Is It Time for A Roadmap for Equipment and Materials?
December 20, 2013
IFTLE 173 IMAPS 2013 – Materials Advances; Namics, Towa, Dow; Wiley VCH reading Vol. 3 of 3D Integration Handbook
December 18, 2013
IEDM 2013 Preview
December 06, 2013
MEMS: An Enabler of the Next Internet Revolution
December 09, 2013
NEWS ANALYSIS & FEATURES
Mentor Graphics announces president and managing director for Japan
12/20/2013 Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.
TowerJazz and Panasonic sign agreement
12/20/2013 TowerJazz, a global specialty foundry, and Panasonic Corporation today announced the signing of a definitive agreement to create a joint venture (JV) to manufacture Panasonic’s products, using Panasonic's three semiconductor manufacturing facilities in Japan
The Week in Review: Dec. 20, 2013
12/20/2013 AMD and Hynix close to commercialization of HBM; Intel's 22nm mobile processor; SEMI's book-to-bill report; Soitec and CEA renew partnership; Micron collaborates with Broadcom on DRAM timing issue
Book-to-bill: Year-end activity substantially stronger compared to last year
12/20/2013 North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.
STMicroelectronics joins ARM mbed Project
12/19/2013 ARM, a semiconductor supplier, and STMicroelectronics today announced that ST has joined the ARM mbed Project.
Soitec and CEA sign a five-year R&D partnership
12/18/2013 This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets.
Spansion dual-quad serial flash delivers performance for graphic-rich applications
12/18/2013 Universal footprint enables common pinout with current and future high-speed memory.
SAMCO unveils deep silicon etching system for MEMS and TSV production processing
12/18/2013 The RIE-800iPBC is the latest in SAMCO's etching system lineup, and was officially introduced by SAMCO at SEMICON Japan 2013 (the world's largest exhibition for semiconductor equipment and materials), held in Tokyo from December 4-6, 2013.
MACOM successfully completes tender offer for Mindspeed Technologies
12/18/2013 M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.
IDT appoints Gregory Waters as President and CEO
12/17/2013 Integrated Device Technology, Inc. today announced the appointment of Greg Waters, 53, as President, Chief Executive Officer and board member, effective January 6, 2014. Jeff McCreary, who served as interim CEO since August 2013, will remain a member of the IDT board of directors.
Micron collaborates with Broadcom to solve DRAM timing challenge
12/17/2013 Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.
Crystal film growth: nanosheets extend epitaxial growth applications
12/17/2013 Molecularly thin two-dimensional crystals can alleviate the lattice matching restrictions of epitaxial crystalline thin film growth, as reported by researchers in Japan.
Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies
12/17/2013 SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced Packaging, Advanced Product Technology Development, and Kevin Rinebold, Cadence’s Senior Product Marketing Manager.
Mindspeed announces agreement to sell assets to IntelMORE ANALYSIS & FEATURES
12/16/2013 Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.
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