Device Architecture

Microsoft joins Hybrid Memory Cube Consortium

Wed, 16 May 2012 20:33:00 GMT

The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.

SMIC expands Beijing fab for smaller-node semiconductor manufacturing

Tue, 15 May 2012 21:16:00 GMT

Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.

DRAM partially recovers thanks to Elpida bankruptcy

Tue, 15 May 2012 19:01:00 GMT

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.

Infineon CEO Bauer resigns for health considerations

Tue, 15 May 2012 16:23:00 GMT

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.

GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy

Mon, 14 May 2012 15:32:00 GMT

The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts.

CMOS image sensor suppliers ramp up 300mm capacity

Fri, 11 May 2012 17:53:00 GMT

CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.

Intel (INTC) plans high capex and fast node shrinks, expects chipmaker consolidation

Fri, 11 May 2012 16:48:00 GMT

At Intel’s annual investor day, the chipmaker reported that capital spending will be high in 2012 and 2013, noting that its 22nm and 14nm node capabilities are differentiators. Intel focused on its Ultrabook launches, consolidation in the chip industry, and reiterated that capex is for internal use not foundry services.

Micron confirms Elpida takeover discussions

Fri, 11 May 2012 15:46:00 GMT

Memory chip maker Micron Technology Inc. (Nasdaq:MU) confirmed that it is engaged in discussions to take over the assets of bankrupt DRAM maker Elpida Memory Inc.

SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

Wed, 09 May 2012 18:36:00 GMT

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.

President Obama speaks at Albany Nano-Tech Complex today

Tue, 08 May 2012 15:11:00 GMT

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.

III-V Lab shares silicon and compound semiconductor work 1 year in

Mon, 07 May 2012 21:20:00 GMT

III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA-Leti, provides an update one year into its 4 main research area projects. III-V lab combines compound semiconductor and silicon semiconductor technologies for applications in telecom, industrial control, environmental testing, defense, security, and space.

Micron expected to win Elpida assets in DRAM maker's bankruptcy negotiations

Mon, 07 May 2012 16:33:00 GMT

Elpida informally chose Micron to sponsor its restructuring, report severals sources. Micron reportedly will pay about USD1 billion more than it originally offered, investing another $1.25 billion to upgrade 2 fabs in Japan.

Texas Instruments (TI, TXN) shares strategy at Analyst Day

Fri, 04 May 2012 22:04:00 GMT

Texas Instruments Inc. (NASDAQ:TXN, TI) hosted an Analyst Day this week to discuss and review key strategies and progress achieved over the past 15 years. Barclays Capital “heard few surprises” at TI's Analyst Day; its analysts maintain their view that TI is a “high-quality analog company” that raises some concerns that it is not able to benefit from its scale advantages, with a growth trajectory of only GDP-plus (i.e. in line with overall semiconductors). FBR Capital Markets analysts agree that “little new surfaced.”

Organic complementary logic aim of 2 European research projects

Fri, 04 May 2012 17:53:00 GMT

The Heterogeneous Technology Alliance in Europe is focusing on high-performance organic electronic circuits through 2 projects: COSMIC to develop p- and n-type OTFTs for complementary logic, and POLARIC for shrinking critical dimensions of OTFTs.

Top 10 innovative technology firms in Q1

Fri, 04 May 2012 15:26:00 GMT

Lux Research profiled 328 companies across 15 different emerging technology domains in Q1 2012. Of these, Lux Research selected its top 10, including a gallium-nitride (GaN) power device maker, printed electronics supplier, and others.

Semiconductor sales grew incrementally in March 2012

Wed, 02 May 2012 16:38:00 GMT

Global semiconductor sales hit $23.3 billion in March 2012, up 1.5% from February 2012 and down 7.9% from March 2011, reports the Semiconductor Industry Association (SIA).

RFMD intros GaN process for high-voltage power semiconductor devices

Wed, 02 May 2012 14:41:00 GMT

RF Micro Devices Inc. (Nasdaq GS:RFMD) expanded its gallium nitride (GaN) portfolio with rGaN-HV, optimized for high-voltage power devices in power conversion applications.

Global Semiconductor Alliance appoints first China-based director

Tue, 01 May 2012 19:09:00 GMT

The Global Semiconductor Alliance (GSA) appointed Dr. Leo Li, chairman, CEO and president of Spreadtrum Communications Inc., to its Board of Directors. Li is GSA’s first China-based executive to join the Board.

NASA funds GaN-on-Si power amplifier development at Nitronex

Tue, 01 May 2012 11:30:00 GMT

Nitronex was awarded a NASA Phase I SBIR to develop a highly efficient 20W X-band GaN power amplifier MMICs, for use in long range RF telecommunications. The company will deploy its GaN-on-Si technology.

Intel 22nm trigate transistor process chosen for next-gen Netronome flow processors

Tue, 01 May 2012 05:00:00 GMT

Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel's 22nm tri-gate transistor architecture.