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    <title>MEMS Applications</title>
    <link>http://www.electroiq.com</link>
    <description />
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      <title>Knowles tops 3B MEMS microphones shipped</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/knowles-tops-3b-mems-microphones-shipped.html</link>
      <description>&lt;p&gt;Knowles, micro acoustics and MEMS microphone maker, has shipped over 3 billion SiSonic MEMS microphones from the SiSonic MEMS microphone introduction in 2003.&lt;/p&gt;</description>
      <pubDate>Wed, 16 May 2012 19:28:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/knowles-tops-3b-mems-microphones-shipped.html</guid>
      <dc:date>2012-05-16T19:28:00Z</dc:date>
    </item>
    <item>
      <title>DRIE expands from MEMS to advanced packaging and more applications</title>
      <link>http://www.electroiq.com/articles/ap/2012/05/drie-expands-from-mems-to-advanced-packaging-and-more-applications.html</link>
      <description>&lt;p&gt;&#x201c;From 2011 to 2017, the number of DRIE-processed wafers will jump from 5.4M to more than 27M (all wafer sizes). This is &amp;gt;30% CAGR&#x201d;, explains Dr Eric Mounier, Yole Développement.&lt;/p&gt;</description>
      <pubDate>Tue, 15 May 2012 19:52:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/ap/2012/05/drie-expands-from-mems-to-advanced-packaging-and-more-applications.html</guid>
      <dc:date>2012-05-15T19:52:00Z</dc:date>
    </item>
    <item>
      <title>MEMS microphones shrink to grow market share</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/mems-microphones-shrink-to-grow-market-share.html</link>
      <description>&lt;p&gt;TechNavio predicts 22% CAGR for MEMS microphones from 2011 to 2015, mainly due to the shrinking form factor of these devices. MEMS microphones are gaining acceptance in a new field: healthcare electronics.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 14 May 2012 17:35:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/mems-microphones-shrink-to-grow-market-share.html</guid>
      <dc:date>2012-05-14T17:35:00Z</dc:date>
    </item>
    <item>
      <title>IDT eliminates crystals in high-performance MEMS oscillators</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/idt-eliminates-crystals-in-high-performance-mems-oscillators.html</link>
      <description>&lt;p&gt;Integrated Device Technology, Inc. (IDT), introduced a piezoelectric MEMS resonator technology that does not use crystals. IDT has branded the components CrystalFree pMEMS (piezoelectric MEMS).&lt;/p&gt;</description>
      <pubDate>Fri, 11 May 2012 19:59:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/idt-eliminates-crystals-in-high-performance-mems-oscillators.html</guid>
      <dc:date>2012-05-11T19:59:00Z</dc:date>
    </item>
    <item>
      <title>Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/sensory-swarms-and-mems-roadmaps-on-docket-at-meptec-mems-technology-symposium.html</link>
      <description>&lt;p&gt;MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover &#x201c;sensory swarms&#x201d; and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.&lt;/p&gt;</description>
      <pubDate>Thu, 10 May 2012 18:04:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/sensory-swarms-and-mems-roadmaps-on-docket-at-meptec-mems-technology-symposium.html</guid>
      <dc:date>2012-05-10T18:04:00Z</dc:date>
    </item>
    <item>
      <title>SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support</title>
      <link>http://www.electroiq.com/articles/sst/2012/04/semi-lauds-congressman-dave-camp-for-microelectronics-photovoltaics-support.html</link>
      <description>&lt;p&gt;SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.&lt;/p&gt;</description>
      <pubDate>Wed, 09 May 2012 18:36:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/2012/04/semi-lauds-congressman-dave-camp-for-microelectronics-photovoltaics-support.html</guid>
      <dc:date>2012-05-09T18:36:00Z</dc:date>
    </item>
    <item>
      <title>ST&#x2019;s MEMS revenues jump 82% in 2011, but TI holds onto #1 spot</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/st-mems-revenues-jump-82-ti-holds-1-spot.html</link>
      <description>&lt;p&gt;The top 3 MEMS manufacturers by revenue -- Texas Instruments, Hewlett Packard, and Bosch -- fought for market share in 2011, but #4, STMicroelectronics, experienced the biggest revenue jump year-to-year.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Wed, 09 May 2012 13:09:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/st-mems-revenues-jump-82-ti-holds-1-spot.html</guid>
      <dc:date>2012-05-09T13:09:00Z</dc:date>
    </item>
    <item>
      <title>NASA funds Phase II of MEMS-based exoplanet imaging improvement project</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/nasa-funds-phase-ii-of-mems-based-exoplanet-imaging-improvement-project.html</link>
      <description>&lt;p&gt;Boston Micromachines Corporation won a Phase II contract for $750,000 from NASA's SBIR to support its Exoplanet Exploration program. Phase II covers reliability in the harsh environment of space.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 07 May 2012 19:50:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/nasa-funds-phase-ii-of-mems-based-exoplanet-imaging-improvement-project.html</guid>
      <dc:date>2012-05-07T19:50:00Z</dc:date>
    </item>
    <item>
      <title>Micropelt raises EUR6.5M for wafer-based energy harvesting technology</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/micropelt-raises-eur6m-for-energy-harvesting-technology.html</link>
      <description>&lt;p&gt;Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.&lt;/p&gt;</description>
      <pubDate>Thu, 03 May 2012 21:28:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/micropelt-raises-eur6m-for-energy-harvesting-technology.html</guid>
      <dc:date>2012-05-03T21:28:00Z</dc:date>
    </item>
    <item>
      <title>ST brings MEMS microphones to distant-speech research project</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/st-brings-mems-microphones-to-distant-speech-research-project.html</link>
      <description>&lt;p&gt;STMicroelectronics will bring its MEMS microphone and audio processing expertise to the European research project, Distant Speech Interaction for Robust Home Applications (DIRHA).&lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 19:30:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/st-brings-mems-microphones-to-distant-speech-research-project.html</guid>
      <dc:date>2012-05-02T19:30:00Z</dc:date>
    </item>
    <item>
      <title>Top 50 &#x201c;internet of things&#x201d; applications</title>
      <link>http://www.electroiq.com/articles/sst/2012/05/top-50-internet-of-things-applications.html</link>
      <description>&lt;p&gt;Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and &#x201c;internet of things&#x201d; applications. &lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 14:10:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/2012/05/top-50-internet-of-things-applications.html</guid>
      <dc:date>2012-05-02T14:10:00Z</dc:date>
    </item>
    <item>
      <title>SensorsCon highlights</title>
      <link>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/columns/mems/sensorscon-highlights.html</link>
      <description>&lt;p&gt;&lt;i&gt;SensorsCon 2012 was held March 21 at the Santa Clara TechMart Center, in conjunction with the annual meeting of the International Society for Quality Electronic Design (ISQED).&lt;/i&gt;&lt;/p&gt;</description>
      <pubDate>Tue, 01 May 2012 05:00:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/columns/mems/sensorscon-highlights.html</guid>
      <dc:date>2012-05-01T05:00:00Z</dc:date>
    </item>
    <item>
      <title>What have we done for you lately?</title>
      <link>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/columns/industry-forum/what-have-we-done.html</link>
      <description>&lt;p&gt;This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovate, to give a few examples.&lt;/p&gt;</description>
      <pubDate>Tue, 01 May 2012 05:00:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/columns/industry-forum/what-have-we-done.html</guid>
      <dc:date>2012-05-01T05:00:00Z</dc:date>
    </item>
    <item>
      <title>Intel 22nm trigate transistor process chosen for next-gen Netronome flow processors</title>
      <link>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/departments/news/intel-22nm-trigate-transistor.html</link>
      <description>&lt;p&gt;Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel's 22nm tri-gate transistor architecture.&lt;/p&gt;</description>
      <pubDate>Tue, 01 May 2012 05:00:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/departments/news/intel-22nm-trigate-transistor.html</guid>
      <dc:date>2012-05-01T05:00:00Z</dc:date>
    </item>
    <item>
      <title>MEMS packaging growth, trends, and special requirements</title>
      <link>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/departments/news/mems-packaging-growth-trends.html</link>
      <description>&lt;p&gt;The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report &amp;quot;MEMS Packaging.&amp;quot;&lt;/p&gt;</description>
      <pubDate>Tue, 01 May 2012 05:00:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/departments/news/mems-packaging-growth-trends.html</guid>
      <dc:date>2012-05-01T05:00:00Z</dc:date>
    </item>
    <item>
      <title>SST Book Review: Energy Harvesting for Autonomous Systems</title>
      <link>http://www.electroiq.com/articles/sst/2012/04/book-review-energy-harvesting-for-autonomous-systems.html</link>
      <description>&lt;p&gt;Contributing editor Steve Groothuis reviews a book titled &#x201c;Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).&#x201d; The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices.&amp;nbsp; &lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 30 Apr 2012 20:16:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/2012/04/book-review-energy-harvesting-for-autonomous-systems.html</guid>
      <dc:date>2012-04-30T20:16:00Z</dc:date>
    </item>
    <item>
      <title>4 billion MEMS sensors to enable augmented reality location services by 2016</title>
      <link>http://www.electroiq.com/articles/stm/2012/04/4-billion-mems-sensors-to-enable-augmented-reality-location-services-by-2016.html</link>
      <description>&lt;p&gt;Mobile augmented reality and location-based services will be powered by more than 4 billion MEMS sensor devices by 2016, reports Juniper Research. However, unit prices for MEMS devices are declining rapidly, reaching a lowest possible price point over the medium term in the next few years.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 30 Apr 2012 19:41:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/04/4-billion-mems-sensors-to-enable-augmented-reality-location-services-by-2016.html</guid>
      <dc:date>2012-04-30T19:41:00Z</dc:date>
    </item>
    <item>
      <title>100 millionth MEMS device ships from SiTime</title>
      <link>http://www.electroiq.com/articles/stm/2012/04/100-millionth-mems-device-ships-from-sitime.html</link>
      <description>&lt;p&gt;SiTime Corporation has shipped 100 million units of its MEMS devices, including oscillators, clock generators and resonators.&lt;/p&gt;</description>
      <pubDate>Mon, 30 Apr 2012 16:57:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/04/100-millionth-mems-device-ships-from-sitime.html</guid>
      <dc:date>2012-04-30T16:57:00Z</dc:date>
    </item>
    <item>
      <title>Audio Pixels moves to OTCQX as ADPXY</title>
      <link>http://www.electroiq.com/articles/stm/2012/04/audio-pixels-moves-to-otcqx-as-adpxy.html</link>
      <description>&lt;p&gt;Merriman Capital, Inc. will serve as the Principal American Liaison for Audio Pixels Holdings Limited (OTCQX:ADPXY, ASX) as it is now trading on the OTC market's highest tier, OTCQX.&lt;/p&gt;</description>
      <pubDate>Tue, 24 Apr 2012 19:44:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/04/audio-pixels-moves-to-otcqx-as-adpxy.html</guid>
      <dc:date>2012-04-24T19:44:00Z</dc:date>
    </item>
    <item>
      <title>Telcordia qualifies MEMSCAP MEMS VOA to 2 passive optical component standards</title>
      <link>http://www.electroiq.com/articles/stm/2012/04/telcordia-qualifies-memscap-mems-voa-to-2-passive-optical-component-standards.html</link>
      <description>&lt;p&gt;MEMSCAP qualified its high-voltage electrostatic MEMS variable optical attenuator (VOA) with Telcordia standards GR-1209 and GR-1221 for passive optical components.&lt;/p&gt;</description>
      <pubDate>Fri, 20 Apr 2012 20:32:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/04/telcordia-qualifies-memscap-mems-voa-to-2-passive-optical-component-standards.html</guid>
      <dc:date>2012-04-20T20:32:00Z</dc:date>
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