EDI CON USA

EDI CON USA 2018 Announces Outstanding Paper Winners

Thu, 15 Nov 2018 17:14:00 -0500

EDI CON USA 2018 took place in Santa Clara Convention Center on October 17 and 18, and as part of its technical program, EDI CON USA presents its Outstanding Paper Awards.

All Silicon Active Antennas for High Performance mmWave Systems

Mon, 12 Nov 2018 10:32:00 -0500

Active antennas, or phased arrays, have been widely used for many years. The first phased array applications were mainly military with systems deployed as early as the mid-1970s. Recent industry trends have shown a rapid increase in the use of this technology for both radar and communication systems, along with a push into the mmWave spectrum. This paper will explain the market changes behind these trends and the implications for the future.

RF Front-end Technology and Tradeoffs for 5G mmWave Fixed Wireless Access

Sun, 11 Nov 2018 09:10:00 -0500

In this technical paper, we analyze the architecture, semiconductor technology, and RF front-end (RFFE) design needed to deliver mmWave FWA services. Discussing topics such as: Scan-angle requirements, Tradeoffs of Hybrid-beamforming versus All-Digital Beamforming for the Base Transceiver Station (BTS),Analyze BTS semiconductor technology and RF front-end components, and Gallium-Nitride on Silicon Carbide (GaN-on-SiC) front-end modules (FEMs) designed specifically for the 5G FWA

Bits to Beams – RF Technology Evolution for 5G mmwave Radios

Fri, 09 Nov 2018 14:53:00 -0500

This article is organized into 3 major topics. In the first section, we will discuss some of the leading use cases for mmwave communications and set the stage for the analysis that follows. In the second and third sections we will delve into the architectures and technology for the mmwave basestation systems. In section 2 we will discuss technology for the beamformers and how the required transmit power influences the choice of technology for the system front-end. While the beamformer gets much of the spotlight in the press, there is equally important section of the radio that performs the conversion from bits to mmwave frequency. We will present an example signal chain for this section of the system and suggest some leading-edge components from Analog Devices for radio designer’s consideration.

SemiGen Featuring Expanded Capabilities at EDI CON USA 2018 After Ion Beam Milling Acquisition

Tue, 16 Oct 2018 19:24:00 -0400

SemiGen Inc. has announced that after recently acquiring Ion Beam Milling of Manchester, N.H., they are now offering a full suite of thin film circuits and products along with specialized foundry services to augment their microwave assembly and component solutions offered to microwave RF/manufacturers.

Outstanding Papers Take the Stage at EDI CON USA 2018

Wed, 10 Oct 2018 09:50:00 -0400

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators in Santa Clara Convention Center on October 17 and 18, announces the finalists in the Outstanding Paper Awards competition for 2018.

NI AWR Software Featured at EDI CON USA 2018

Tue, 02 Oct 2018 15:18:56 -0400

NI AWR software will be on display in Booth #212 at the 2018 Electronic Design Innovation Conference & Exhibition (EDI CON) USA, taking place October 17-18 in Santa Clara, Calif.

StratEdge to Display GaN, GaAs Packages at IMAPS, BCICTS and EDI CON USA

Mon, 01 Oct 2018 14:53:00 -0400

StratEdge Corp. will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS and EDI CON USA.

Rogers to Highlight Circuit Materials at EDI CON USA 2018

Mon, 24 Sep 2018 10:58:00 -0400

Rogers Corp. will share its experience and expertise on circuit materials technologies at the 2018 Electronic Design Innovation Conference (EDI CON) USA October 17-18, in Santa Clara, Calif.

EDI CON USA Comes to California!

Tue, 11 Sep 2018 16:51:00 -0400

Two full days of technical programming, the EDI CON University, panels, exhibition, networking and show floor presentations covering RF, microwave, signal integrity, power integrity and EMC/EMI await this year’s attendees in sunny Santa Clara, California.

LPKF to Demo Rapid Prototyping of PCBs at EDI CON USA 2018

Tue, 21 Aug 2018 11:14:00 -0400

LPKF Laser & Electronics has announced it will be demonstrating its in-house rapid PCB prototyping equipment at the EDI CON USA 2018 exhibition, which takes place October 17-18 at the Santa Clara Convention Center in Santa Clara, Calif.

Ransom Stephens, Ovi Jacob Headline EDI CON USA 2018 Plenary Keynotes

Mon, 13 Aug 2018 11:10:00 -0400

EDI CON USA announces its plenary keynote speakers—Ovi Jacob and Ransom Stephens—for the 2018 conference, which will be held in Santa Clara, Calif. October 17 and 18.

EDI CON USA Keynote Talks - Bet Your Job, 5G in 5 Years and T&M Value

Sat, 30 Sep 2017 16:19:00 -0400

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.

Speakers Take Top Prizes at EDI CON USA Outstanding Paper Awards 2017

Thu, 21 Sep 2017 11:58:00 -0400

EDI CON USA recognizes finalists and winners in the 2017 Outstanding Paper Awards.

EDI CON USA 2017 Celebrates High Frequency and High Speed

Wed, 20 Sep 2017 13:00:00 -0400

Offering a unique combination of training, technical sessions, workshops, panels and a commercial exhibition, EDI CON USA returned to Boston for its second year in the U.S.

MicroFlex Circuits, Electroformed Components by Metrigraphics at EDI CON USA

Tue, 12 Sep 2017 15:51:06 -0400

Metrigraphics will be exhibiting at EDI CON USA 2017 in Boston, on September 12 through 13.

Microwave Transceivers, High-Power mmWave Circulators by Smiths Interconnect at EDI CON USA

Tue, 12 Sep 2017 15:40:33 -0400

Smiths Interconnect will exhibit its largest range of components, assemblies and systems from 18 to 325 GHz, in Booth #423 at the EDI CON USA in Boston, and of their many new devices they’ll be featuring Ku-Band High-Power Transceivers (HPTs) and 18 to 110 GHz Circulators.

Laser Services to Discuss Advanced Ceramic Substrate Processing Techniques at EDI CON 2017

Tue, 12 Sep 2017 15:17:06 -0400

Laser Services is excited to be exhibiting in Boston at the 2017 EDI-CON conference September 12–13 in Booth #408.

Strand Announces Their Attendance at EDI CON USA 2017 in Boston

Tue, 12 Sep 2017 15:00:01 -0400

Strand Marketing is pleased to announce that they will be attending EDI CON USA 2017, a tradeshow put on by Horizon House and Microwave Journal that brings together RF, microwave, EMC/EMI and high-speed digital design engineers and system integrators for networking, training and learning opportunities.

First Showing of R&S 5 GHz Signal Analysis Bandwidth at EDI CON USA

Mon, 11 Sep 2017 00:00:00 -0400

Rohde & Schwarz is addressing the demands for characterizing wideband components and systems with the R&S FSW-B5000 option, which will be demonstrated for the first time to at EDI CON USA in Boston.

Custom MMIC to Speak at EDI CON USA 2017 on Phase Noise Reduction Techniques

Fri, 08 Sep 2017 15:43:00 -0400

Custom MMIC has announced that President and CTO, Paul Blount, will be delivering a presentation at the Electronic Design Innovation Conference and Exhibition (EDI CON) 2017 in Boston, titled “Conquering Phase Noise in Radar and Communication Systems.”

NI AWR Design Environment Featured in Booth Demos, Amplifier Design Workshop at EDI CON USA 2017

Thu, 07 Sep 2017 11:35:00 -0400

NI AWR Design Environment V13 will be featured in a variety of activities at EDI CON USA 2017, being held September 11-13 in Boston.

Rogers Corp. Brings Circuit Materials, Material Design Insights to EDI CON USA 2017

Thu, 07 Sep 2017 10:04:53 -0400

Rogers Corporation will be participating at EDI CON USA 2017 September 12-13, as part of a well-rounded technical program and exhibition.

EDI CON USA Announces Finalists in Outstanding Paper Awards

Wed, 06 Sep 2017 13:14:00 -0400

EDI CON USA announced the finalists in its Outstanding Paper Awards for 2017. Papers will be presented at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, Mass.

EDI CON USA Returns to Boston in 2 Weeks with Powerful Education and Keynotes

Tue, 29 Aug 2017 13:39:00 -0400

To add to its high-quality line-up of education, EDI CON USA announced its plenary keynote speakers, Scott McMorrow, Dr. Thomas Cameron and Faride Akretch, for the conference and EXPO on September 11-13 at the Hynes Convention Center in Boston, Mass.

Indium Corporation Expert Presents at EDI CON USA

Tue, 15 Aug 2017 11:59:00 -0400

Indium Corporation’s Brook Sandy-Smith, technical support engineer for PCB Assembly Materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017, September 11-13 in Boston, Mass.

EDI CON USA Adds IBIS Summit to Its Premier Program Line-Up

Wed, 09 Aug 2017 15:08:00 -0400

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, Mass.

EDI CON USA 2017 Launches Scholarship Program

Wed, 02 Aug 2017 09:10:00 -0400

EDI CON USA 2017 announces a new scholarship program for university students, where any student that attends can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of major sponsors on September 12-13.

EDI CON USA 2017 Launches Scholarship Program

Wed, 02 Aug 2017 00:00:00 -0400

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics. Any student that attends EDI CON USA 2017 can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of three major sponsors in the exhibition Sept 12-13.

Analog Devices Signs On as Host Sponsor of EDI CON USA 2017

Mon, 31 Jul 2017 15:40:00 -0400

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that Analog Devices, Inc. (ADI) is taking on the role of host sponsor of the exhibition and conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.