Peplertech

Zot – Sprint-150

Andrew Norton — Fri, 10 Dec 2021 16:30:00 +0000

Zot engineering have recently installed a new Orbotech Sprint-150 Inkjet Legend Printer at their bare board PCB production plant near Edinburgh. The Sprint-150 replaces their previous generation machine the Sprint-8 providing higher throughput, improved print quality and lower operational costs as power consumption and consumables are reduced.

Zot took the opportunity to switch over to a new type of ink which is compatible with flex and flex-rigid PCBs in addition to their rigid boards.

10 December 2021

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Graphic – Inspex 3

Andrew Norton — Fri, 20 Aug 2021 14:00:00 +0000

Graphic Plc have recently installed a new multiple Inspex 3 Smart Digital Microscopes in the final inspection department at their bare board PCB production plant in Crediton, UK.

The Inspex 3 is a powerful, flexible and intuitive HD digital microscope ideally for routine inspection tasks in industries such as electronics, medical device, pharma and precision engineering.
Unique, patented, high-speed image processing algorithms for exceptional image quality. Super-fast focus speed and smooth digital zoom. Simpler, easier, more efficient inspection.

20 August 2021

View Ash Vision Inspex 3

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Graphic Sprint-300

Andrew Norton — Fri, 30 Jul 2021 16:32:00 +0000

Graphic Plc have recently installed a new Orbotech Sprint-300 Inkjet Legend Printer at their bare board PCB production plant in Crediton, UK. The Sprint-300 replaces their previous generation machine the Sprint-8 providing higher throughput, improved print quality and lower operational costs as power consumption and consumables are all reduced.

Graphic took the opportunity to switch over to a new type of ink which is compatible with flex and flex-rigid PCBs in addition to their rigid boards.

30 July 2021

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Garner Osborne Purchase Fusion AOI from Orbotech

Andrew Norton — Tue, 16 Oct 2018 10:00:01 +0000

UK PCB manufacturer Garner Osborne Circuits has purchased a Fusion 22 AOI System, from our partner Orbotech. The system was delivered in the first half of 2018.

Fusion 22 utilises Orbotech’s unique Multi-Image Technology to insect panels multiple times in one scan for unparalleled detection accuracy and lowest false alarm level. The Fusion replaced an older Discovery AOI model, also from Orbotech, which had provided many years of reliable and consistent performance.

Garner Osborne are celebrating their 26th anniversary as a printed circuit board manufacturer and now offer PCB bare board and electronic assembly in one UK location.

For more details visit:

Garner Osborne Circuits Ltd

Orbotech

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CC Electronics Install Optical Registration System from DIS Inc

Andrew Norton — Tue, 02 Oct 2018 10:00:33 +0000

CC Electronics one of the UK’s leading printed circuit board manufacturers have installed a new Optical Registration system from our partner DIS Inc. The PRS L/U is installed at CC Electronics facility in Winsford, Cheshire, providing layer-to-layer alignment tolerance half that of the best pin-based systems.

The PRS-L/U Pinless Registration System allows for pinless lamination of multi-layers and sequential lamination build-up technology. Three different processes take place in one unit: lay-up, layer-to-layer alignment and welding. The patented SmartWeld system uses inductive energy for rapid welding of the layers independent of layer count. This process eliminates the added tolerances associated with pin lamination, rivet and thermal bonding systems.

CC Electronics wanted to improve registration accuracy provided by their old four-slot punch system. Tests have shown that tolerances are much better with the PRS L/U achieving +/-0.7 mil (17micron) nominal final registration accuracy prior to lamination. The system is capable of High layer count and HDI technology, and significantly improves upon any current pin registration approaches.

To learn more about the PRS Shuttle visit DIS Inc >>

Visit CC Electronics website

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Stevenage Circuits Purchase ITC Hole Filling System

Andrew Norton — Tue, 25 Sep 2018 10:40:21 +0000

Stevenage Circuits Ltd have installed a hole filling system from one of our partners ITC Intercircuit GmbH to meet the increasing demand for filling microvias and through holes.

The system comprises a THP35 Double Chamber Plugging machine with a new patented type of vacuum filling head enabling double sided filling of blind and through holes in one step. A PD 50 Wet Planariser completes the system to grind surplus hole filler and copper after the filling process whilst avoiding heat and stress build up in the panel. The complete hole filling systems is already installed and running at Stevenage Circuits factory in Stevenage, UK.

Stevenage Circuits Ltd is one of the UK’s leading printed circuit board manufacturers. Producing complex multilayer circuits, flex circuits (flexi circuits), and rigid flex circuits, the company specialises in the manufacture of high reliability PCBs for the aerospace, medical and industrial sectors.

I.T.C. Intercircuit started as a sales company for the Printed Circuit Board Industry in Germany, in 1972. Today the I.T.C. group is a leader in manufacturing of PCB equipment with three independent locations in Germany and USA. The company designs and manufacturers Hole Filling Machines, Solder Mask Spraying and Coating Equipment, and Drying/Curing Systems.

For more details visit:

Stevenage Circuits Ltd

ITC Intercircuit GmbH

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Amphenol Invotec Install Orbotech’s Fusion 22XL AOI

Andrew Norton — Mon, 24 Sep 2018 17:26:41 +0000

UK PCB manufacturer Amphenol Invotec has installed Orbotech’s Fusion 22XL Automated Optical Inspection (AOI) solution.

Since implementation, the 22XL has increased the speed and cost effectiveness of its AOI process, enhanced throughput and at the same time, reduced the number of AOI machines in Amphenol Invotec’s UK PCB Manufacturing plant.

Accurately inspecting complex PCBs with special materials without sacrificing delivery schedules poses unique challenges. The Fusion 22XL has helped Amphenol Invotec to increase throughput and high-quality PCB yield while reducing its overall AOI operating costs.

Tim Tatton, General Manager of Amphenol Invotec, commented:

“The Fusion 22XL solution will fundamentally improve our ability to support our rich product and technology mix, including high speed, RF and microwave materials. We look forward to increased yields for our complex PCBs, and we already know that we can count on Orbotech for technical excellence and great customer support.”

For more details visit:

Amphenol Invotec

Orbotech

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Lauffer Pressen – A Short Tour Of The Company

Andrew Norton — Wed, 20 Dec 2017 15:09:24 +0000

Lauffer Pressen have been a partner of PeplerTech for many years providing laminating presses for the Printed Circuit Board (PCB) industry, composite and plastic card industries. Here is a video taking you on a short tour of the company

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Orbotech Diamond – the Leading Direct Imaging (DI) System for Solder Mask

Andrew Norton — Wed, 13 Dec 2017 15:02:20 +0000

Orbotech Diamond is Orbotech’s latest direct imaging (DI) solution for solder mask. Building on Orbotech’s expertise and leadership in DI for patterning, Orbotech Diamond improves mass production of DI for solder mask and boosts throughput, yield and productivity of the most complex designs, while decreasing total cost of ownership (TCO).

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DIS: New RFS system for processing Rigid, Flex and Rigid-Flex boards.

Muriel — Thu, 09 Nov 2017 18:53:36 +0000

The system is a reconfiguration of some of the existing assemblies from DIS systems already in production. The camera assembly has been raised and the positioning system redesigned to move out of the work area. This ensures accuracy, as the cameras only move to the panel length location and then stay fixed for the entire lay-up sequence. This design allows the loading and optical positioning of prepreg that has cutouts, a vacuum plate is used (panel size specific) to completely flatten the layer and position it, once in position, it is clamped.

The system will be introduced at the Productronica show, Please visit DIS at the Adeon booth, (Hall B3, Stand 425)

The RFS system described above optically aligns layer, subs, prepregs etc and then tack welds at 4 points on the perimeter of the panel.

• Optically align and bond Rigid, Flex and Rigid-flex boards
• The system will process all panel sizes from 305 x 355mm to 610 x 760mm (12” x 14” to 24” x 30” )
• Simple touch screen controls
• Ideal for prototype, small volume and high mix production

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