SI - New Devices

Micron Technology 32G 34nm NAND Flash

info@semiconductor.com(Semiconductor Insights) — Tue, 13 Jan 2009 00:00:00 -0600

This device has the highest density (32Gbit) monolithic MLC NAND Flash that the NAND Flash industry has seen to date

Download an Insight Report from our website.

Samsung 16G 42nm NAND MLC Device

info@semiconductor.com(Semiconductor Insights) — Mon, 12 Jan 2009 00:00:00 -0600

This latest 42nm process node product features 16Gbit of non-volatile memory storage with 114mm2 of chip size. Compared to the Samsung’s previous generation 51nm 16Gbit MLC NAND Flash product (K9GAG08U0M), this new device is 30% smaller in chip size

Download an Insight Report from our website.

Micron Technology 1G 50nm DDR2 U68A

info@semiconductor.com(Semiconductor Insights) — Mon, 12 Jan 2009 00:00:00 -0600

The device has 1Gbit of memory and an impressive die area efficiency of 24.8Mbits per mm2. With a chip size of 41mm2, Micron’s 50nm 1Gbit DDR2 showcases an even smaller die area in comparison to Samsung’s 58nm (44mm2) and Hynix’s 54nm (45mm2).

Download an Insight Report from our website.

Samsung 1G DDR2 SDRAM

info@semiconductor.com(Semiconductor Insights) — Thu, 04 Dec 2008 00:00:00 -0600

This is the latest 1Gbit DDR2 SDRAM from the manufacturer using the 58nm DRAM process technology.

Download an Insight Report from our website.

Hynix 1G DDR2 DRAM

info@semiconductor.com(Semiconductor Insights) — Thu, 04 Dec 2008 00:00:00 -0600

This is the latest 1Gbit DDR2 SDRAM from the manufacturer using the 54nm DRAM process technology.

Download an Insight Report from our website.

Qualcomm Snapdragon Mobile Processor

info@semiconductor.com(Semiconductor Insights) — Thu, 09 Oct 2008 00:00:00 -0600

The Qualcomm Snapdragon allows the mobile device vendors to escalate the latest handset market trend to enable laptop experience on handsets. It leads the industry in functionality, performance, power efficiency and footprint.

Download an Insight Report from our website.

Toshiba 16G 43nm MLC NAND Flash

info@semiconductor.com(Semiconductor Insights) — Mon, 06 Oct 2008 00:00:00 -0600

The new architecture, ABL (All BitLine architecture), achieves higher program and read throughput by activating both even & odd bitline simultaneously. Reduced supply voltage for the I/O buffer helps integrating this product with chips in a system

Download an Insight Report from our website.

Broadcom IEEE 802.11a/b/g MAC/BASEBAND/RADIO w/ Bluetooth 2.1 + EDR AND FM Receiver

info@semiconductor.com(Semiconductor Insights) — Tue, 30 Sep 2008 00:00:00 -0600

As evidenced in the Apple iPod Touch 2nd generation design win, BCM4325 provides all the connectivity functions today’s mobile products to enhance user experience. To receive an annotated Image of the iPhone 3G PCB, email simonel@semiconductor.com.

Download an Insight Report from our website.

Hynix 1G DDR3 Synchronus DRAM

info@semiconductor.com(Semiconductor Insights) — Tue, 05 Aug 2008 00:00:00 -0600

The smaller process node offers substantial benefits, lower power consumption, heat dissipation and cost to manufacture. The die size is only 7% larger, helping DDR3 DRAM reach a competitive price point to become mainstream in the marketplace

Download an Insight Report from our website.

Intel SILVERTHORNE Intel Atom Processor

info@semiconductor.com(Semiconductor Insights) — Wed, 23 Jul 2008 00:00:00 -0600

The 45nm Intel® Atom™ processors pack an astounding 47 million transistors on a single chip measuring less than 26mm², making them Intel's smallest and lowest power processors. All this while delivering the power and performance you need

Download an Insight Report from our website.

STMicroelectronics Low Power 3-axis Accelerometer

info@semiconductor.com(Semiconductor Insights) — Wed, 23 Jul 2008 00:00:00 -0600

The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface.

Download an Insight Report from our website.

Qualcomm Applications Processor

info@semiconductor.com(Semiconductor Insights) — Mon, 16 Jun 2008 00:00:00 -0600

Qualcomm MSM7201A's new capabilities include; an integrated ARM11-based application processor, high-speed HSDPA/HSUPA wireless connectivity, blazing fast WVGA video performance and stunning 2D & 3D graphics acceleration

Download an Insight Report from our website.

Texas Instruments OMAP3530 Baseband Applications Processor

info@semiconductor.com(Semiconductor Insights) — Mon, 16 Jun 2008 00:00:00 -0600

The heart of this new device is the ARM Cortex along with the other major subsystems. Die utilization has improved dramatically allowing TI to substantially increase performance, while achieving a 30% die area reduction compared to the 90nm OMAP2420

Download an Insight Report from our website.

Apple (Samsung S5L8900) applications processor with eDRAM

info@semiconductor.com(Semiconductor Insights) — Fri, 16 May 2008 00:00:00 -0600

The Samsung S5L8900 is an applications processor found in the Apple iPhone. It was found with in an Apple marked package. It contains embedded DRAM and an innovative package on package design.

Download an Insight Report from our website.

Spansion 2G 65nm MirrorBit ORNAND

info@semiconductor.com(Semiconductor Insights) — Mon, 21 Apr 2008 00:00:00 -0600

The Spansion 65nm 2Gb MirrorBit ORNAND is an important step for the organization. It continues their commitment to deliver a process lithography shrink every year for the past 3 years.

Download an Insight Report from our website.

Hynix 8G MLC NAND Flash (57nm process node TECHNOLOGY))

info@semiconductor.com(Semiconductor Insights) — Thu, 27 Mar 2008 00:00:00 -0600

Hynix’s 57nm 8Gb MLC NAND Flash has an extra interconnect layer increasing the mask count number. They have also implemented a new die floor plan, with a one-sided pad arrangement and a one-sided buffer arrangement to help reduce the die area used.

Download an Insight Report from our website.

Sony Computer Entertainment Inc. CELL BROADBAND ENGINE ™ Cell Broadband Engine

info@semiconductor.com(Semiconductor Insights) — Mon, 10 Mar 2008 00:00:00 -0600

The Sony PlayStation 3 is one of the three recent gaming systems available in the market. The PS3 has leverage the high level of technical capabilities that the system offers. The Cell Processor largely drives these capabilities.

Download an Insight Report from our website.

Samsung 1G 68nm DDR2 SDRAM

info@semiconductor.com(Semiconductor Insights) — Fri, 07 Mar 2008 00:00:00 -0600

The 68nm device from Samsung is the smallest process lithography DRAM from Samsung analyzed by Semiconductor Insights to date with a 13.7Mb/mm2 rating.

Download an Insight Report from our website.

Micron Technology 16G MLC NAND Flash

info@semiconductor.com(Semiconductor Insights) — Wed, 06 Feb 2008 00:00:00 -0600

While it has been over a year since the previous 4Gb SLC NAND Flash from IM Flash Technologies entered the market, the company maintains the smallest process lithography at this time, measuring only 50nm.

Download an Insight Report from our website.

Hynix 1G DDR2 SDRAM

info@semiconductor.com(Semiconductor Insights) — Wed, 30 Jan 2008 00:00:00 -0600

The 66nm device from Hynix is the smallest DRAM process component analyzed by SI to date. Smaller process geometries help to reduce power consumption in the chip enabling less heat produced, lower cooling costs, and quieter system operation.

Download an Insight Report from our website.

Spansion 2G MirrorBit Quad Flash

info@semiconductor.com(Semiconductor Insights) — Tue, 29 Jan 2008 00:00:00 -0600

The first NOR flash from Spansion to use MirrorBit Quad technology – an architecture that stores four-bits-per-cell. MirrorBit Quad doubles the density of MirrorBit with the added ability to store different charge states in each of the two locations.

Download an Insight Report from our website.

Qualcomm MSM7200 Chipset solution for WCDMA (UMTS)/HSUPA and GSM/GPRS/EDGE

info@semiconductor.com(Semiconductor Insights) — Wed, 14 Nov 2007 00:00:00 -0600

The Qualcomm MSM7200 is designed for wireless mobile applications, such as cell phones, providing all of the features that these systems require from connectivity, camera support, GPS, and multimedia playback.

Download an Insight Report from our website.

Intel Penryn 45nm Processor

info@semiconductor.com(Semiconductor Insights) — Wed, 07 Nov 2007 00:00:00 -0600

Intel’s 45nm Penryn processor is an engineering milestone, with a small process lithography and high K gate dielectrics. Intel claims this can deliver >20% increase in transistor switching speed and reduce transistor gate leakage by over 10X.

Download an Insight Report from our website.

Panasonic 45nm UniPhier system LSI

info@semiconductor.com(Semiconductor Insights) — Fri, 02 Nov 2007 00:00:00 -0600

To achieve a 45nm process node Matsushita has used 193nm immersion lithography, stress-induced mobility-enhanced transistors, low-k dielectrics and design-for-manufacturability technologies.

Download an Insight Report from our website.

Marvell Semiconductor 802.11 a/b/g RF IC Transceiver

info@semiconductor.com(Semiconductor Insights) — Tue, 23 Oct 2007 00:00:00 -0600

The Marvell 88W8686, found in the Apple iPhone, integrates an ARM-compliant CPU, high-speed serial host interfaces including SDIO and SPI, and advanced 802.11 a/b/g RF transceiver with full cellular coexistence.

Download an Insight Report from our website.

Hynix 8G 60nm NAND Flash

info@semiconductor.com(Semiconductor Insights) — Fri, 19 Oct 2007 10:47:19 -0600

The latest NAND Flash product offered by Hynix is in their 60nm process technology. The HY27UT088G2M is 8Gb MLC NAND Flash.

Download an Insight Report from our website.

Maxlinear MXL5005 Terrestrial Tuner