VILLENEUVE D'ASCQ, France & LILLE. December, 1st, 2011. DelfMEMS S.A. announced that it has since Q2 2011 has collaborated with Tronics’ MEMS Fab in Dallas (TX) for the RF MEMS switch process transfer and platform qualification. With steady progress made over the past 6 months, DelfMEMS and Tronics will be able to address the high capacity needs of its RF module partners for the cellular handset market.

The rigorous selection process among US, European and Asian foundries was undertaken in late 2010 and identified Tronics as the best positioned company to meet DelfMEMS technology process requirements for its core RF switch and its thin film capping solution and business sourcing channels.

DelfMEMS will be present @ "UK ANSYS Regional Conference". The paper "Transient Simulation of the Closing of a MEMS Switch with Air Gap Modelled by FLUID136 Elements" will be presented by Nicolas LORPHELIN, mechanical engineer @ DelfMEMS. 

DelfMEMS will exhibit @ EUMW 2011 in Manchester, booth #539. The 14th European Microwave Week 2011, being held this year in Manchester, builds on the success of the previous microwave weeks: Amsterdam (1998, 2004, 2008) • London (2001) • Manchester (2006) • Milan (2002) • Munich (1999, 2003, 2007) • Paris (2000, 2005, 2010) • Rome (2009). The conference has grown over the years and is now the premier event in this field in Europe. The European Microwave Week consists of three conferences: The European Microwave Conference (EuMC) / The European Microwave Integrated Circuits Conference (EuMIC) / The European Radar Conference (EuRAD).

In addition, Exhibitor Workshops, Seminars and Round Table Forums will be a platform for leading manufacturers, institutes and industry bodies to stimulate dialogue and interaction with attendees on relevant Microwave, RF, Wireless, Defence/Security and Radar issues.

The Week provides an invaluable opportunity for industrialists, academics and researchers to consider the latest trends and developments within the ever-widening field of microwaves.

Karim Segueni, DelfMEMS's CTO, will be present @ The 7th International Summer School on RF-MEMS and RF Microsystems, organized by the Topical Group on RF  M E MS  of the European Microwave Association  ( E u M A ® ), aspires to continue the  successful séries  of events started in 2004 wi t h in the framework  of the AMT COM Network of Excellence. The purpose  of this SchooJ is to transfer and exchange knowledge on  Micro and Nano Machined Systems for RF applications, through a number of tutorials  by experts from leading European institutions. The event is open to a il members from academia,  research institutions, and industrial organizations, wi th the aim  of  exchanging the knowledge on this highly active and dynamic topic.

DelfMEMS will exhibit @ IMS 2011, booth #632. IMS2011 will cover developments in microwave technology from nano devices to system applications with a Microwaves for the World theme. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, application seminars, historical exhibits, and a wide array of other technical activities will be offered. The IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium for 2011 (IMS2011) will be held in Baltimore, Maryland, as the centerpiece ofMicrowave Week 2011, from Sunday, June 5 through Friday, June 10, 2011.  

Villeneuve d’Ascq & Lille, France, April 26th, 2011. – DelfMEMS, a rising player in the RF MEMS field, reports today it has successfully delivered custom samples to NTT DOCOMO INC., DelfMEMS has provided arrays of custom MEMS ohmic switches to enable tunability into Radio-Frequency front-end modules -FEM- for mobile applications. Voltage, size, losses, isolation, ultra-fast switching time and power handling will be evaluated by the innovative telecom operator according to the requested specifications until 6 GHz.

DelfMEMS is a provider of MEMS solutions as a part of ARTEMOS project. Agile RF Transceivers and Front-Ends for Future Smart Multi-Standard Communications ApplicationS. This project aims at developing architecture and technologies for implementing agile radio frequency (RF) transceiver capacities in future radio communication products. These new architecture and technologies will be able to manage multi-standard (multi-band, multi-data-rate, and multi-waveform) operation with high modularity, low-power consumption, high reliability, high integration, low costs, low PCB area, and low bill of material (BOM). This will not just require smart RF architectures in advanced CMOS and BiCMOS technology, but also need incorporating of e.g. MEMS technologies and novel simulation methodology for achieving these complex optimizations. The ARTEMOS consortium with partners in the full value-chain from semiconductor suppliers, system houses, application domain, research and universities, is confident that the realization of its ambitious objectives will assist Europe to achieve technological leadership in domains that are targeted by ENIAC. The future RF is coming.