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ST’s M24LR16E – Dual-Interface Memory Family with 16-Kbit Device Uses Energy Harvesting to Enable True Battery-Free System Design

admin — Thu, 26 Jan 2012 05:00:17 +0000

Advanced Dual-Interface Memory from STMicroelectronics Uses Energy Harvesting to Enable True Battery-Free System Design

Dual-interface memory family adds 16-Kbit device capable of powering small systems entirely from harvested RF power with no battery required

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is taking the first step to extending its family of RFID/NFC wireless memory ICs with a new 16-Kbit device that can also harvest enough energy to enable small electronic items using it to become completely battery-free electronic applications.

Energy harvesting converts energy captured from the surrounding environment into electrical energy to powering small systems. Ambient energy is available in a variety of forms, such as radio waves, waste heat, kinetic energy from movement by a user, or wind or solar energy, is freely available, and has no CO2 or other emissions. Utilizing this energy also saves designers relying on sources such as batteries or an external power supply, which can increase costs, impose size and weight restrictions, or complicate installation. Freeing equipment from power cables or any need to recharge or replace batteries, energy harvesting technology promises lower ownership costs and is gaining widespread consumer interest.

ST’s dual-interface memories, including the new 16-Kbit device, feature a low power I2C interface, as well as a 13.56-MHz ISO15693 contactless RF interface. This RF interface can harvest ambient radio waves emitted by RFID reader-writers and convert those waves into a voltage output that may be used to power other electronic components.

The energy harvesting capability of the EEPROM will enable new types of miniaturized electronics. ST has demonstrated the M24LR16E energy-harvesting wireless memory by illuminating indicator LEDs as well as by powering its battery-less STM8L-based Discovery kit.viagra Other potential applications include e-paper devices such as electronic shelf labels, as well as industrial automation, sensing and monitoring systems, and personal healthcare products.

“The pioneering M24LR16E strengthens our Dual-Interface EEPROM portfolio by providing additional memory-density options and, by offering a means to harvest energy from its environment, to enable innovative applications for smart electronics,” said Benoit Rodrigues, General Manager of ST’s Memories Division. “This new device also strengthens ST’s portfolio of green-energy solutions for innovative high-tech products, helping to improve sustainability and quality of life.”

The M24LR16E features 16Kbits of non-volatile EEPROM storage, introducing a new lower-density option alongside ST’s established 64Kbit dual-interface wireless memory, the M24LR64. ST anticipates a broad user base for these RFID/NFC-compatible devices as RFID is now widely used in supply-chain and retail businesses, and NFC technology will be included in more than 500 million mobile phones sold annually by 2015, according to figures from ABI Research.

Main features of the M24LR16E:

16-Kbit EEPROM user memory
40 years data retention, 1 million write-erase cycles
RF interface operating at 13.56MHz, compatible with
- RFID reader-writers
- ISO15693-capable NFC devices
Low-power I2C interface operating at 400 kHz
1.8V to 5.5V supply-voltage range
Vout analog output (energy harvesting)
RF status digital output

The M24LR16E is in volume production now and available in SO8, TSSOP8 or MLP8 surface-mount packages. Prices are $0.6 in SO8 and TSSOP8 and $0.66 in MLP8, for orders over 1000 pieces. Alternative pricing options may be available for higher quantities. The device may also be supplied in wafer form on request.

Further technical information:
ST’s dual-interface memories are EEPROMs that provide non-volatile storage for system parameters, data logged from external sources or program code. Each device provides an I2C serial interface as well as a wireless interface compatible with the ISO-IEC 15693 13.56MHz radio standard for RFID and ISO15693-capable NFC systems. The memory can communicate with the host system in the same way as a standard serial EEPROM, or it can be read/written directly using equipment such as an RFID reader or mobile phone. Wireless operation requires an antenna that can simply be etched on the printed circuit board.

A data protection scheme is built in, including 32-bit password protection to safeguard stored data against threats such as accidental over-writing and unauthorized access or tampering.

The new M24LR16E integrates additional power-management circuitry to make harvested energy available to other devices on the pc-board via an output pin. The nominal output voltage is between 1.7 to 2.3V, allowing the memory to supply many types of devices including low-voltage CMOS ICs.

The electrical power available to drive external devices depends on various factors, such as the RF power of the reader, the distance between the reader and the memory’s connected antenna, and the relative sizes of the reader and memory antennas. Assuming adequate RF strength, an RFID device can even be used to power multiple items of equipment placed within range. The EEPROM’s energy harvesting mode can be turned on or off, and the maximum output current set from 300µA to 6mA, by adjusting settings in an internal register.

The evaluation board ROBOT-M24LR16E-A, demonstrating energy-harvesting capabilities of the M24LR16E dual-interface EEPROM, is available from ST.

About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2010, the Company’s net revenues were $10.35 billion. Further information on ST can be found at www.st.com.

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Atmel Announces Complete Digital Audio Platform for Consumer, Automotive and Industrial Applications

admin — Wed, 23 Nov 2011 16:32:02 +0000

Atmel Launches Complete Digital Audio Platform for Consumer Applications

Offers designers a complete, easy-to-use platform including firmware, hardware and licensing agreement for audio applications

Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch technology solutions, today announced a complete Digital Audio Platform for consumer, automotive and industrial applications. The Atmel Digital Audio Platform offers audio equipment and mobile accessory OEMs (original equipment manufacturers) a complete hardware and firmware solution that greatly simplifies the task of designing high-quality digital audio equipment. The new Digital Audio Platform is implemented with the Atmel AVR® UC3 microcontrollers specifically tailored for audio applications such as smartphone and media player docking stations.

The Digital Audio Platform integrates dedicated microcontrollers, evaluation kits and firmware IP. The firmware IP includes control and streaming interfaces for a selection of popular smartphones and portable media players as well as MP3, WMA and AAC decoders to allow designers to decode compressed music files; USB protocol stacks; and a complete file system to allow designers to navigate through mass storage devices such as USB Flash disks or SD cards. The platform uses a ready-to-go commercial licensing model for firmware IP that enables designers to keep their firmware code confidential, unlike many audio license agreements today that require the firmware code to be open. The Digital Audio Platform is ideal for applications including docking stations, USB mass storage, SD card playback, car stereos, USB speakers, microphones, and various voice and music equipment. Other applications include mobile accessories (accessories connected to smartphones or tablets) that use the same underlying technology.

With all the benefits of the Atmel AVR UC3 microcontrollers, the Digital Audio Platform offers designers a system that is highest in performance and lowest in power. The AVR UC3 microcontrollers also support the Atmel QTouch® Library for easy implementation of elegant, differentiating user interfaces for capacitive touch buttons, sliders and wheels.

“Designing digital audio applications has historically been a complex, cumbersome task of finding the required firmware IP, licensing it and finally stitching it together in a working application,” said Ingar Fredriksen, sr. director of AVR products, Atmel Corporation. “The Atmel Digital Audio Platform offers an ‘out-of-the-box solution’ to enable designers to develop today’s audio applications with minimum engineering effort spent on getting the core design working.”

To help accelerate a designer’s audio application development, evaluation kits (EVK) are also available with the Digital Audio Platform. Evaluation kits include a board with an Atmel AVR MCU and free downloadable source code. The Atmel AVR EVK1104AU/1105AU audio development kits are available in the Atmel Store at http://store.atmel.com and through Atmel-qualified distributors.

Pricing and Availability
The Atmel Digital Audio Platform is available now. Pricing for 10,000-piece quantities:

Device	Pricing in USD (10K Units)
AT32UC3A0512AU-ALUT	$8.80
AT32UC3A0512AU-ALTRA	$10.37
AT32UC3A0256AU-ALUT	$7.46
AT32UC3A0128AU-ALUT	$6.07
AT32UC3A1512AU-AUR	$8.00
AT32UC3A1256AU-AUR	$6.78
AT32UC3A3256AU-ALUT	$8.74
AT32UC3B0512AU-Z2UR	$7.39
AT32UC3B0128AU-A2UT	$5.02
AT32UC3B0128AU-Z2UR	$5.48
AT32UC3C0512CAU-ALUT	$9.11

Evaluation kit pricing:
EVK1105AU: $179 USD
EVK1104AU: $169 USD

More Information
For more information about the Digital Audio Platform, please visit: www.atmel.com/audio/.
Additional information on Atmel UC3 AVR microcontrollers is available at http://www.atmel.com/uc3.

About Atmel
Atmel Corporation (Nasdaq: ATML) is a worldwide leader in the design and manufacture of microcontrollers, capacitive touch solutions, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry’s broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions focused on industrial, consumer, communications, computing and automotive markets.

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Intersil’s ISL233x5 and ISL234x5 – New Series of Single, Dual and Quad Digitally Controlled Potentiometers (DCPs) with Industry’s Lowest Supply Voltages, Power Consumption and Noise

admin — Tue, 22 Nov 2011 15:54:22 +0000

Intersil’s 256-Tap DCPs Feature Industry’s Lowest Supply Voltages and Power Consumption

Compact Packages Make the ISL233x5 and ISL234x5 Ideal for Battery Operated Equipment, Regulator Voltage Margining or Trimming Sensor Circuits

(Photo Intersil)

Intersil Corporation(NASDAQ Global Select: ISIL) has developed a new series of single, dual and quad digitally controlled potentiometers (DCPs) featuring the industry’s lowest supply voltages, power consumption and noise.

The ISL233x5 and ISL234x5 provide the most flexible and reliable solution wherever a voltage or resistor setting is needed. Supply current is as low as 2.8uA at 5V, which is 40% to 50% lower than most competitive devices. Analog supply voltage can range from 1.7V to 5.5V. The digital supply voltage may be even lower at 1.2V to 5.5V, eliminating the need for a level shifter if the MCU has low voltage digital interface outputs. Users can control the wiper position through either the I2C or SPI interface.

The ESD tolerance is a robust 6.5kV HBM, and the DCPs are offered in leaded packages for easy debugging as well as tiny microTQFN packages for space-constrained applications. Devices may be ordered with 10kOhm, 50kOhm or 100kOhm total resistances. They are designed for use as three-terminal potentiometers or as two-terminal variable resistors in portable medical instrumentation, network cards, smartphones, regulator margining and other applications requiring calibration or digital control.

Features and Specifications

Digital interface voltage range from 1.2V to 5.5V
Analog supply voltage range from 1.7V to 5.5V
The ISL233x5 has multiple address pins to allow up to four DCPs on one I2C bus, providing maximum design flexibility
The ISL234x5’s daisy-chain functionality for SPI devices allows users to link multiple DCPs on one set of I/O lines
Compact microTQFN package is 40% smaller than competitive devices

Pricing and Availability

The ISL23315/ISL23415 are available in 10-pin microTQFN and MSOP packages, with prices starting at $0.68 each in 1,000-unit quantities. The ISL23325/ISL23425 come in 14-pin or 16-pin microTQFN and TSSOP packages, priced at $0.97 each in 1,000-piece units. The ISL23345/ISL23445 are available in 20-pin QFN and TSSOP packages, priced at $1.37 each in 1,000-unit quantities.

For more information on the Single, ISL23315 (I2C) or SPI ISL23415 (SPI) visit
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23315
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23415

For more information on the ISL23325 (I2C) or ISL23425 (SPI) visit
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23325
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23425

For more information on the ISL23345 (I2C) or ISL23445 (SPI) visit
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23345
http://www.intersil.com/products/deviceinfo.asp?pn=ISL23445

About Intersil

Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors. The Company’s products address some of the fastest growing markets within the communications, computingigh-end consumer and industrial electronics markets. For more information about Intersil or to find out how to become a member of our winning team, visit the Company’s web site and career page at www.intersil.com.

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TI Introduces Sitara AM335x ARM Cortex-A8 Microprocessors

admin — Tue, 22 Nov 2011 15:25:46 +0000

TI Sitara™ AM335x ARM® Cortex™-A8 microprocessors: First single-chip solutions offering integrated industrial communication protocols to accelerate industrial designs

– Multiple, on-chip, production-ready, industrial Ethernet and fieldbus communication protocols eliminate the need for an external ASIC/FPGA and save 30 percent on BOM costs
– One scalable, low-power ARM Cortex-A8 processor platform (275 MHz to 720 MHz) for many different industrial automation applications, enabling extensive reuse
– Two new industrial hardware development tools, comprehensive software and analog signal chain solution for faster, easier time to market

(Photo TI)

Developers looking to ease and accelerate their industrial automation designs can now benefit from the industry’s first ARM® Cortex™-A8 system solution with multiple integrated industrial communication protocols, offered by Texas Instruments Incorporated (TI) (NYSE: TXN – News). The Sitara™ AM335x ARM Cortex-A8 microprocessors, launched last month, deliver power dissipation levels below 7mW, along with two industrial automation hardware development tools, complete software and analog signal chain complement to provide a total industrial automation system solution. Using this solution, developers can get to market faster with industrial automation designs, including input/output (I/O) devices, human machine interfaces (HMIs) and programmable logic controllers (PLCs).

On-chip industrial peripherals and communication protocols offer 30 percent BOM reduction

Perfect for industrial automation designs, the AM335x ARM Cortex-A8 microprocessors include a programmable real-time unit (PRU) on-chip interface to enable real-time industrial communications capability (master and slave) to support popular protocols, such as EtherCAT®, Ethernet/IP, PROFIBUS®, PROFINET®, POWERLINK and SERCOS III. This unique PRU + ARM architecture in the AM335x ARM microprocessors eliminates the need for an external ASIC or FPGA to reduce system complexity and save on bill of materials (BOM) costs by more than 30 percent. The AM335x ARM microprocessors also include other key, on-chip industrial peripherals — CAN, ADC, USB + PHY and two-port Gigabit Ethernet with IEEE1588 — to enable fast network connectivity and rapid data throughput, as well as connection to sensors, actuators and motor control.

One scalable platform for many different end equipments

Designers can take advantage of the pin-to-pin and software compatibility of the AM335x ARM Cortex-A8 microprocessors and design several end equipments with the devices that best fit their industrial automation need, such as:

Drives and I/O-level devices: Specifically targeted to enable sensors, actuators, motor drives, communications modules and gateways needing industrial slave communications, the AM3356 and AM3357 ARM microprocessors offer a low-performance 275 MHz solution. These two devices do not require an external memory or an operating system making the system solution simple and compact.
Industrial PLC applications: Offering high performance of up to 720 MHz, the AM3356 and AM3357 ARM microprocessors are well suited for high-performance PLC applications that need to control various I/O devices in an automation system such as electric motors, pneumatic or hydraulic cylinders, magnetic relays solenoids and more.
HMI products: Ideal for designing HMI products, the AM3354, AM3358 and AM3359 ARM microprocessors offer an on-chip 3D graphics accelerator, which combined with the integrated touch screen controller, enables rich and intuitive graphical user touch screen interfaces. For HMI applications not requiring integrated industrial communications, the AM3354 and AM3352 and ARM microprocessors offer lower cost options.

Get to market quickly with two industrial development tools and complete software

Accompanying the AM335x ARM microprocessors are two industrial hardware development tools to enable customers to easily incorporate industrial communication standards in their industrial automation designs:

AM3359 Industrial development kit (IDK) from TI is an extensive development tool enabling customers to evaluate all popular industrial communications and motor control applications. The AM3359 IDK has many different evaluation features such as 512 MB of DDR2 memory, dual motor drivers, digital I/O, a C2000™ Piccolo microcontroller with integrated analog to digital converters, a Stellaris® ARM Cortex-M3 microcontroller, USB, Ethernet, SPI, I2C and much more. The AM3359 IDK is $895 and available for order today.
AM3359 Industrial communications engine (ICE) from TI is a pocket-sized, cost-optimized and form-factor optimized hardware tool for I/O devices and sensors needing to add industrial communications quickly and easily. The AM3359 ICE is $99 and available for order today.

Designers can also utilize the AM335x evaluation module for $995 to begin development. Further easing development is a software development kit (SDK) with free, production-ready, certified software for industrial automation, supporting Linux, Android and Windows Embedded Compact 7 for high-end applications. For low-end applications, the SDK contains the ultra-compact, real-time SYS/BIOS operating system. The SDK also includes support for popular industrial communications protocols, industrial automation design demos, applications notes and videos.

TI offers the ability to complete an entire system design with TI analog ICs, including industrial Ethernet and isolated CAN transceivers, motor drivers, temperature sensors and power management devices, plus wireless connectivity options to complement the Sitara AM335x ARM microprocessors.

About Texas Instruments

Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be — smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do — from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

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NXP’s BC69PA – Industry’s First Medium Power Transistors in a 2-mm x 2-mm 3-Pin Leadless DFN Package

admin — Mon, 21 Nov 2011 23:08:27 +0000

NXP Launches Industry’s First Medium Power Transistors in 2×2-mm Leadless DFN Package

Ultra-small transistor delivers unrivalled performance while saving PCB space

(Photo NXP)

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor.

Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps. When mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows Ptot levels of up to 1.1 W in a tiny footprint. Driven by miniaturization in chip design, NXP’s ultra-compact medium power transistors offer design engineers a flexible power transistor solution for designs focusing on space saving, energy efficiency, and low heat dissipation. All NXP medium power transistors are automotive-qualified according to AEC-Q101.

“With our latest miniaturized medium power transistor, we continue to drive the market in compact components and in high performance low VCEsat transistors. NXP is the first vendor to offer such a broadly differentiated choice of transistors in a tiny 2-mm x 2-mm 3-pin package, significantly expanding design options for engineers,” said Joachim Stange, product manager, NXP Semiconductors. “In charging circuits of mobile devices, tablet PCs and automotive electronics requiring smaller ICs, designers can now choose a medium power solution and not have to trade off PCB space for functionality. Simple applications such as interior car lighting which require only 1-2 Watts can be powered by an ultra-compact medium power solution.”

Key Features of NXP Medium Power Transistors

High current in a small leadless package with medium power capability
Exposed heat sink for excellent thermal and electrical performance
VCEO ranging from 20 V to 80 V
High collector current capability IC (up to 2A) and ICM (up to 3A)
Automotive AEC Q101 qualified

Pricing and Availability

The new medium power transistors are available now. Pricing in high volume starts at USD $0.10.

Offering greater power management through energy efficiency, easier circuit design and reduced component costs, NXP’s portfolio of low, medium and high-voltage transistors is ideally suited to any powered application. NXP’s small-signal bipolar transistors include its Low VCEsat BISS (Breakthrough In Small Signal) transistor range, its space- and cost-saving resistor-equipped transistors, plus a host of RF wideband transistor options.

Links

NXP medium power transistors
Download the line card for medium power general-purpose transistors from NXP: http://www.nxp.com/documents/line_card/75017209.pdf

About NXP

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com

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SMSC’s LAN9730 – Industry’s First Fully Integrated Hi-Speed Inter-Chip (HSIC) USB 2.0 to-10/100 Ethernet Device

admin — Mon, 21 Nov 2011 22:49:13 +0000

SMSC Launches Industry’s First, Hi-Speed Inter-Chip USB 2.0 to 10/100 Ethernet Controller for Low Power Applications

SMSC’s Patented Interconnect Technology Provides Link for SoCs & Peripherals Via On-Board USB

(Photo: SMSC)

SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems, today introduced its LAN9730, the industry’s first fully integrated Hi-Speed Inter-Chip (HSIC) USB 2.0 to-10/100 Ethernet device. The LAN9730 device was designed to deliver power consumption viagra bill of material savings to OEM and ODM designers of a wide range of embedded systems and consumer electronics devices.

HSIC, which incorporates SMSC’s patented Inter-Chip Connectivity™ (ICC) technology, enables the USB 2.0 protocol, which is now standard in billions of electronic devices, to be delivered over short distances while retaining 100 percent software compatibility with an analog USB 2.0 connection. AMD and Samsung have recently joined NVIDIA, Qualcomm and others in licensing ICC from SMSC to enable HSIC communication from their portable System-on-a-Chip (SoCs) to peripheral USB 2.0 devices. HSIC has been adopted as part of the USB 2.0 standard and dramatically decreases power consumption in applications such as battery-powered portable devices requiring an Ethernet port. The LAN9730 offers an integrated 10/100 physical layer and multiple power management enhancements, including Magic Packet and Link Status Change as well as “Wake on LAN” mode, which allows systems to enter a low power state and wake on desired network traffic, thereby conserving resources during downtimes.

“Performance, flexibility in design and power savings are all critical design elements inherent in SMSC’s line of networking solutions,” said Rolf Mahler, Vice President and General Manager of SMSC’s Networking Solutions group. “For embedded and consumer applications, this device can leverage our patented ICC technology to reduce power consumption and silicon area compared to a standard analog USB 2.0 interface.”

The latest in SMSC’s growing family of USB-to-Ethernet solutions, the new LAN9730 is compliant with USB specification 1.1 and 2.0 as well as IEEE 802.3/802.3u Ethernet standards. Additionally the LAN9730 needs only a single 25MHz crystal to drive both the USB and Ethernet PHYs, thereby reducing developer BOM cost.

SMSC’s integrated USB-based networking solution provides added flexibility for the routing and placement of network connections anywhere in the developer’s system. Additionally, the LAN9730 supports a wide range of drivers for the most recent versions of Windows®, Mac® and Linux® operating systems. The LAN9730 is ideal for applications such as battery-powered portable devices that also require Ethernet connectivity.

The LAN9730 is available in a small form factor 8x8mm 56-pin QFN package, which is lead-free and RoHS compliant. It is available in both commercial (0 to 70 degree Celsius) and industrial (-40 to +85 degree Celsius) temperature ranges. Qualification samples and evaluation kits are available now with mass production slated for the end of January 2012.

About SMSC

SMSC is a leading developer of Smart Mixed-Signal Connectivity™ solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. SMSC’s feature-rich products drive a number of industry standards and include USB, MOST® automotive networking, Kleer® and JukeBlox® wireless audio, embedded system control and analog solutions, including thermal management and RightTouch® capacitive sensing. SMSC is headquartered in New York and has offices and research facilities in North America, Asia, Europe and India. Additional information is available at http://www.smsc.com.

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TI’s ADS5294 – Industry’s Best Noise Performance and Lowest Power Octal-Channel, 14-bit ADC at 80 MSPS

admin — Fri, 18 Nov 2011 16:02:35 +0000

TI offers best noise performance and lowest power in 14-bit, 8-channel ADC at 80 MSPS for medical imaging applications

(Photo: Texas Instruments)

Texas Instruments Incorporated (TI) (NYSE: TXN) introduced the industry’s best noise performance and lowest power octal-channel, 14-bit analog-to-digital converter (ADC) at 80 MSPS. The ADS5294 meets designers’ needs for power-efficient, cost-effective designs by delivering a best-in-class signal-to-noise ratio (SNR) of 75.5 dBFS at 5 MHz and a sampling frequency of up to 80 MSPS. Along with high performance and lowest power consumption of 77 mW per channel at 80 MSPS, ADS5294 also integrates a digital processing block, a low-frequency noise suppression mode and programmable input-to-output mapping. All these features allow system designers to integrate more functions in a smaller footprint, resulting in more compact medical imaging systems. For information, samples and evaluation modules (EVMs) visit www.ti.com/ads5294-pr.

Key features and benefits

Leading noise and power performance: The ADS5294 provides best-in-class SNR and enables designers of high-density applications to increase channel count without increasing power.
- 75.5 dBFS SNR at 5 MHz/80 MSPS
- 78.2 dBFS SNR at 5 MHz and decimation filter enabled
- 84 dBc SFDR at 5 MHz/80 MSPS
- 77 mW per channel at 80 MSPS (two LVDS wires per channel)
- Low-frequency noise suppression mode.
Digital processing block that integrates several commonly used system functions such as two- or four-channel averaging and decimation by two, four or eight filters.
The digital processing block can be used to significantly improve SNR and filter harmonics, while reducing output data rate for narrow-band applications.
Two-wire LVDS interface: Using the ADS5294, digital data can be output over one or two wires of LVDS pins per channel reducing the number of interface lines. This creates a two-wire interface which keeps the serial data rate low allowing designers to use low cost FPGAs.
In addition to medical imaging systems, the ADS5294 brings the same benefits to radar, communications, test and measurement and other multi-channel data acquisition applications.

Availability, packaging and pricing

The ADS5294 is available now in a 12-mm x 12-mm, 80-pin QFP package. The ADS5294 is priced at $84 in quantities of 1,000.

Tools and support

To provide a flexible environment for testing the ADS5294 under a variety of conditions, an evaluation module (EVM) is available. The ADS5294 EVM is priced at $299 and can be found at www.ti.com/ads5294evm-pr.

An IBIS model to verify board signal integrity requirements is available at www.ti.com/ads5294model-pr.

Highly optimized analog products and full portfolio for medical applications

The ADS5294 is the latest addition to TI’s extensive portfolio of highly optimized analog products for medical imaging systems and other medical applications including:

Ultrasound: The AFE58xx family of analog front ends for ultrasound applications with the AFE5801 and AFE5851 for handheld systems, the AFE5805 and AFE5804 for portable to mid-range systems, and the AFE5807 and AFE5808 for high-end ultrasound systems, all complemented on the transmit side by TI’s TX810 T/R switch.
ECG/EEG: The ADS1298 family of analog front ends bringing lowest power and highest integration to electrocardiogram (ECG), electroencephalogram (EEG) and other patient monitoring applications.

TI’s full portfolio of semiconductor products for medical applications includes embedded processors, such as DSPs and MCUs, plus a full range of analog signal chain, power management and wireless connectivity solutions, which allow manufacturers to bring innovative medical electronics to market faster.

Find out more about the ADS5294 and TI products for medical imaging:

Download the datasheet and order ADS5294 evaluation modules and samples at www.ti.com/ads5294-pr.
The ADS5294 is also joined by the ADS5292, an octal-channel, 12-bit, 80 MSPS ADC.
View TI’s medical imaging website for system block diagrams and to explore TI’s full portfolio for medical imaging applications like ultrasound, CT scanners and MRI machines: www.ti.com/medicalimaging.
Download TI’s Medical Imaging Applications Guide: www.ti.com/imagingguidepdf-pr.
Learn more about TI’s offering for Medical applications at www.ti.com/medical.

About Texas Instruments

Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

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ST’s ST33TPM12LPC – First TPM with 32-Bit Secure Processor

admin — Fri, 18 Nov 2011 15:41:25 +0000

STMicroelectronics Unveils Highest Performing Secure Processor for Advanced Computer Security

Breakthrough 32-bit Trusted Platform Module (TPM) system-on-chip supports next-generation TCG standards for attack-resistant trusted computer hardware

(Photo: STMicroelectronics)

STMicroelectronics (NYSE: STM – News), a global semiconductor leader serving customers across the spectrum of electronics applications, and the provider of Trusted Platform Modules (TPMs) to all major PC OEMs, has revealed the industry’s highest performing TPM enabling significantly stronger security and trust for activities like e-commerce and cloud-computing services.

As part of the Trusted Computing ecosystem, the TPM is a highly secure processor mounted on the computer motherboard to protect against threats such as software attacks or theft and tampering. It guards sensitive data such as keys, passwords and digital certificates, and provides trustworthy reports of system integrity. According to the Trusted Computing Group (TCG), the industry alliance promoting Trusted Computing technology, almost all enterprise PCs, servers and various embedded systems now have a TPM inside.

ST’s ST33TPM12LPC increases the strength of this hardware-based security as the first TPM to feature a 32-bit secure processor, surpassing existing standalone implementations. This allows the device to handle advanced cryptography algorithms and be ready to support the next-generation TPM 2.0 standard. The ST33TPM12LPC will not only achieve functional certification but also Common Criteria security certifications based on the TPM 1.2 latest Protection Profile at EAL4+ level thus fully complying with TPM Certification Program defined by the TCG.

In addition, ST will be proposing derived versions with other communication interfaces such as I2C and SPI to enable a range of devices besides desktops, notebooks, servers and network equipment to perform as trusted hardware. These include printers, copiers, mobile phones, tablets, home gateways, appliances, smart meters, industrial controls and automotive electronics.

The release of the ST33TPM12LPC is another demonstration of ST’s leading position in advanced process technology and security expertise. “ST is clearly committed to bringing today’s most powerful and compliant Trusted Platform Module not only to the PC industry but also to a virtually unlimited number of connected platforms,” said Marie-France Florentin , General Manager, Secure Microcontrollers Division at STMicroelectronics. “With ST having successfully supported TCG technology for years, this new product highlights our ability to take the lead and capitalize on our know-how and assets.”

The NIST (National Institute of Standards and Technology) promotes best practice in using the SHA-256 (Secure Hashing Algorithm version 2, 256Bit) algorithm. However, to date, the adoption in commercial markets has been much slower than originally anticipated. “The decision to use this algorithm within the TPM Root Certificate supports the longer term needs of tomorrow’s trustworthy computing environments and offers real value to users today in being able to meet the NIST requirements and accelerate the replacement of ageing SHA1 implementations”, said Steve Roylance , Business Development Director for GlobalSign Ltd, the certificate authority chosen by ST to certify the Endorsement Key within the TPM. “GlobalSign’s TPM Root certificate authority is one of a family of 2048bit RSA SHA -256 Certificates. Other roots have already been adopted by web browsers and operating system providers in a bid to push forward the NIST recommendations.”

Major features of ST33TPM12LPC:

ARM® SC300 32-bit secure processor capable of supporting:
SHA1 and SHA2 hash algorithms
AES
Ready for next generation TPM 2.0
Embedded EK certificate root certified by independent Certification Authority (GlobalSign)
Embedded 90nm non-volatile memory
Low Pin-Count (LPC) interface

Samples of the ST33TPM12LPC are available in the TCG-recommended TSSOP28 4.4mm surface-mount package or a leadless QFN32 5 x 5mm lead-free Ecopack option. The ST33TPM12LPC will be in volume production in Q1 2012.

Please contact your ST sales office for pricing options and sample requests.

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2010, the Company’s net revenues were $10.35 billion . Further information on ST can be found at www.st.com.

About GlobalSign

GlobalSign was established in 1996 and is a WebTrust accredited public certificate authority. As part of the GMO Internet Group, GlobalSign offers publicly trusted SSL Certificates, EV SSL, Managed SSL Services, S/MIME email security and Code Signing for use on all platforms including mobile devices. Its Trusted Root solution uses the widely embedded GlobalSign Root CA certificates to provide immediate PKI trust for Microsoft Certificate Services and internal PKI, eliminating the costs of using untrusted Root Certificates. Its partnership with Adobe to provide Certified Document Services (CDS) enables secure digitally signed PDF documents, certified transcripts and e-invoices. These core Digital Certificate solutions allow its thousands of authenticated customers to conduct secure online transactions, data transfer, distribution of tamper-proof code, and protection of online identities for secure email and access control. The company has a history of innovation within the online security industry and has offices in the US, UK, Belgium , Japan , and China .

www.globalsign.com

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Home Health Hub (HHH) Reference Platform Based on Freescale’s i.MX28 – Solution for Telehealth Applications

admin — Wed, 16 Nov 2011 01:17:53 +0000

Freescale Introduces ‘Home Health Hub’ Solution for Telehealth Applications

Comprehensive reference platform helps accelerate development of medical devices with seamless connectivity and data aggregation capabilities

Photo from Freescale

Freescale Semiconductor (NYSE: FSL – News) today introduced a home health hub (HHH) reference platform to help medical equipment manufacturers quickly and easily create remote-access devices that can collect, connect and securely share health data for improved healthcare management.

The HHH reference platform is based on Freescale’s i.MX28 applications processor and ZigBee® and sub-1 GHz transceivers. It enables secure WiFi and Ethernet connectivity to remote devices with displays, such as tablets, smartphones or PCs with medical-specific remote user interface (UI) options. The platform also can provide wired and wireless connectivity to end healthcare devices, such as blood pressure monitors, blood glucometers, weight scales, pulse oximeters and more via ZigBee, sub-1 GHz, USB, Bluetooth and Bluetooth Low Energy including medical-class-specific device profiles.

According to the World Health Organization, there are 860 million chronic disease patients worldwide, and 75 to 85 percent of all healthcare spending can be attributed to chronic disease management. Many of those who suffer from chronic diseases are 65 years or older – a demographic that the U.S. Census Bureau estimates will represent 19 percent of the U.S. population, or about 72.1 million individuals, by 2030.

Societies around the world continue to look for ways to reduce health care costs for these chronic patients while improving their quality of life. Remote patient monitoring devices can be made based on Freescale’s home health hub reference platform and can allow patients to avoid unnecessary emergency room visits which both saves money and helps improve patient outcomes.

“The changing dynamics of the aging global population are creating an increased demand for new technologies and tools that can offer peace of mind to the family members of seniors living at home,” said Steven Dean, manager of Freescale’s Global Healthcare team. “There’s also a need to provide access to healthcare in remote and growing regions of the world to improve the quality of life for millions of people. Our new home health hub reference platform is designed to simplify development of connected medical devices and help our customers more easily address these growing needs.”

Freescale’s HHH reference platform provides comprehensive functionality and can be used as the foundation for connected medical product designs, giving developers a head-start to help them get to market faster. The Freescale HHH reference platform delivers a hardware implementation and the necessary software components to provide pre-validated, secure connectivity for healthcare devices and user interfaces.

“We have proven technology out there to monitor patients and connect their data to the cellular network, such that a healthcare professional could intervene instead of the patient having to go to the emergency room,” said Kent Dicks, founder and CEO of MedApps. “We’ve found this to be extremely effective.”

The HHH reference platform software adheres to Continua device profiles to provide consistency and compatibility with other Continua-certified medical devices such as blood pressure monitors, pulse oximeters and weight scales. The platform also enables connection to the Microsoft HealthVault, a privacy- and security-enhanced online data repository that lets users organize, store and share their health information.

The HHH reference platform consists of an aggregator/gateway board based on the low-power i.MX28 applications processor (built on the ARM9™ processor) running various connectivity interfaces to healthcare end devices and wireless or wired connectivity for a remote user interface. Also included is a panic alarm sensor based on Freescale’s MC12311 sub-1 GHz radio, providing personal emergency response system (PERS) functionality. To complete the reference platform, software such as board support packages (Linux® and Windows® Embedded Compact 7) and example code are included.

“If you think about all of the different devices in a healthcare ecosystem, Windows Embedded allows our partners to align on one trusted technology platform,” said Lorraine Bardeen, marketing director for Windows Embedded EMEA at Microsoft. “This collaboration with Freescale builds upon Microsoft’s vision for the evolution of intelligent systems by helping medical manufacturers and healthcare organizations capture the full potential of connected medical data.”

Pricing and availability

The HHH reference platform consists of the aggregator/gateway board, panic alarm sensor, quick start guide, cables and software. Freescale has partnered with Digi International to bring the HHH reference platform to market. The iDigi Telehealth Application Kit is available for purchase through Digi International for $499 (USD) at www.digi.com/hhh. Digi has extensive experience with the i.MX portfolio and provides customized system on module and design services. For more information, visit www.freescale.com/homehealthhub.

“Network connected medical devices improve quality of care by providing real-time access to critical patient data,” said Frederic Luu, VP of Sales and Marketing, EMEA, Japan and Asia, Digi International. “We are excited to partner with Freescale to make it easier for medical device manufacturers to develop network-enabled products.”

About Freescale

Freescale (NYSE:FSL – News) is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial and networking markets. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. http://www.freescale.com/

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ST’s FLI75xx – Industry’s First TV SoC

admin — Fri, 11 Nov 2011 16:46:30 +0000

STMicroelectronics Announces Industry’s First TV System on Chip to Complete Irdeto Security Certification

Delivers a fully integrated conditional access security framework needed for accessing premium content, while reducing cost and system complexity

(Photo: STMicroelectronics )

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a world leader in developing and delivering System-on-Chip (SoC) ICs, today announced the Freeman Premier family of TV System on Chip devices has been certified for Security Application by Irdeto, a global software security and media technology company.

This certification means a TV using the Freeman product has the level of security required to access premium content protected by the Irdeto Conditional Access System (CAS) without the need for an external device or conditional access module. Irdeto CAS support is part of the security capabilities of Freeman product family that also offers robust and hardened implementation of mainstream DRMs and CI+ features.

“As TVs become more powerful and have more ways to access movies and games, content providers become more concerned with protecting their digital media”, said Luigi Mantellassi, General Manager of ST’s WAVE TV division. “ST has been working with Irdeto for many years with our set-top box ICs. By integrating the same robust security mechanism into the Freeman product, now TV manufacturers can satisfy the content provider needs and offer consumers more choices for entertainment, conveniently and directly on their TVs.”

“As a long-standing technology partner, we applaud ST for achieving this latest certification and continuing to design their products to keep premium content safe for operators and available for consumers to enjoy,” said David W. Jones, Sr. Director of Partners and Alliances at Irdeto.

Freeman Premier is part of the Freeman product family, a proven range of TV SoCs, offering scalable performance, software compatibility, and access to connected services. Freeman Premier is a single-chip for 120 Hz TVs, incorporating Motion-Corrected Temporal Interpolation (MCTi) Faroudja technology, delivering an outstanding 3DTV experience.

The certified Freeman ICs include FLI7510, FLI7512, FLI7515 and FLI7525, available in volume now, and ready to deploy worldwide with content providers using Irdeto Conditional Access.

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