<?xml version="1.0" encoding="ISO-8859-1"?>
<?xml-stylesheet type="text/xsl" media="screen" href="/~d/styles/rss2full.xsl"?><?xml-stylesheet type="text/css" media="screen" href="http://feeds.feedburner.com/~d/styles/itemcontent.css"?><rss xmlns:dc="http://purl.org/dc/elements/1.1/" version="2.0">
  <channel>
    <title>MEMS</title>
    <link>http://www.electroiq.com</link>
    <description />
    <atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" type="application/rss+xml" href="http://feeds.feedburner.com/small-times/mems" /><feedburner:info xmlns:feedburner="http://rssnamespace.org/feedburner/ext/1.0" uri="small-times/mems" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com/" /><item>
      <title>Knowles tops 3B MEMS microphones shipped</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/knowles-tops-3b-mems-microphones-shipped.html</link>
      <description>&lt;p&gt;Knowles, micro acoustics and MEMS microphone maker, has shipped over 3 billion SiSonic MEMS microphones from the SiSonic MEMS microphone introduction in 2003.&lt;/p&gt;</description>
      <pubDate>Wed, 16 May 2012 19:28:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/knowles-tops-3b-mems-microphones-shipped.html</guid>
      <dc:date>2012-05-16T19:28:00Z</dc:date>
    </item>
    <item>
      <title>DRIE expands from MEMS to advanced packaging and more applications</title>
      <link>http://www.electroiq.com/articles/ap/2012/05/drie-expands-from-mems-to-advanced-packaging-and-more-applications.html</link>
      <description>&lt;p&gt;&#x201c;From 2011 to 2017, the number of DRIE-processed wafers will jump from 5.4M to more than 27M (all wafer sizes). This is &amp;gt;30% CAGR&#x201d;, explains Dr Eric Mounier, Yole Développement.&lt;/p&gt;</description>
      <pubDate>Tue, 15 May 2012 19:52:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/ap/2012/05/drie-expands-from-mems-to-advanced-packaging-and-more-applications.html</guid>
      <dc:date>2012-05-15T19:52:00Z</dc:date>
    </item>
    <item>
      <title>MEMS suppliers, equipment maker join MIG Hall of Fame</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/mems-suppliers-equipment-maker-join-mig-hall-of-fame.html</link>
      <description>&lt;p&gt;MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).&lt;/p&gt;</description>
      <pubDate>Mon, 14 May 2012 21:08:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/mems-suppliers-equipment-maker-join-mig-hall-of-fame.html</guid>
      <dc:date>2012-05-14T21:08:00Z</dc:date>
    </item>
    <item>
      <title>MEMS microphones shrink to grow market share</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/mems-microphones-shrink-to-grow-market-share.html</link>
      <description>&lt;p&gt;TechNavio predicts 22% CAGR for MEMS microphones from 2011 to 2015, mainly due to the shrinking form factor of these devices. MEMS microphones are gaining acceptance in a new field: healthcare electronics.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 14 May 2012 17:35:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/mems-microphones-shrink-to-grow-market-share.html</guid>
      <dc:date>2012-05-14T17:35:00Z</dc:date>
    </item>
    <item>
      <title>IDT eliminates crystals in high-performance MEMS oscillators</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/idt-eliminates-crystals-in-high-performance-mems-oscillators.html</link>
      <description>&lt;p&gt;Integrated Device Technology, Inc. (IDT), introduced a piezoelectric MEMS resonator technology that does not use crystals. IDT has branded the components CrystalFree pMEMS (piezoelectric MEMS).&lt;/p&gt;</description>
      <pubDate>Fri, 11 May 2012 19:59:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/idt-eliminates-crystals-in-high-performance-mems-oscillators.html</guid>
      <dc:date>2012-05-11T19:59:00Z</dc:date>
    </item>
    <item>
      <title>Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/sensory-swarms-and-mems-roadmaps-on-docket-at-meptec-mems-technology-symposium.html</link>
      <description>&lt;p&gt;MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover &#x201c;sensory swarms&#x201d; and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.&lt;/p&gt;</description>
      <pubDate>Thu, 10 May 2012 18:04:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/sensory-swarms-and-mems-roadmaps-on-docket-at-meptec-mems-technology-symposium.html</guid>
      <dc:date>2012-05-10T18:04:00Z</dc:date>
    </item>
    <item>
      <title>Stiction free removal of organic sacrificial layers in MEMS manufacturing</title>
      <link>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/features/mems-manufacturing/stiction-free-removal-of-organic.html</link>
      <description>&lt;p&gt;To resolve &amp;quot;stiction&amp;quot; yield failure issue in the manufacturing of MEMS devices, special release processes have been developed based on a combination of structural and sacrificial materials. Yin Xu, Vlad Tarasov, Wei Chen, And Koukou Suu, ULVAC Technologies, Inc., Methuen, MA&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Thu, 10 May 2012 05:00:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/print/vol-55/issue-4/features/mems-manufacturing/stiction-free-removal-of-organic.html</guid>
      <dc:date>2012-05-10T05:00:00Z</dc:date>
    </item>
    <item>
      <title>SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support</title>
      <link>http://www.electroiq.com/articles/sst/2012/04/semi-lauds-congressman-dave-camp-for-microelectronics-photovoltaics-support.html</link>
      <description>&lt;p&gt;SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.&lt;/p&gt;</description>
      <pubDate>Wed, 09 May 2012 18:36:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/2012/04/semi-lauds-congressman-dave-camp-for-microelectronics-photovoltaics-support.html</guid>
      <dc:date>2012-05-09T18:36:00Z</dc:date>
    </item>
    <item>
      <title>ST&#x2019;s MEMS revenues jump 82% in 2011, but TI holds onto #1 spot</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/st-mems-revenues-jump-82-ti-holds-1-spot.html</link>
      <description>&lt;p&gt;The top 3 MEMS manufacturers by revenue -- Texas Instruments, Hewlett Packard, and Bosch -- fought for market share in 2011, but #4, STMicroelectronics, experienced the biggest revenue jump year-to-year.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Wed, 09 May 2012 13:09:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/st-mems-revenues-jump-82-ti-holds-1-spot.html</guid>
      <dc:date>2012-05-09T13:09:00Z</dc:date>
    </item>
    <item>
      <title>SWS Inertial Sensor Development Platform evaluates MEMS behavior, performance</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/sws-inertial-sensor-development-platform-evaluates-mems-behavior-and-performance.html</link>
      <description>&lt;p&gt;Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.&lt;/p&gt;</description>
      <pubDate>Tue, 08 May 2012 21:22:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/sws-inertial-sensor-development-platform-evaluates-mems-behavior-and-performance.html</guid>
      <dc:date>2012-05-08T21:22:00Z</dc:date>
    </item>
    <item>
      <title>Baolab expands NEMS fab technology in pursuit of CMOS-integrated IMU</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/baolab-expands-nems-fab-technology-in-pursuit-of-cmos-integrated-imu.html</link>
      <description>&lt;p&gt;Baolab Microsystems will modify the structures of its 3D NanoCompass to build a range of other motion sensors, with the end-goal of low-cost, smart, reconfigurable inertial measurement units (IMUs).&lt;/p&gt;</description>
      <pubDate>Tue, 08 May 2012 18:03:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/baolab-expands-nems-fab-technology-in-pursuit-of-cmos-integrated-imu.html</guid>
      <dc:date>2012-05-08T18:03:00Z</dc:date>
    </item>
    <item>
      <title>memsstar appoints CEO with semiconductor and packaging experience</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/memsstar-appoints-ceo-with-semiconductor-and-packaging-experience.html</link>
      <description>&lt;p&gt;memsstar Limited, deposition and etch equipment supplier to the MEMS and semiconductor industries, named Mike Thompson as CEO.&lt;/p&gt;</description>
      <pubDate>Tue, 08 May 2012 14:36:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/memsstar-appoints-ceo-with-semiconductor-and-packaging-experience.html</guid>
      <dc:date>2012-05-08T14:36:00Z</dc:date>
    </item>
    <item>
      <title>NASA funds Phase II of MEMS-based exoplanet imaging improvement project</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/nasa-funds-phase-ii-of-mems-based-exoplanet-imaging-improvement-project.html</link>
      <description>&lt;p&gt;Boston Micromachines Corporation won a Phase II contract for $750,000 from NASA's SBIR to support its Exoplanet Exploration program. Phase II covers reliability in the harsh environment of space.&lt;br&gt;
&lt;/p&gt;</description>
      <pubDate>Mon, 07 May 2012 19:50:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/nasa-funds-phase-ii-of-mems-based-exoplanet-imaging-improvement-project.html</guid>
      <dc:date>2012-05-07T19:50:00Z</dc:date>
    </item>
    <item>
      <title>MEMS formed with laser, diamond combo</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/combining-lasers-and-diamonds-to-cut-hard-brittle-materials.html</link>
      <description>&lt;p&gt;Western Michigan University developed a device combining a laser and diamond cutting system, enabling users to process hard, brittle materials that are difficult to machine. Initial applications include MEMS manufacturing, and other fabrication on semiconductor materials.&lt;/p&gt;</description>
      <pubDate>Mon, 07 May 2012 18:59:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/combining-lasers-and-diamonds-to-cut-hard-brittle-materials.html</guid>
      <dc:date>2012-05-07T18:59:00Z</dc:date>
    </item>
    <item>
      <title>Hanking builds MEMS fab in China</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/hanking-builds-mems-fab-in-china.html</link>
      <description>&lt;p&gt;Hanking Industrial Group Co., Ltd., broke ground on a micro electro mechanical system (MEMS) manufacturing campus in Fushun City, China, outside of Shenyang.&lt;/p&gt;</description>
      <pubDate>Fri, 04 May 2012 20:06:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/hanking-builds-mems-fab-in-china.html</guid>
      <dc:date>2012-05-04T20:06:00Z</dc:date>
    </item>
    <item>
      <title>Micropelt raises EUR6.5M for wafer-based energy harvesting technology</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/micropelt-raises-eur6m-for-energy-harvesting-technology.html</link>
      <description>&lt;p&gt;Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.&lt;/p&gt;</description>
      <pubDate>Thu, 03 May 2012 21:28:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/micropelt-raises-eur6m-for-energy-harvesting-technology.html</guid>
      <dc:date>2012-05-03T21:28:00Z</dc:date>
    </item>
    <item>
      <title>Dolomite, LioniX partner on microfluidics design, manufacturing, more</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/dolomite-lionix-partner-on-microfluidics.html</link>
      <description>&lt;p&gt;Dolomite and LioniX BV formed a partnership covering the design, development, fabrication, and distribution of microfluidic devices and systems.&lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 21:17:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/dolomite-lionix-partner-on-microfluidics.html</guid>
      <dc:date>2012-05-02T21:17:00Z</dc:date>
    </item>
    <item>
      <title>ST brings MEMS microphones to distant-speech research project</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/st-brings-mems-microphones-to-distant-speech-research-project.html</link>
      <description>&lt;p&gt;STMicroelectronics will bring its MEMS microphone and audio processing expertise to the European research project, Distant Speech Interaction for Robust Home Applications (DIRHA).&lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 19:30:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/st-brings-mems-microphones-to-distant-speech-research-project.html</guid>
      <dc:date>2012-05-02T19:30:00Z</dc:date>
    </item>
    <item>
      <title>Audio Precision uncrates PDM interface for MEMS microphone test</title>
      <link>http://www.electroiq.com/articles/stm/2012/05/audio-precision-uncrates-pdm-interface-for-mems-microphone-test.html</link>
      <description>&lt;p&gt;Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.&lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 18:47:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/stm/2012/05/audio-precision-uncrates-pdm-interface-for-mems-microphone-test.html</guid>
      <dc:date>2012-05-02T18:47:00Z</dc:date>
    </item>
    <item>
      <title>Top 50 &#x201c;internet of things&#x201d; applications</title>
      <link>http://www.electroiq.com/articles/sst/2012/05/top-50-internet-of-things-applications.html</link>
      <description>&lt;p&gt;Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and &#x201c;internet of things&#x201d; applications. &lt;/p&gt;</description>
      <pubDate>Wed, 02 May 2012 14:10:00 GMT</pubDate>
      <guid>http://www.electroiq.com/articles/sst/2012/05/top-50-internet-of-things-applications.html</guid>
      <dc:date>2012-05-02T14:10:00Z</dc:date>
    </item>
  </channel>
</rss>

