The paper claims that according to calculations, using the relays would result in a reduction of more than 40 percent in footprint on the die, over one-third reduction in static power, and reduction of over a quarter in critical-path delay.

"We knew upfront that FPGA was becoming much more of an issue in the PCB space. FPGAs are growing in complexity. They are having much more capability in terms of ARM processor cores, high speed interfaces for example, and we are seeing more people turning to FPGAs than trying to develop ASICs or SoCs themselves. So, we saw that as a good sign that FPGA is becoming more of a decision criterion for companies purchasing PCB software," commented Keith Felton, Cadence's group director, Product Management Allegro and OrCAD PCB, IC Packaging and System-In-Package Technologies.

博客重组目的
- 将FPGA知识系统化
- 更好地整理资料方便以后重用
- 分工更清晰，读者更明确

博客重组计划

1. 创建技术集合WIKI - http://wiki.fpganotes.com
此站点致力于有序地收集FPGA相关经验。文章做好合理的分类。旧Blog中有价值的内容会被陆续录入wiki，新的技术心得会在wiki中出现。

2. 持续维护Blog - http://www.fpganotes.com
在去除了原本作为主要内容的技术心得后，本Blog依然会正常维护。考虑添加电子类新闻的传递与评论。一方面逼自己多思考，一方面为大家传递信息。

3. 其他内容 - http://www.rickysu.com
其他非FPGA相关内容都将放到个人博客下。