MEMS Packaging and Testing

Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium

Thu, 10 May 2012 18:04:00 GMT

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.

SWS Inertial Sensor Development Platform evaluates MEMS behavior, performance

Tue, 08 May 2012 21:22:00 GMT

Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.

Audio Precision uncrates PDM interface for MEMS microphone test

Wed, 02 May 2012 18:47:00 GMT

Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.

What have we done for you lately?

Tue, 01 May 2012 05:00:00 GMT

This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovate, to give a few examples.

SST Book Review: Energy Harvesting for Autonomous Systems

Mon, 30 Apr 2012 20:16:00 GMT

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices.

CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency

Thu, 26 Apr 2012 19:55:00 GMT

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

Metrology tool offers economical price point with high accuracy

Mon, 23 Apr 2012 19:40:00 GMT

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

Mold packaging meets metal TSV for 5-10x density of conventional substrates

Thu, 19 Apr 2012 14:17:00 GMT

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

MEMS and microelectronics undergo contactless delamination tests at Georgia Tech

Fri, 13 Apr 2012 20:30:00 GMT

Conference Report: MRS Spring 2012, Day 4

Fri, 13 Apr 2012 19:10:00 GMT

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta₂O₅ memristors, redox flow batteries, graphene, and more.

Conference Report: MRS Spring 2012, Day 3

Thu, 12 Apr 2012 13:34:00 GMT

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Smallest 3-axis MEMS gyroscope: Teardown report released

Wed, 11 Apr 2012 20:40:00 GMT

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.

MEMS packaging growth, trends, and special requirements

Tue, 03 Apr 2012 16:32:00 GMT

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.”

Conference Report: MEMS Executive Congress Europe

Mon, 02 Apr 2012 17:36:00 GMT

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

Microfluidic surface coating agent improves droplet performance

Thu, 29 Mar 2012 17:42:00 GMT

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.

Field Report: Sensors in Design 2012

Thu, 29 Mar 2012 13:52:00 GMT

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

Bosch's Akustica enters analog MEMS sector with 2-chip offering

Wed, 28 Mar 2012 13:23:00 GMT

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

ACUTRONIC MEMS testers enable economical test at the fab

Mon, 19 Mar 2012 19:43:00 GMT

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.

AMEC debuts TSV etch tool with Chinese installations

Wed, 14 Mar 2012 19:48:00 GMT

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.

MEMS at heart of new iNEMI efforts, starting with test/reliability

Tue, 13 Mar 2012 20:36:00 GMT

iNEMI began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop on MEMS in May.