters.

Endicott Interconnect Technologies Prepares For Significant Growth, Modifies Employment Practices and Schedules Job Fair

noreply@blogger.com (News) — Thu, 18 Sep 2008 16:00:00 +0000

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has scheduled a job fair for Thursday, September 25th from 4pm to 7pm at EI in Endicott, NY. The company is looking to add over 150 employees during the fourth quarter of 2008. Professional and full-time manufacturing positions are available.

In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.

These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.

EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.

EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.

Felicia Williams Named Vice President of Human Resources at Endicott Interconnect Technologies, Inc.

noreply@blogger.com (News) — Tue, 19 Aug 2008 16:03:00 +0000

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has named Felicia Williams to the position of Vice President of Human Resources effective immediately. In this role, Ms. Williams is responsible for leading EI’s human resource programs, including evaluating and determining needs and opportunities, assessing the effectiveness of existing structures and programs and determining strategic goals and implementation plans.

Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward.   “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”

Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.

Northrop Grumman Corporation Electronic Systems recognizes Endicott Interconnect Technologies for “Raising the Bar in Performance”

noreply@blogger.com (News) — Wed, 06 Aug 2008 16:01:00 +0000

The theme of the Northrop Grumman Electronic Systems’ 2008 supplier conference was “Raising the Bar in Performance.” This full day event included presentations by key sector leadership responsible for supplier management, supplier awards and a reception for the award recipients. The NGC Electronic Systems Supply Chain Management (SCM) and Mission Assurance (MA) organizations co-hosted the 2008 Supplier Conference and Awards event at the Historical Electronics Museum in Linthicum, MD on Wednesday, July 23rd, 2008.

The leadership message was clear, the NGES supply base is an essential component of the success of programs, and Northrop Grumman must have a supply base they can depend on for consistent high quality, on-time delivery, cost competitiveness, innovation, and continuous improvement of processes and product.

In addition to the key sector leadership Ed Asher, Mission Systems Sector, Director of Workforce Relations presented on Operation IMPACT (Injured Military Pursuing Assisted Career Transition) and Lieutenant Colonel Wendell Bugg, Integrated Systems Sector Director, Sector Communications, provided a “Voice of the Customer” perspective.

The supplier awards echoed the conference theme and presenters’ messages. The award categories represented the supplier behaviors, attributes or outcomes that Northrop Grumman Electronic Systems values: Customer Service, Strategic Contributions, Continuous Improvement, Innovation, Extraordinary Effort, Life Cycle Cost and overall highest contributor, Supplier-of-the-Year. The Supplier Awards Program construct from nomination to final vetting reinforced a voice of the customer theme and underscored the principle of one Northrop Grumman.

Among the honored suppliers was Endicott Interconnect Technologies, selected for Innovation. Endicott, located in Endicott, New York, is the successor to IBM’s microelectronics division in Endicott, NY. Endicott provides microelectronic solutions provides high density interconnect substrates.

Endicott Interconnect Technologies, Inc. Announces 2008 Scholarship Award Winners

noreply@blogger.com (News) — Tue, 29 Jul 2008 16:05:00 +0000

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2008 scholarship program in a breakfast ceremony held at EI on Friday, July 25th. 2008 winners include: Renee Stanke, daughter of Duane and Linda Stanke, who will be attending Broome Community College; Melissa Bates, daughter of Bernita Bates, who will be attending Syracuse University; Richard Hill, son of Richard and Sharon Hill, who will be attending SUNY Stony Brook; Bryan Simpson, son of Dave and Susan Seibold-Simpson, who will be attending Binghamton University; and Amir Merke, son of Tensaew Ashera, who will also be attending Binghamton University.

Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.

“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”

Endicott Interconnect Technologies, Inc. Receives Good Neighbor Award

noreply@blogger.com (News) — Wed, 23 Jul 2008 16:06:00 +0000

ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) received the Good Neighbor Award for outstanding support to the American Red Cross Southern Tier Chapter, at a ceremony held at Genegantslet Golf Club on June 26th, 2008.

This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.

“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

noreply@blogger.com (News) — Tue, 01 Jul 2008 16:07:00 +0000

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region. The award, which recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses, was presented at a gala event on June 27th held at the Carnegie Music Hall and Foyer in Pittsburgh, P.A.

McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.

“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”

Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.

About Ernst & Young’s Entrepreneur Of The Year
 Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.

About Ernst & Young 
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.

ndicott Interconnect Technologies, Inc. Supports the Boy Scouts

noreply@blogger.com (News) — Fri, 27 Jun 2008 16:10:00 +0000

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) donated $5,000.00 to the Baden-Powell Council, Boy Scouts of America, in support of an Aquatics Education structure to be built at Camp Tuscarora in Windsor, N.Y. The building will be the centerpiece of the waterfront at the camp and utilized for aquatics training including swimming, boating and fishing. The Baden-Powell Council serves communities in Broome, Chenango, Cortland, southern Seneca, Tioga and Tompkins Counties of New York and Susquehanna County of Pennsylvania.

“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”

Voya R. Markovich named an honored member in technology by Princeton Premier

noreply@blogger.com (News) — Tue, 17 Jun 2008 16:11:00 +0000

New York, N.Y. -- Voya R. Markovich, senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., has been chosen for inclusion in the 2008-2009 Princeton Premier Registry.

Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.

In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.