Materials and Equipment

Silicon Labs offers bare die from 1 wafer and up

Wed, 16 May 2012 21:17:00 GMT

Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.

CMOS image sensor suppliers ramp up 300mm capacity

Fri, 11 May 2012 17:53:00 GMT

CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.

SATS provider Carsem begins LED packaging and test

Fri, 04 May 2012 13:19:00 GMT

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.

Micropelt raises EUR6.5M for wafer-based energy harvesting technology

Thu, 03 May 2012 21:28:00 GMT

Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.

GaN Systems collaborates with APEI to optimize power electronics packaging

Thu, 03 May 2012 20:29:00 GMT

GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes.

David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012

Thu, 03 May 2012 18:28:00 GMT

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.

What have we done for you lately?

Tue, 01 May 2012 05:00:00 GMT

This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovate, to give a few examples.

MEMS packaging growth, trends, and special requirements

Tue, 01 May 2012 05:00:00 GMT

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report "MEMS Packaging."

NXP increases pad pitch while shrinking package form factor

Tue, 24 Apr 2012 15:12:00 GMT

NXP Semiconductors released the new SOT1226 "Diamond" package using a “unique pad pitch design” to shrink the package by 25% from the prior design, with a 0.5mm pad pitch, 50% larger than typical small package designs.

EoPlex builds packaging facility in Malaysia

Tue, 24 Apr 2012 14:51:00 GMT

EoPlex Limited, a subsidiary of ASTI Holdings Limited, Singapore, will open a new factory for its xLC semiconductor package technology in Q2 2012, in Malaysia.

Toshiba builds semiconductor fab in Thailand to replace flooded fab

Tue, 24 Apr 2012 13:22:00 GMT

Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.

STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board

Mon, 23 Apr 2012 13:18:00 GMT

Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately.

Mold packaging meets metal TSV for 5-10x density of conventional substrates

Thu, 19 Apr 2012 14:17:00 GMT

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

ASMC will focus on productivity and technology challenges

Wed, 18 Apr 2012 20:13:00 GMT

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

ChipMOS expands semiconductor assembly and test services with new building in Taiwan

Mon, 16 Apr 2012 19:43:00 GMT

ChipMOS TECHNOLOGIES INC. (ChipMOS Taiwan), purchased a 393,173sq.ft. building adjacent to its existing facility in Southern Taiwan Science Park.

Advanced semiconductor packaging start-up Deca could take over SPWR fab

Mon, 16 Apr 2012 14:40:00 GMT

WLCSP start-up Deca Technologies might take over SunPower Corp.'s Fab 1, when the solar photovoltaics supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter.

Conference Report: MRS Spring 2012, Day 3

Thu, 12 Apr 2012 13:34:00 GMT

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Georgia Tech targets thin 3D packaging with new consortium

Wed, 11 Apr 2012 17:37:00 GMT

Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.

Invensas face-down die packaging replaces SODIMM

Wed, 11 Apr 2012 15:34:00 GMT

Invensas Corporation, a wholly owned subsidiary of Tessera, unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices.

Endicott Interconnect names David Van Rossum new CFO

Tue, 10 Apr 2012 14:31:00 GMT

Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.